Shared counterparties of the synthetic demo book, as of 2026-06-30

Relationship mentions, completeness untested.

Unranked: holdings in the book with a counted link, most first; ties A-Z by display name.

Book weight, not a loss or exposure estimate.

The synthetic demo book (a development fixture, not a person's book), line by line

Line	As entered	Label
1	NVDA 22	covered
2	TSM 18	covered
3	AVGO 14	covered
4	AMD 12	covered
5	QCOM 10	covered
6	ASML 10	covered
7	AMKR 8	covered
8	MU 6	covered

Shared counterparties (18)

Taiwan Semiconductor Manufacturing Company Limited 5 holdings

Families: foundry; assembly and test; named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 21; assembly and test 1; named customer or supplier 13; foundry 13.

Advanced Micro Devices, Inc. (AMD): 2 line(s)

Advanced Micro Devices, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

We rely on Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of all wafers for microprocessor and GPU products at 7 nanometer (nm) or smaller nodes, and we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1A. RISK FACTORS; characters 127713 to 128034; re-found.

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An appreciation of the U.S. dollar relative to the local currency could reduce sales of our products. Operational and Technology Risks We rely on third parties to manufacture our products, and if they are unable to do so on a timely basis in sufficient quantities and using competitive technologies, our business could be materially adversely affected. We utilize third-party wafer foundries to fabricate the silicon wafers for all of our products. We rely on Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of all wafers for microprocessor and GPU products at 7 nanometer (nm) or smaller nodes, and we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm. We also utilize TSMC, United Microelectronics Corporation (UMC) and Samsung Electronics Co., Ltd. for our integrated circuits (IC) in the form of programmable logic devices. We also rely on third-party manufacturers to assemble, test, mark and pack (ATMP) our products. Our third-party package assembly partners are responsible for packaging technology used to fabricate our products.

Taiwan Semiconductor Manufacturing Company Limited names Advanced Micro Devices, Inc. as its end customer; State current since 2026-02-04 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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We also offer design, mask making, TSMC 3DFabric ® advanced silicon stacking and packaging technologies, and testing services. We produced 34% of the “Foundry 2.0” industry, which we define as all logic wafer manufacturing, packaging, testing, mask-making and others, an increase from 28% in 2023. We believe that our scale and capacity, particularly for advanced technologies, is a major competitive advantage. Please see “– Semiconductor Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs, nine 300mm wafer fabs, and five advanced backend fabs.

ASML Holding N.V. (ASML): 1 line(s)

ASML Holding N.V. names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

In November 2025, we were honored to receive the TSMC Supplier ‘Excellence in Green Manufacturing’ Award

From ASML HOLDING NV's 20-F filed 2026-02-25, accession 000162828026011378, period December 31, 2025, under Item 6 Any; characters 677109 to 677213; re-found.

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Together, these two elements provide a new solution for hydrogen reuse, for which we have provided design and safety assessment assistance. 80% of the hydrogen used is due to be recovered, and 50% of the power associated with that hydrogen use saved. This integrated solution has bee n tested and is now being gradually introduced to the installed base of our customers . In November 2025, we were honored to receive the TSMC Supplier ‘Excellence in Green Manufacturing’ Award, for this and other product energy- efficiency innovations. STRATEGIC REPORT CORPORATE GOVERNANCE SUSTAINABILITY FINANCIALS ASML Annual Report 2025 175 General disclosures Environmental Social Governance Energy efficiency and climate action: Product use (continued) Looking ahead We will continue to work on the energy efficiency of our systems and other product families.

Broadcom Inc. (AVGO): 2 line(s)

Broadcom Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry and assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1A. RISK FACTORS; characters 114481 to 114584; re-found.

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We do not generally have long-term capacity commitments with our CMs and substantially all of our manufacturing services are on a purchase order basis with no minimum quantities. Further, our CMs may fail to timely develop or successfully implement new, advanced manufacturing processes, including transitions to smaller geometry process technologies. From time to time, our CMs may also cease to, or become unable to, manufacture a component for us, and have had capacity constraints in times of unprecedented demand. During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC. We believe our wafer requirements represent a meaningful portion of TSMC’s total production capacity. However, TSMC also fabricates wafers for other companies, including some of our competitors, and could choose or be required to materially prioritize capacity for other customers or reduce or eliminate deliveries to us on short notice.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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Manufacturing We focus on maintaining an efficient global supply chain and a variable, low-cost operating model. Accordingly, we outsource a majority of our manufacturing operations, utilizing third-party foundry and assembly and test capabilities, as well as some of our corporate infrastructure functions. The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”). We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd. We use our internal fabrication facilities for products utilizing our innovative and proprietary processes, such as our FBAR filters for wireless communications and our vertical-cavity surface emitting laser and side emitting lasers based on gallium arsenide (“GaAs”) and indium phosphide (“InP”) lasers for fiber optic communications, while outsourcing commodity processes such as standard CMOS.

Taiwan Semiconductor Manufacturing Company Limited names Broadcom Inc. as its end customer; State current since 2025-12-18 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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NVIDIA Corporation (NVDA): 2 line(s)

NVIDIA Corporation names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57819 to 57993; re-found.

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In periods of growth, we may place non-cancellable inventory orders for certain product components in advance of our historical lead times, pay premiums, or provide deposits to secure future supply and capacity and may need to continue to do so. We have expanded our supplier relationships to build redundancy and resilience in our operations to provide long-term manufacturing capacity aligned with growing customer demand. While currently our supply chain is mainly concentrated in Asia, we are expanding into the U.S. and Latin America. We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers. We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung. We utilize CoWoS technology for semiconductor packaging. We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.

Taiwan Semiconductor Manufacturing Company Limited names NVIDIA Corporation as its end customer; State current since 2026-02-25 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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QUALCOMM INC (QCOM): 2 line(s)

QUALCOMM INC names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 57997 to 58203; re-found.

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We employ both turnkey and two-stage manufacturing models to purchase our integrated circuits. Under the turnkey model, our foundry suppliers are responsible for delivering fully assembled and tested integrated circuits. Under the two-stage manufacturing model, we purchase die in singular or wafer form from semiconductor manufacturing foundries and contract with separate third parties for manufacturing services such as wafer bump, probe, assembly and the majority of our final test requirements. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries. Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region.

Taiwan Semiconductor Manufacturing Company Limited names QUALCOMM INC as its end customer; State current since 2025-11-05 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Hewlett Packard Enterprise Company 3 holdings

Families: named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 7; named customer or supplier 6; licence (licensor or licensee) 1.

Advanced Micro Devices, Inc. (AMD): 1 line(s)

Hewlett Packard Enterprise Company names Advanced Micro Devices, Inc. as its supplier; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

Sourcing in the filing's own words: single-source.

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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Our inventory management and distribution practices in both building products to order and configuring products to order seek to minimize inventory holding periods by taking delivery of the inventory and manufacturing shortly before the sale or distribution of products to our customers. We purchase materials, supplies, and product subassemblies from a substantial number of vendors. For most of our products, we have existing alternate sources of supply or such alternate sources of supply are readily available. However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors. Like other participants in the IT industry, we ordinarily acquire materials and components through a combination of blanket and scheduled purchase orders to support our demand requirements for periods averaging 90 to 120 days.

Broadcom Inc. (AVGO): 1 line(s)

Hewlett Packard Enterprise Company names Broadcom Inc. as its supplier; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

Sourcing in the filing's own words: single-source.

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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NVIDIA Corporation (NVDA): 1 line(s)

Hewlett Packard Enterprise Company names NVIDIA Corporation as its supplier; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

Sourcing in the filing's own words: single-source.

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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Nokia Corporation 3 holdings

Families: named customer or supplier; licence (licensor or licensee), licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 12; named customer or supplier 8; licence (licensor or licensee) 4.

Broadcom Inc. (AVGO): 1 line(s)

Nokia Corporation names Broadcom Inc. as its supplier; State current since 2026-03-05 (this filer's naming: current); last named 2026-03-05.

We expanded our data center switching offer with our new 7220 IXR H6 switching platform, powered by Broadcom's Tomahawk 6 chipset.

From Nokia Corporation's 20-F filed 2026-03-05, accession 000162828026015034, period 2025-12-31, under ITEM 19 EXHIBITS; characters 171798 to 171928; re-found.

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At the event Nokia announced a new strategy, as well as a simplified operating model, a new long-term financial target, new strategic KPIs and changes to its Group Leadership Team. Expansion with AI & Cloud 2025 We saw real progress in AI & Cloud . We closed and integrated Infinera. We launched new 800G pluggables, delivering excellent optical performance for data centers in a compact, low-power form factor. We expanded our data center switching offer with our new 7220 IXR H6 switching platform, powered by Broadcom's Tomahawk 6 chipset. And we generated EUR 2.4 billion in orders from AI & Cloud customers across the year.

NVIDIA Corporation (NVDA): 1 line(s)

Nokia Corporation names NVIDIA Corporation as its supplier; State current since 2026-03-05 (this filer's naming: current); last named 2026-03-05.

As the first supplier to introduce commercial- grade AI-RAN products for 5G-Advanced and 6G networks, we leverage the NVIDIA ARC-Pro accelerated computing platform to evolve our Cloud RAN into a Cloud AI-RAN solution, and in our AirScale RAN solutions.

From Nokia Corporation's 20-F filed 2026-03-05, accession 000162828026015034, period 2025-12-31, under ITEM 19 EXHIBITS; characters 191919 to 192171; re-found.

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Analyst firms like Dell’Oro and Omdia ranked Nokia third in global Mobile RAN market share for the first three quarters. By the end of the year, we had 408 commercial 5G agreements across key regions and over 1 000 private wireless customers. In 2024 - 2025, we gained 18 new telecommunication customers, seven of which joined in 2025, expanded RAN market share with 18 customers, and saw 13 existing customers upgrade to 5G technologies. Nokia has set itself apart from competitors by pioneering AI-powered radio access networks (AI-RAN) solutions in partnership with NVIDIA. As the first supplier to introduce commercial- grade AI-RAN products for 5G-Advanced and 6G networks, we leverage the NVIDIA ARC-Pro accelerated computing platform to evolve our Cloud RAN into a Cloud AI-RAN solution, and in our AirScale RAN solutions. The upcoming AI- RAN capacity plug-in unit for Nokia AirScale baseband will be optimized for AI-native traffic, allowing customers to capture greater opportunities in the AI-driven market cycle. T-Mobile U.S. is partnering with Nokia and NVIDIA to drive and test AI-RAN technologies within its commercial network.

QUALCOMM INC (QCOM): 1 line(s)

QUALCOMM INC names Nokia Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2024-11-06 (this filer's naming: current); last named 2024-11-06; not named in QUALCOMM INC's 2025-11-05 filing as read.

decrease in revenues from the ending of the recognition of certain upfront license fee consideration in the first quarter of fiscal 2023 from our long-term license agreement with Nokia

From QUALCOMM Incorporated's 10-K filed 2024-11-06, accession 000080432824000075, period September 29, 2024, under Item 7. Management; characters 261723 to 261907; re-found.

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Gross margin percentage remained flat in fiscal 2024. QTL Segment (in millions, except percentages) 2024 2023 Change Licensing revenues $ 5,572 $ 5,306 $ 266 EBT 4,027 3,628 399 EBT as a % of revenues 72 % 68 % 4 points 2024 vs. 2023 The increase in QTL licensing revenues in fiscal 2024 was primarily due to: + $402 million increase in estimated sales of 3G/4G/5G-based multimode products - $90 million decrease in estimated revenues per unit - $68 million decrease in revenues from the ending of the recognition of certain upfront license fee consideration in the first quarter of fiscal 2023 from our long-term license agreement with Nokia QTL EBT as a percentage of revenues increased in fiscal 2024 primarily due to: + lower cost of sales driven by a decrease in amortization expense related to acquired patents + higher revenues 44 QSI Segment (in millions) 2024 2023 Change Equipment and services revenues $ 18 $ 28 $ (10) EBT 104 (12) 116 2024 vs. 2023 QSI EBT increased in fiscal 2024 primarily due to net gains on certain of our …

Samsung Electronics Co., Ltd. 3 holdings

Families: foundry; named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 23; named customer or supplier 16; foundry 5; licence (licensor or licensee) 5.

Advanced Micro Devices, Inc. (AMD): 1 line(s)

Advanced Micro Devices, Inc. names Samsung Electronics Co., Ltd. as its foundry; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

Additionally, we utilize TSMC, United Microelectronics Corporation (UMC) and Samsung Electronics Co., Ltd. for the production of our ICs in the form of programmable logic devices.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 81472 to 81651; re-found.

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Manufacturing Arrangements and Assembly and Test Facilities Third-Party Wafer Foundry Facilities We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products and GLOBALFOUNDRIES Inc. (GF), with respect to wafer purchases for our HPC products at the 12 nm and 14 nm technology nodes. Additionally, we utilize TSMC, United Microelectronics Corporation (UMC) and Samsung Electronics Co., Ltd. for the production of our ICs in the form of programmable logic devices. Other Third-Party Manufacturers We outsource board-level graphics product manufacturing to third-party manufacturers.

NVIDIA Corporation (NVDA): 1 line(s)

NVIDIA Corporation names Samsung Electronics Co., Ltd. as its foundry and supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57819 to 57993; re-found.

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We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57994 to 58070; re-found.

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We have expanded our supplier relationships to build redundancy and resilience in our operations to provide long-term manufacturing capacity aligned with growing customer demand. While currently our supply chain is mainly concentrated in Asia, we are expanding into the U.S. and Latin America. We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers. We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung. We utilize CoWoS technology for semiconductor packaging. We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.

QUALCOMM INC (QCOM): 2 line(s)

QUALCOMM INC names Samsung Electronics Co., Ltd. as its foundry; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 57997 to 58203; re-found.

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QUALCOMM INC names Samsung Electronics Co., Ltd. as its end customer; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 73438 to 73550; re-found.

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QTL is operated by QUALCOMM Incorporated, which owns the vast majority of our patent portfolio. Snapdragon and Qualcomm branded products are products of QTI and/or its subsidiaries. Qualcomm patents are licensed by QUALCOMM Incorporated. Neither QTI nor any of its subsidiaries has any right, power or authority to grant any licenses or other rights under or to any patents owned by QUALCOMM Incorporated. Revenue Concentrations and Significant Customers A small number of customers/licensees historically have accounted for a significant portion of our consolidated revenues. In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues. Additional information regarding revenue concentrations is provided in this Annual Report in “Notes to Consolidated Financial Statements, Note 2. Composition of Certain Financial Statement Items” and “Notes to Consolidated Financial Statements, Note 8. Segment Information.”

Siliconware Precision Industries Co., Ltd. 3 holdings

Families: assembly and test.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 4; assembly and test 4.

Advanced Micro Devices, Inc. (AMD): 1 line(s)

Advanced Micro Devices, Inc. names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 82176 to 82315; re-found.

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Other Third-Party Manufacturers We outsource board-level graphics product manufacturing to third-party manufacturers. Assembly, Test, Mark and Packaging Facilities Wafers for our products are either sorted by the foundry or delivered by the foundry to our assembly, test, mark and packaging (ATMP) partners or subcontractors located in the Asia-Pacific region, who package and test our final semiconductor products. We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd. The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products. 10 Table of Conten t s Intellectual Property and Licensing We rely on contracts and intellectual property rights to protect our products and technologies from unauthorized third-party copying and use. Intellectual property rights include copyrights, patents, patent applications, trademarks, trade secrets and mask work rights.

Broadcom Inc. (AVGO): 1 line(s)

Broadcom Inc. names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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QUALCOMM INC (QCOM): 1 line(s)

QUALCOMM INC names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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Under the two-stage manufacturing model, we purchase die in singular or wafer form from semiconductor manufacturing foundries and contract with separate third parties for manufacturing services such as wafer bump, probe, assembly and the majority of our final test requirements. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries. Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region. QCT primarily uses internal fabrication facilities to manufacture certain RFFE modules and RF filter products, and our manufacturing operations consist of front-end and back-end processes.

Advanced Semiconductor Engineering, Inc. 2 holdings

Families: assembly and test.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 4; assembly and test 4.

Broadcom Inc. (AVGO): 1 line(s)

Broadcom Inc. names Advanced Semiconductor Engineering, Inc. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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QUALCOMM INC (QCOM): 1 line(s)

QUALCOMM INC names Advanced Semiconductor Engineering, Inc. as its assembly and test provider; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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Amkor Technology, Inc. 2 holdings

Families: assembly and test; named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 4; assembly and test 3; named customer or supplier 2.

Broadcom Inc. (AVGO): 1 line(s)

Broadcom Inc. names Amkor Technology, Inc. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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QUALCOMM INC (QCOM): 2 line(s)

Amkor Technology, Inc. names QUALCOMM INC as its end customer; State current since 2026-02-20 (this filer's naming: current); last named 2026-02-20.

Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 1. Business; characters 92238 to 92372; re-found.

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In addition, semiconductor companies generally reduce their production during the holidays at the end of December, which generally results in a decrease in packaging and test services during the first quarter. General economic conditions, changes in our product mix or overall demand in any of our end markets can impact our seasonality. CUSTOMERS Our customers include most of the world’s largest semiconductor companies. Our ten largest customers accounted for 72% of our net sales in 2025. Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025. MATERIALS AND EQUIPMENT Materials Our materials are used primarily for packaging activities. Our packaging operations depend upon obtaining adequate supplies of materials on a timely basis. The principal materials used in our packaging process are laminate substrates, ICs, capacitors, leadframes and bonding wires. The silicon wafer is generally consigned from our customer.

QUALCOMM INC names Amkor Technology, Inc. as its assembly and test provider; State current since 2026-02-20 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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Apple Inc. 2 holdings

Families: named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 18; named customer or supplier 14; distribution 1; licence (licensor or licensee) 3.

Amkor Technology, Inc. (AMKR): 1 line(s)

Amkor Technology, Inc. names Apple Inc. as its end customer; State current since 2026-02-20 (this filer's naming: current); last named 2026-02-20.

Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 1. Business; characters 92238 to 92372; re-found.

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QUALCOMM INC (QCOM): 1 line(s)

QUALCOMM INC names Apple Inc. as its end customer; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 73438 to 73550; re-found.

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Broadcom Inc. 2 holdings

Families: foundry; assembly and test.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 9; assembly and test 2; named customer or supplier 6; foundry 1; licence (licensor or licensee) 2.

Amkor Technology, Inc. (AMKR): 1 line(s)

Broadcom Inc. names Amkor Technology, Inc. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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Taiwan Semiconductor Manufacturing Company Limited (TSM): 2 line(s)

During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1A. RISK FACTORS; characters 114481 to 114584; re-found.

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We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Cirrus Logic, Inc. 2 holdings

Families: foundry; assembly and test.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 5; assembly and test 1; named customer or supplier 2; foundry 2; licence (licensor or licensee) 1.

Amkor Technology, Inc. (AMKR): 1 line(s)

Cirrus Logic, Inc. names Amkor Technology, Inc. as its assembly and test provider; State current since 2026-05-21 (this filer's naming: current); last named 2026-05-21.

The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.

From CIRRUS LOGIC, INC.'s 10-K filed 2026-05-21, accession 000077240626000018, period March 28, 2026, under ITEM 1. Business; characters 37310 to 37525; re-found.

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In fiscal year 2022, the Company entered into a Capacity Reservation and Wafer Supply Commitment Agreement with GlobalFoundries to reserve capacity and set wafer pricing for products purchased pursuant to the agreement through calendar year 2026. On February 18, 2025, the Capacity Reservation Agreement was amended (the "Amendment") to define the quarterly spread of the remaining wafer quantities under the agreement. See Note 13 - Commitments and Contingencies of the Notes to the Consolidated Financial Statements for additional details. The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd. Our outsourced manufacturing strategy allows us to concentrate on our design strengths and minimize fixed costs and capital expenditures while giving us access to advanced manufacturing facilities. It also provides the flexibility to source multiple leading-edge technologies through strategic relationships.

Taiwan Semiconductor Manufacturing Company Limited (TSM): 1 line(s)

Cirrus Logic, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-05-21 (this filer's naming: current); last named 2026-05-21.

We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").

From CIRRUS LOGIC, INC.'s 10-K filed 2026-05-21, accession 000077240626000018, period March 28, 2026, under ITEM 1. Business; characters 36579 to 36767; re-found.

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For fiscal years 2026, 2025, and 2024, we had one end customer, Apple Inc., who purchased through multiple contract manufacturers and represented approximately 91 percent, 89 percent, and 87 percent, of the Company’s total net sales, respectively. No other customer or distributor represented more than 10 percent of net sales in fiscal years 2026, 2025, or 2024. 4 Table of Contents Manufacturing As a fabless semiconductor company, we contract with third parties for wafer fabrication and product assembly and test. We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC"). In fiscal year 2022, the Company entered into a Capacity Reservation and Wafer Supply Commitment Agreement with GlobalFoundries to reserve capacity and set wafer pricing for products purchased pursuant to the agreement through calendar year 2026.

GLOBALFOUNDRIES Inc. 2 holdings

Families: foundry.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 5; named customer or supplier 4; foundry 3.

Advanced Micro Devices, Inc. (AMD): 2 line(s)

Advanced Micro Devices, Inc. names GLOBALFOUNDRIES Inc. as its foundry; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

We rely on Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of all wafers for microprocessor and GPU products at 7 nanometer (nm) or smaller nodes, and we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1A. RISK FACTORS; characters 127713 to 128034; re-found.

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GLOBALFOUNDRIES Inc. names Advanced Micro Devices, Inc. as its end customer; State current since 2026-02-04 (this filer's naming: current); last named 2025-03-20; not named in GLOBALFOUNDRIES Inc.'s 2026-02-27 filing as read.

For the year 2024, our top ten customers, based on wafer shipment volume, included some of the largest semiconductor companies in the world: AMD, Cirrus Logic International (U.K.) Limited, Infineon Technologies AG, Media Tek Inc., NXP Semiconductors N.V., Qualcomm Global Trading Pte. Ltd (“Qualcomm”), Qorvo International Ptd. Ltd, Samsung, Skyworks Solutions, Inc. and Sony Semiconductor Manufacturing Corporation.

From GFS's 20-F filed 2025-03-20, accession 000170904825000024, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 288083 to 288499; re-found.

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… Devices Home and Industrial IoT Communications, Infrastructure and Datacenter Automotive FEATURE RICH CMOS FR-CMOS ✓ ✓ ✓ ✓ ULTRA-LOW POWER CMOS FinFet ✓ ✓ ✓ ✓ FDX TM , FD-SOI ✓ ✓ ✓ ✓ SILICON PHOTONICS SiPh ✓ ✓ RF RF, SOI ✓ ✓ ✓ ✓ SiGe ✓ ✓ ✓ ✓ RF GaN ✓ ✓ POWER BCD, BCDLite ✓ ✓ ✓ ✓ Power GaN ✓ ✓ ✓ ✓ Customers and Sales Through our highly differentiated technology, scaled manufacturing footprint and intense focus on collaboration, we have built deep strategic partnerships with a broad base of more than 250 customers as of December 31, 2024, many of whom are the global leaders in their field. For the year 2024, our top ten customers, based on wafer shipment volume, included some of the largest semiconductor companies in the world: AMD, Cirrus Logic International (U.K.) Limited, Infineon Technologies AG, Media Tek Inc., NXP Semiconductors N.V., Qualcomm Global Trading Pte. Ltd (“Qualcomm”), Qorvo International Ptd. Ltd, Samsung, Skyworks Solutions, Inc. and Sony Semiconductor Manufacturing Corporation. A key measure of our position as a strategic partner to our customers is the mix of our wafer shipment volume attributable to single-sourced design wins, which represented approximately 64% of wafer shipment volume in 2024.

QUALCOMM INC (QCOM): 1 line(s)

QUALCOMM INC names GLOBALFOUNDRIES Inc. as its foundry; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 57997 to 58203; re-found.

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Hon Hai Precision Industry Co., Ltd. 2 holdings

Families: assembly and test.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 4; assembly and test 2; contract manufacturing 1; named customer or supplier 1.

one counterparty here: the identity view holds 2317.TW, ?foxconn hon hai as possible same entity on one store node, so their lines are joined.

Broadcom Inc. (AVGO): 1 line(s)

Broadcom Inc. names Hon Hai Precision Industry Co., Ltd. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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NVIDIA Corporation (NVDA): 1 line(s)

NVIDIA Corporation names Hon Hai Precision Industry Co., Ltd. as its assembly and test provider; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 58128 to 58342; re-found.

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While currently our supply chain is mainly concentrated in Asia, we are expanding into the U.S. and Latin America. We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers. We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung. We utilize CoWoS technology for semiconductor packaging. We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products. Competition The market for our products is intensely competitive and is characterized by rapid technological change and evolving industry standards.

HP Inc. 2 holdings

Families: named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 7; named customer or supplier 5; licence (licensor or licensee) 2.

Advanced Micro Devices, Inc. (AMD): 1 line(s)

HP Inc. names Advanced Micro Devices, Inc. as its supplier; State current since 2025-12-10 (this filer's naming: current); last named 2025-12-10.

We also rely on Intel, AMD, and NVIDIA, or other suppliers to provide us with a sufficient supply of processors for the majority of our PCs and workstations.

From HP Inc.'s 10-K filed 2025-12-10, accession 000004721725000071, period October 31, 2025, under ITEM 1A. Risk Factors.; characters 142661 to 142818; re-found.

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Our brand perception, customer loyalty and legal compliance could be adversely impacted by a supplier’s improper practices or failure to comply with our requirements for responsible practices and sourcing, including sub-tier sourcing. • Single-source suppliers. We obtain a significant number of components from a single source due to technology, availability, price, quality or other considerations. For example, we rely on Canon for certain laser printer engines and laser toner cartridges and certain key suppliers for application specific integrated circuits (“ASICs”). We also rely on Intel, AMD, and NVIDIA, or other suppliers to provide us with a sufficient supply of processors for the majority of our PCs and workstations. Some of those processors may be customized for our products. New products that we introduce may utilize custom components obtained initially from only one source until we have determined whether there is a need for additional suppliers.

NVIDIA Corporation (NVDA): 1 line(s)

HP Inc. names NVIDIA Corporation as its supplier; State current since 2025-12-10 (this filer's naming: current); last named 2025-12-10.

We also rely on Intel, AMD, and NVIDIA, or other suppliers to provide us with a sufficient supply of processors for the majority of our PCs and workstations.

From HP Inc.'s 10-K filed 2025-12-10, accession 000004721725000071, period October 31, 2025, under ITEM 1A. Risk Factors.; characters 142661 to 142818; re-found.

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Intel Corporation 2 holdings

Families: foundry; named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 13; named customer or supplier 11; foundry 2; licence (licensor or licensee) 2.

ASML Holding N.V. (ASML): 2 line(s)

ASML Holding N.V. names Intel Corporation as its end customer; State current since 2025-03-05 (this filer's naming: current); last named 2025-03-05; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

systems were assembled and installed at an Intel plant near Hillsboro, Oregon (US)

From ASML HOLDING NV's 20-F filed 2025-03-05, accession 000093796625000009, period December 31, 2024; characters 88179 to 88261; re-found.

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New for 2024: High NA EUV success with our TWINSCAN EXE:5000 To prepare High NA EUV (0.55 NA) for high-volume manufacturing, the first operational prototype was made available to chipmakers in the new ASML-imec High NA EUV Lithography Lab at our Veldhoven campus (the Netherlands). T wo more TWINSCAN EXE:5000 systems were assembled and installed at an Intel plant near Hillsboro, Oregon (US), and a fourth system was shipped to a customer in Asia . In April 2024, the High NA EUV system in Veldhoven printed the first-ever 10 nm dense lines, with imaging done after optics, sensors and stages completed coarse calibration (see image on the right) . This important milestone showed the system is functioning, though not at full performance in a high-volume manufacturing environment yet .

Intel Corporation names ASML Holding N.V. as its supplier; State current since 2025-03-05 (this filer's naming: current); last named 2026-01-23.

Sourcing in the filing's own words: sole supplier.

For example, ASML Holding N.V. (ASML) is currently the sole supplier of EUV lithography tools that we are deploying in our Intel 4, Intel 3, Intel 18A and planned future leading-edge manufacturing process nodes.

From INTEL CORPORATION's 10-K filed 2026-01-23, accession 000005086326000011, period December 27, 2025; characters 287602 to 287813; re-found.

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We typically have less control over delivery schedules, design and manufacturing co-optimization, yields, quality, product quantities and costs for components and products that are manufactured by third parties. For certain products, components, services, materials and equipment, we rely on a single or a limited number of suppliers, or upon suppliers in a single location, which can impact the nature, quality, availability and pricing of the products and services available to us. For example, ASML Holding N.V. (ASML) is currently the sole supplier of EUV lithography tools that we are deploying in our Intel 4, Intel 3, Intel 18A and planned future leading-edge manufacturing process nodes. These tools are highly complex to develop and produce, and increasingly costly, and from time to time there are increases in lead times or delays in their development and availability, which could delay the development or ramp of our future process nodes.

Taiwan Semiconductor Manufacturing Company Limited (TSM): 2 line(s)

Intel Corporation names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-01-23 (this filer's naming: current); last named 2026-01-23.

In recent years, however, we have also strategically utilized third-party foundry manufacturing capacity, including at one of our key foundry competitors, TSMC, for various tiles or an entire product where advantageous for cost, performance, schedule or other considerations.

From INTEL CORPORATION's 10-K filed 2026-01-23, accession 000005086326000011, period December 27, 2025; characters 114211 to 114486; re-found.

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In addition, a disaggregated approach often requires advanced substrates and other materials that can create additional manufacturing challenges when supply is constrained, as is the situation currently. Our product offerings are predominantly manufactured in our own facilities, located in the U.S. and internationally, using our proprietary process technologies. In recent years, however, we have also strategically utilized third-party foundry manufacturing capacity, including at one of our key foundry competitors, TSMC, for various tiles or an entire product where advantageous for cost, performance, schedule or other considerations. This approach provides flexibility and scale, including in recent years the ability to offer products at the most performant end of the spectrum where comparable internal process technologies were not yet available. We expect to continue to use TSMC and other third-party foundry suppliers for various key tiles in a number of current and future products.

Taiwan Semiconductor Manufacturing Company Limited names Intel Corporation as its end customer; State current since 2026-01-23 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Lam Research Corporation 2 holdings

Families: named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 4; named customer or supplier 4.

Micron Technology, Inc. (MU): 1 line(s)

Lam Research Corporation names Micron Technology, Inc. as its end customer; State current since 2024-08-29 (this filer's naming: current); last named 2024-08-29; not named in Lam Research Corporation's 2025-08-11 filing as read.

Our most significant customers during the fiscal years ending June 30, 2024, June 25, 2023, and June 26, 2022 included Micron Technology, Inc.; Samsung Electronics Company, Ltd.; SK hynix Inc.; and Taiwan Semiconductor Manufacturing Company.

From LAM RESEARCH CORPORATION's 10-K filed 2024-08-29, accession 000070754924000106, period June 30, 2024, under Item 1. Business; characters 58164 to 58405; re-found.

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Customers Our customers include many of the world’s leading semiconductor manufacturers. Customers continue to establish joint ventures, alliances, and licensing arrangements which have the potential to positively or negatively impact our competitive position and market opportunities. Refer to Note 9 of our Consolidated Financial Statements, included in Part II, Item 8 of this report, for information concerning customer concentrations. Our most significant customers during the fiscal years ending June 30, 2024, June 25, 2023, and June 26, 2022 included Micron Technology, Inc.; Samsung Electronics Company, Ltd.; SK hynix Inc.; and Taiwan Semiconductor Manufacturing Company. A material reduction in orders from our customers could adversely affect our results of operations and projected financial condition. Our business depends upon the expenditures of semiconductor manufacturers.

Taiwan Semiconductor Manufacturing Company Limited (TSM): 1 line(s)

Lam Research Corporation names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2025-08-11 (this filer's naming: current); last named 2025-08-11.

Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company.

From LAM RESEARCH CORPORATION's 10-K filed 2025-08-11, accession 000070754925000075, period June 29, 2025, under Item 1. Business; characters 55541 to 55741; re-found.

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Customers Our customers include many of the world’s leading semiconductor manufacturers. Customers continue to establish joint ventures, alliances, and licensing arrangements which have the potential to positively or negatively impact our competitive position and market opportunities. Refer to Note 9 of our Consolidated Financial Statements, included in Part II, Item 8 of this report, for information concerning customer concentrations. Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company. A material reduction in orders from our customers could adversely affect our results of operations and projected financial condition. Our business depends upon the expenditures of semiconductor manufacturers.

Microsoft Corporation 2 holdings

Families: named customer or supplier; licence (licensor or licensee), licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 10; named customer or supplier 6; distribution 2; licence (licensor or licensee) 2.

Advanced Micro Devices, Inc. (AMD): 1 line(s)

Advanced Micro Devices, Inc. names Microsoft Corporation as its end customer; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 59234 to 59404; re-found.

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In addition, we leverage our core IP, including graphics and processing technologies, to develop semi-custom solutions deeply co-engineered with our customers, which has enabled many of today’s leading gaming consoles and handheld gaming products. Semi-Custom Products. Our semi-custom products are tailored, high-performance, customer-specific solutions based on CPU, GPU and multi-media technologies. We work closely with our customers to define solutions precisely matching their system requirements. AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC. Discrete Desktop and Notebook GPUs . Our AMD Radeon RX discrete GPU processors for PCs power the latest gaming and creation platforms.

NVIDIA Corporation (NVDA): 1 line(s)

NVIDIA Corporation names Microsoft Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

Under our agreement with Microsoft for the Xbox, if someone makes an offer to purchase at least 30% of our outstanding common stock, Microsoft may have first and last rights of refusal to purchase the stock.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1A. Risk Factors; characters 193339 to 193546; re-found.

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These provisions include the ability of our Board of Directors to create and issue preferred stock, change the number of directors, and to make, amend or repeal our bylaws without prior shareholder approval; the inability of our shareholders to act by written consent; advance notice requirements for director nominations and shareholder proposals; and super-majority voting requirement to amend some provisions in our certificate of incorporation and bylaws. Under our agreement with Microsoft for the Xbox, if someone makes an offer to purchase at least 30% of our outstanding common stock, Microsoft may have first and last rights of refusal to purchase the stock. These provisions could delay or prevent a change in control of NVIDIA, discourage proxy contests, and make it more difficult for shareholders to elect directors of their choosing and to cause us to take other corporate actions they desire. Item 1B. Unresolved Staff Comments None. Item 1C.

NVIDIA Corporation 2 holdings

Families: foundry; named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 10; assembly and test 1; named customer or supplier 8; foundry 1; licence (licensor or licensee) 2.

Micron Technology, Inc. (MU): 1 line(s)

NVIDIA Corporation names Micron Technology, Inc. as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57994 to 58070; re-found.

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Taiwan Semiconductor Manufacturing Company Limited (TSM): 2 line(s)

NVIDIA Corporation names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57819 to 57993; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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QUALCOMM INC 2 holdings

Families: foundry; assembly and test; named customer or supplier.

Covered filers with a current disclosed relationship with it, of 189 read before the date: any family 8; assembly and test 1; named customer or supplier 4; foundry 2; licence (licensor or licensee) 3.

Amkor Technology, Inc. (AMKR): 2 line(s)

Amkor Technology, Inc. names QUALCOMM INC as its end customer; State current since 2026-02-20 (this filer's naming: current); last named 2026-02-20.

Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 1. Business; characters 92238 to 92372; re-found.

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QUALCOMM INC names Amkor Technology, Inc. as its assembly and test provider; State current since 2026-02-20 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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Taiwan Semiconductor Manufacturing Company Limited (TSM): 2 line(s)

QUALCOMM INC names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 57997 to 58203; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Folded

3 counterparties that two or more holdings name are folded into this one line (list sentence 1, universal licensor 2; a counterparty can carry more than one reason). They are counted, not listed.

Parent view

ASE Technology Holding Co., Ltd.: Advanced Semiconductor Engineering, Inc. (AVGO, QCOM), Siliconware Precision Industries Co., Ltd. (AMD, AVGO, QCOM); a view from the store's ownership claims filed before the date; the companies stay separate lines; 3 other ownership claims of the group name companies that are not in this book, counted, not listed.

Claim clm:2989f9a1d03d22ee0a688b8b: ASE Technology Holding Co., Ltd. directly_controls Advanced Semiconductor Engineering, Inc., filed 2026-04-01; 1 receipt(s).

ASEH directly controls ASE Group, SPIL Group, USI Group, ASE Social Enterprise Co., Ltd., and ASE Global Integrated Solutions Co., Ltd.

From ASE Technology Holding Co., Ltd.'s 20-F filed 2026-04-01, accession 000119312526135585, period December 31, 2025, under Item 4. Information on the Company; characters 273901 to 274036; re-found.

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Even if such allegations are ultimately proven to be groundless, allegations against us could severely impact ADSs and their value could be greatly reduced or rendered worthless. Item 4. Information on the Company HISTORY AND DEVELOPMENT OF THE COMPANY ASE Technology Holding Co., Ltd. was jointly established on April 30, 2018, as a company limited by shares under the R.O.C. Company Law, by the combination of Advanced Semiconductor Engineering, Inc., which was incorporated on March 23, 1984, and Siliconware Precision Industries Co., Ltd., which was incorporated on May 17, 1984. ASEH directly controls ASE Group, SPIL Group, USI Group, ASE Social Enterprise Co., Ltd., and ASE Global Integrated Solutions Co., Ltd. ASEH’s main manufacturing facilities are located in Taiwan, the P.R.C., South Korea, Japan, Singapore, Malaysia, the Philippines, Vietnam, Mexico, America, Poland, France, the United Kingdom, Germany, Tunisia, the Czech Republic, and Hungary.

Claim clm:831b6bb01573bf2301f8e85a: ASE Technology Holding Co., Ltd. wholly_owns Advanced Semiconductor Engineering, Inc., filed 2026-04-01; 1 receipt(s).

The Share Exchange consummated on April 30, 2018, and ASE and SPIL became privately held and wholly owned subsidiaries of ASEH concurrently.

From ASE Technology Holding Co., Ltd.'s 20-F filed 2026-04-01, accession 000119312526135585, period December 31, 2025, under Item 4. Information on the Company; characters 276345 to 276485; re-found.

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In 2015, ASE started purchasing SPIL shares through concurrent tender offers in the R.O.C. and the U.S. In 2016, ASE entered into the Joint Share Exchange Agreement with SPIL, pursuant to which ASEH was formed by means of a statutory share exchange pursuant to the laws of the Republic of China, and ASEH (i) acquired all issued shares of ASE in exchange for shares of ASEH, and (ii) acquired all issued shares of SPIL using cash consideration. The Share Exchange consummated on April 30, 2018, and ASE and SPIL became privately held and wholly owned subsidiaries of ASEH concurrently. Moreover, ASE and SPIL were separately approved by the competent authority to terminate their public offerings in March and April 2024. USI Group and USI Group Restructuring USI Group engages primarily in EMS in relation to computing, consumer electronics, communications, industrial and automotive, among other services and businesses.

Claim clm:a9269342bd4e3318f812bfa6: ASE Technology Holding Co., Ltd. wholly_owns Siliconware Precision Industries Co., Ltd., filed 2026-04-01; 1 receipt(s).

The Share Exchange consummated on April 30, 2018, and ASE and SPIL became privately held and wholly owned subsidiaries of ASEH concurrently.

From ASE Technology Holding Co., Ltd.'s 20-F filed 2026-04-01, accession 000119312526135585, period December 31, 2025, under Item 4. Information on the Company; characters 276345 to 276485; re-found.

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Claim clm:feeff879e5e3dee478d66afc: ASE Technology Holding Co., Ltd. directly_controls Siliconware Precision Industries Co., Ltd., filed 2026-04-01; 1 receipt(s).

ASEH directly controls ASE Group, SPIL Group, USI Group, ASE Social Enterprise Co., Ltd., and ASE Global Integrated Solutions Co., Ltd.

From ASE Technology Holding Co., Ltd.'s 20-F filed 2026-04-01, accession 000119312526135585, period December 31, 2025, under Item 4. Information on the Company; characters 273901 to 274036; re-found.

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Sole and dual sourcing, in the filing's words (4)

the filing's own words, for rows the state reader classed sole or dual; explicit wording only until the sole-source audit (L3) passes.

Advanced Micro Devices, Inc. and Hewlett Packard Enterprise Company: single-source (quote).

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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ASML Holding N.V. and Intel Corporation: sole supplier (quote).

For example, ASML Holding N.V. (ASML) is currently the sole supplier of EUV lithography tools that we are deploying in our Intel 4, Intel 3, Intel 18A and planned future leading-edge manufacturing process nodes.

From INTEL CORPORATION's 10-K filed 2026-01-23, accession 000005086326000011, period December 27, 2025; characters 287602 to 287813; re-found.

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Broadcom Inc. and Hewlett Packard Enterprise Company: single-source (quote).

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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NVIDIA Corporation and Hewlett Packard Enterprise Company: single-source (quote).

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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Each holding's relationships

Each holding's list below is not printed: the lists are on the page, closed until opened.

Advanced Micro Devices, Inc. (AMD): current 19, stale 16

current (19)

Advanced Micro Devices, Inc. names ATMP JV (two joint ventures with affiliates of Tongfu Microelectronics Co., Ltd.) as its assembly and test provider; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 82176 to 82315; re-found.

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Fortinet, Inc. names Advanced Micro Devices, Inc. as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

Some of the components important to our business, including certain Central Processing Units (“CPUs”) from Intel Corporation (“Intel”) and Advanced Micro Devices, Inc. (“AMD”), network and wireless chips from Broadcom Inc. (“Broadcom”), Marvell Technology Group Ltd. (“Marvell”), Qualcomm Incorporated (“Qualcomm”) and Intel and memory devices from Intel, Micron Technology (“Micron”), ADATA Technology Co., Ltd. (“ADATA”), Toshiba Corporation (“Toshiba”), Samsung Electronics Co., Ltd. (“Samsung”), and Western Digital Technologies, Inc. (“Western Digital”), are available from limited or sole sources of supply.

From FORTINET, INC.'s 10-K filed 2026-02-25, accession 000126203926000007, period 2025-12-31, under ITEM 1. Business; characters 80561 to 81174; re-found.

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Our proprietary ASICs, which are key to the performance of our appliances, are built by contract manufacturers including Toshiba America Electronic Components, Inc. (“Toshiba America”) and Renesas Electronics America, Inc. (“Renesas”). These contract manufacturers use foundries in Taiwan and Japan operated by either Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) or by the contract manufacturer itself. The components included in our products are sourced from various suppliers by us or, more frequently, by our contract manufacturers. Some of the components important to our business, including certain Central Processing Units (“CPUs”) from Intel Corporation (“Intel”) and Advanced Micro Devices, Inc. (“AMD”), network and wireless chips from Broadcom Inc. (“Broadcom”), Marvell Technology Group Ltd. (“Marvell”), Qualcomm Incorporated (“Qualcomm”) and Intel and memory devices from Intel, Micron Technology (“Micron”), ADATA Technology Co., Ltd. (“ADATA”), Toshiba Corporation (“Toshiba”), Samsung Electronics Co., Ltd. (“Samsung”), and Western Digital Technologies, Inc. (“Western Digital”), are available from limited or sole sources of supply. We have no long-term contracts related to the manufacturing of our ASICs or other components that guarantee any capacity or pricing terms. Additionally, we manage global memory component supply through diversified sourcing arrangements, strategic inventory planning and coordination with key supply chain partners.

Advanced Micro Devices, Inc. names GLOBALFOUNDRIES Inc. as its foundry; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

We rely on Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of all wafers for microprocessor and GPU products at 7 nanometer (nm) or smaller nodes, and we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1A. RISK FACTORS; characters 127713 to 128034; re-found.

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For the year 2024, our top ten customers, based on wafer shipment volume, included some of the largest semiconductor companies in the world: AMD, Cirrus Logic International (U.K.) Limited, Infineon Technologies AG, Media Tek Inc., NXP Semiconductors N.V., Qualcomm Global Trading Pte. Ltd (“Qualcomm”), Qorvo International Ptd. Ltd, Samsung, Skyworks Solutions, Inc. and Sony Semiconductor Manufacturing Corporation.

From GFS's 20-F filed 2025-03-20, accession 000170904825000024, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 288083 to 288499; re-found.

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Hewlett Packard Enterprise Company names Advanced Micro Devices, Inc. as its supplier; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

Sourcing in the filing's own words: single-source.

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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HP Inc. names Advanced Micro Devices, Inc. as its supplier; State current since 2025-12-10 (this filer's naming: current); last named 2025-12-10.

We also rely on Intel, AMD, and NVIDIA, or other suppliers to provide us with a sufficient supply of processors for the majority of our PCs and workstations.

From HP Inc.'s 10-K filed 2025-12-10, accession 000004721725000071, period October 31, 2025, under ITEM 1A. Risk Factors.; characters 142661 to 142818; re-found.

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Advanced Micro Devices, Inc. names King Yuan Electronics Co., Ltd. as its assembly and test provider; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 82176 to 82315; re-found.

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Advanced Micro Devices, Inc. names Microsoft Corporation as its end customer; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 59234 to 59404; re-found.

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Advanced Micro Devices, Inc. names OpenAI OpCo, LLC as its end customer; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

In October 2025, we entered into a product purchase agreement with OpenAI OpCo, LLC, (OpenAI) to deploy 6 gigawatts of AMD GPUs, with the deployment of the first gigawatt of capacity powered by our AMD Instinct MI450 series products.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 49537 to 49770; re-found.

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AMD is uniquely positioned to deliver across this stack, combining industry-leading CPUs, GPUs and adaptive SoCs with networking, software and system integration expertise. We continue to invest in software capabilities and the open ecosystem through the AMD ROCm™ platform, delivering new features for high-performance AI training and inference. In 2025, we introduced key optimizations and expanded support for frameworks and libraries, improving performance for generative AI workloads and simplifying the developer experience. In October 2025, we entered into a product purchase agreement with OpenAI OpCo, LLC, (OpenAI) to deploy 6 gigawatts of AMD GPUs, with the deployment of the first gigawatt of capacity powered by our AMD Instinct MI450 series products. This multiyear strategic partnership with OpenAI demonstrates our continued execution of hardware, software and full-stack solutions roadmaps. Our Business Beginning in the first quarter of fiscal year 2025, we combined the Client and Gaming segments into one reportable segment to align with how we manage our business. All prior period segment data were retrospectively adjusted.

Rambus, Inc. names Advanced Micro Devices, Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-18 (this filer's naming: current); last named 2026-02-18.

Leading semiconductor and electronic system companies, such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents

From RAMBUS INC .'s 10-K filed 2026-02-18, accession 000119312526057101, period December 31, 2025, under Item 1. Business; characters 42010 to 42323; re-found.

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Table of Contents customers may use or employ our inventions in their products. License agreements are structured with fixed or variable, or a hybrid of fixed and variable royalty payments over certain periods typically ranging up to ten years. Leading semiconductor and electronic system companies, such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents. Additionally, from time to time, we enter into agreements to sell certain patent assets under agreements which may also include subsequent profit-sharing. The sale of these patents, as well as the subsequent profit-sharing, are included as part of our royalties revenue.

Advanced Micro Devices, Inc. names Samsung Electronics Co., Ltd. as its foundry; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

Additionally, we utilize TSMC, United Microelectronics Corporation (UMC) and Samsung Electronics Co., Ltd. for the production of our ICs in the form of programmable logic devices.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 81472 to 81651; re-found.

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Advanced Micro Devices, Inc. names Sanmina Corporation as its contract manufacturer; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

The Company also entered into a Manufacturing Services Agreement with Sanmina with an initial term of five years.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 328257 to 328370; re-found.

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Upon close of the sale, the Company recorded a Sanmina Earn-out receivable of $ 332 million within Other non-current assets in the Company’s Consolidated Balance Sheets. The Earn-out receivable will be subject to impairment assessment at the end of each reporting period prior to receipt of payment. The Company also entered into a Manufacturing Services Agreement with Sanmina with an initial term of five years. Other Acquisitions In 2025, the Company completed other business acquisitions for a total consideration of $ 90 million that resulted in the recognition of $ 79 million of goodwill.

Advanced Micro Devices, Inc. names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 82176 to 82315; re-found.

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Advanced Micro Devices, Inc. names Sony Group Corp as its end customer; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 59234 to 59404; re-found.

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Advanced Micro Devices, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

We rely on Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of all wafers for microprocessor and GPU products at 7 nanometer (nm) or smaller nodes, and we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1A. RISK FACTORS; characters 127713 to 128034; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Advanced Micro Devices, Inc. names THATIC JV as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

We may not realize the expected benefits from the THATIC JV’s expected future performance, including the receipt of any royalties from certain licensed intellectual property.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1A. RISK FACTORS; characters 216271 to 216445; re-found.

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Acquisitions or joint ventures may also reduce our cash available for operation and other uses which could harm our business. For example, the majority of our ATMP services are provided by the ATMP JVs, and there is no guarantee that the JVs will be able to fulfill our long-term ATMP requirements. If we are unable to meet customer demand due to fluctuating or late supply from the ATMP JVs, it could result in lost sales and have a material adverse effect on our business. We may not realize the expected benefits from the THATIC JV’s expected future performance, including the receipt of any royalties from certain licensed intellectual property. In June 2019, the BIS added certain Chinese entities to the Entity List, including THATIC and the THATIC JV. We are complying with U.S. law pertaining to the Entity List designation. 39 Table of Conten t s We invest in both public and private companies to further our strategic objectives and to support certain key business initiatives.

Advanced Micro Devices, Inc. names United Microelectronics Corporation as its foundry; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

Additionally, we utilize TSMC, United Microelectronics Corporation (UMC) and Samsung Electronics Co., Ltd. for the production of our ICs in the form of programmable logic devices.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 81472 to 81651; re-found.

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Advanced Micro Devices, Inc. names Valve as its end customer; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1. BUSINESS; characters 59234 to 59404; re-found.

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stale (16)

Advanced Micro Devices, Inc. names Amazon Web Services, Inc. as its end customer; State stale since 2023-02-27 (this filer's naming: stale); last named 2021-01-29; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

In December 2020 Amazon Web Services announced and made available their new “G4ad” instance, designed for graphics intensive applications such as virtual workstations, game streaming and graphics rendering. G4ad utilizes both AMD EPYC processors and the AMD Radeon Pro V520 GPU.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2021-01-29, accession 000162828021001185, period December 26, 2020, under ITEM 1. BUSINESS; characters 54542 to 54820; re-found.

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Our visual cloud data center GPUs include a range of solutions tailored towards workloads requiring remote visualization, such as Desktop-as-a-Service, Workstation-as-a-Service and Cloud Gaming. These GPUs are designed to cover the full range of graphical application acceleration, from light desktop tasks, to workstation tasks, multi-GPU high end rendering, and cloud gaming activities. Our software solutions carry certification for a number of professional software vendor applications as well as being optimized for modern gaming titles. In December 2020 Amazon Web Services announced and made available their new “G4ad” instance, designed for graphics intensive applications such as virtual workstations, game streaming and graphics rendering. G4ad utilizes both AMD EPYC processors and the AMD Radeon Pro V520 GPU. The AMD Radeon Pro V520 is the first AMD RDNA based, 7 nm GPU 6 released for cloud environments.

Advanced Micro Devices, Inc. names ARM HOLDINGS PLC as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2022-02-03 (this filer's naming: stale); last named 2020-02-04; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

ARM Holdings designs and licenses its ARM cores and architecture to third parties, including us, and offers supporting software and services.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2020-02-04, accession 000000248820000008, period December 28, 2019, under ITEM 1. BUSINESS; characters 79606 to 79747; re-found.

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Other competitors include a variety of companies providing or developing ARM-based designs at relatively low cost and low power processors for the computing market including tablets and thin-client form factors, as well as dense servers, set-top boxes and gaming consoles. ARM Holdings designs and licenses its ARM cores and architecture to third parties, including us, and offers supporting software and services. Our ability to compete with companies who use ARM-based solutions depends on our ability to timely design and bring to market energy-efficient, high-performing products at an attractive price point. Competition in the Graphics Markets In the graphics market, our competitors include suppliers of discrete graphics, embedded graphics processors and integrated graphics processor (IGP) chipsets.

Advanced Micro Devices, Inc. names ATMP JV (Suzhou TF-AMD Semiconductor Co., Ltd. and TF AMD Microelectronics (Penang) Sdn. Bhd.) as its assembly and test provider; State stale since 2025-02-05 (this filer's naming: stale); last named 2023-02-27; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd. The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2023-02-27, accession 000000248823000047, period December 31, 2022, under ITEM 1. BUSINESS; characters 82474 to 82721; re-found.

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10 Table of Contents Additionally, we purchase wafers from United Microelectronics Corporation (UMC) and Samsung Electronics Co., Ltd. Other Third-Party Manufacturers We outsource board-level graphics product manufacturing to third-party manufacturers. Assembly, Test, Mark and Packaging Facilities Wafers for our products are either sorted by the foundry or delivered by the foundry to our assembly, test, mark and packaging (ATMP) partners or subcontractors located in the Asia-Pacific region who package and test our final semiconductor products. We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd. The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products. Intellectual Property and Licensing We rely on contracts and intellectual property rights to protect our products and technologies from unauthorized third-party copying and use. Intellectual property rights include copyrights, patents, patent applications, trademarks, trade secrets and mask work rights.

Cohu, Inc. names Advanced Micro Devices, Inc. as its end customer; State stale since 2014-03-05 (this filer's naming: stale); last named 2012-02-29; not named in Cohu, Inc.'s 2026-02-17 filing as read.

During the last three years, customers from our semiconductor equipment segment that have comprised 10% or greater of our consolidated net sales are as follows: 2011 2010 2009 Intel 36% 26% 30% Texas Instruments 11% 14% * Advanced Micro Devices * * 11%

From COHU, INC.'s 10-K filed 2012-02-29, accession 000119312512088296, period December 31, 2011, under Item 1. Business.; characters 23568 to 24055; re-found.

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To support its camera products, the Electronics Division also offers accessories including monitors, lenses and camera test equipment. Customers Semiconductor Equipment Our customers include semiconductor manufacturers and subcontractors that perform test services for semiconductor manufacturers. Repeat sales to existing customers represent a significant portion of our sales. We rely on a limited number of customers for a substantial percentage of our net sales. During the last three years, customers from our semiconductor equipment segment that have comprised 10% or greater of our consolidated net sales are as follows: 2011 2010 2009 Intel 36% 26% 30% Texas Instruments 11% 14% * Advanced Micro Devices * * 11% * Less than 10% of net sales 4 Table of Contents The loss of, or a significant reduction in, orders by these or other significant customers, including …

Advanced Micro Devices, Inc. names Google LLC as its end customer; State stale since 2022-02-03 (this filer's naming: stale); last named 2020-02-04; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

In March 2019, Google announced its new Stadia™ cloud gaming service using high-performance, custom AMD Radeon data center GPUs.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2020-02-04, accession 000000248820000008, period December 28, 2019, under ITEM 1. BUSINESS; characters 62030 to 62158; re-found.

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Our AMD Radeon Instinct™ family of GPU products are specifically designed to address growing demand for data center applications, including deep learning training and traditional high performance computing (HPC) workloads such as simulation where the compute capabilities of GPUs provide exceptional flexibility and performance. Combined with our open-source software, Radeon™ Open eCosystem (ROCm), our customers can deliver a differentiated acceleration platforms to address the next-generation of computing challenges while minimizing power and space needs in the data center. In March 2019, Google announced its new Stadia™ cloud gaming service using high-performance, custom AMD Radeon data center GPUs. In May 2019, the US Department of Energy announced the Frontier exascale A+A (AMD CPUs plus AMD GPUs) system with Oakridge National Labs (ORNL). In August 2019, Microsoft announced its new NVv4-series cloud offering of Azure Virtual Machines based on Radeon Instinct™ MI25 GPUs.

Advanced Micro Devices, Inc. names Graphics Properties Holdings, Inc. (SGI) as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2014-02-18 (this filer's naming: stale); last named 2012-02-24; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

On April 18, 2011, the parties entered into a confidential Settlement and License Agreement that resolved this litigation matter for an immaterial amount and that provides immunity under all Graphics Properties Holdings, Inc. (GPHI) patents

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2012-02-24, accession 000119312512075837, period December 31, 2011, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 422880 to 423120; re-found.

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The IBM Parties collected approximately $396 million from the Company’s distributor customers participating in the financing arrangement. The Company terminated the financing arrangement with the IBM Parties in February 2011and there were no outstanding invoices as of December 31, 2011. NOTE 11: Legal Settlements SGI (Graphics Properties Holdings, Inc.) v. ATI and AMD, Case No.06-C-0611 in the United States District Court for the Western District of Wisconsin On April 18, 2011, the parties entered into a confidential Settlement and License Agreement that resolved this litigation matter for an immaterial amount and that provides immunity under all Graphics Properties Holdings, Inc. (GPHI) patents for alleged infringement by AMD products, including components, software and designs. On April 26, 2011, the Court entered an order granting the parties’ agreed motion for dismissal and final judgment.

Advanced Micro Devices, Inc. names HP Inc. as its end customer; State stale since 2020-02-04 (this filer's naming: stale); last named 2018-02-27; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

Collectively, Sony Interactive Entertainment LLC, Microsoft Corporation and HP Inc. accounted for approximately 44% of our consolidated net revenue for the year ended December 30, 2017

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2018-02-27, accession 000000248818000042, period December 30, 2017, under ITEM 1A. RISK FACTORS; characters 92234 to 92418; re-found.

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Our inability to obtain needed financing or to generate sufficient cash from operations may require us to abandon projects or curtail planned investments in research and development or other strategic initiatives. If we curtail planned investments in research and development or abandon projects, our products may fail to remain competitive and our business would be materially adversely affected. The loss of a significant customer may have a material adverse effect on us. Collectively, Sony Interactive Entertainment LLC, Microsoft Corporation and HP Inc. accounted for approximately 44% of our consolidated net revenue for the year ended December 30, 2017. Sales to Sony and Microsoft consisted of products from our Enterprise, Embedded and Semi-Custom segment and sales to HP consisted primarily of products from our Computing and Graphics segment. We expect that a small number of customers will continue to account for a substantial part of revenue of our businesses in the future.

Advanced Micro Devices, Inc. names HP Inc. as its end customer; State current since 2025-12-10 (this filer's naming: stale); last named 2015-02-19; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

In 2014, Hewlett-Packard Company, Microsoft Corporation and Sony Corporation each accounted for more than 13% of our consolidated net revenues.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2015-02-19, accession 000119312515054362, period December 27, 2014, under ITEM 1. BUSINESS; characters 50179 to 50322; re-found.

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We work closely with our customers to create differentiated products that leverage our CPU, GPU and APU technology. In some cases, customers of our semi-custom products pay us non-recurring engineering fees for design and development services and a purchase price for the resulting semi-custom products. Collectively, our top five customers accounted for approximately 61% of our net revenue during the year ended 2014. In 2014, Hewlett-Packard Company, Microsoft Corporation and Sony Corporation each accounted for more than 13% of our consolidated net revenues. Sales to Hewlett-Packard consisted primarily of products from our Computing and Graphics segment. Sales to Microsoft and Sony consisted primarily of products from our Enterprise, Embedded and Semi-Custom segment. Five customers, including Hewlett-Packard, accounted for approximately 54% of the net revenue attributable to our Computing and Graphics segment.

Advanced Micro Devices, Inc. names Microsoft Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2021-01-29 (this filer's naming: stale); last named 2019-02-08; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

Historically we have leveraged our core graphics processing technology into the game console market by licensing our graphic technology in game consoles such as the Microsoft ® Xbox 360™ and Nintendo Wii and Wii U.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2019-02-08, accession 000000248819000011, period December 29, 2018, under ITEM 1. BUSINESS; characters 47769 to 47983; re-found.

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The AMD EPYC Embedded 3000 brings the power of “Zen” to a variety of new markets including networking, storage, and edge computing devices. AMD Ryzen Embedded V1000 targets medical imaging, industrial systems, digital gaming and thin clients. Semi-Custom . Our semi-custom products are tailored, high-performance, customer-specific solutions based on AMD’s CPU, GPU and multi-media technologies. We work closely together with our customers to define solutions to precisely match the requirements of the device or application. Historically we have leveraged our core graphics processing technology into the game console market by licensing our graphic technology in game consoles such as the Microsoft ® Xbox 360™ and Nintendo Wii and Wii U. We developed the semi-custom SoC products that power the current generation Sony PlayStation® 4 and PlayStation ® 4 Pro and Microsoft ® Xbox One™ and Xbox One S™ and Xbox One X™ game consoles. Marketing and Sales We sell our products through our direct sales force and through independent distributors and sales representatives in both domestic and international markets.

Advanced Micro Devices, Inc. names Monterey Research as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2025-02-05 (this filer's naming: stale); last named 2023-02-27; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

the Company entered into an agreement which will provide the Company a license to the Monterey Research patents.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2023-02-27, accession 000000248823000047, period December 31, 2022, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 374841 to 374953; re-found.

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On August 12, 2021, Monterey filed two patent infringement complaints in the United States District Court for the Western District of Texas. In the first complaint, Monterey alleges that the Company infringes two patents (8,694,776 and 9,767,303) related to memory controllers, three patents (8,572,297, 7,609,799, and 7,899,145) related to circuit designs, and one patent (6,979,640) related to semiconductor processing. In the second complaint, Monterey alleges that the Company infringes one patent (6,680,516) related to semiconductor processing. On March 31, 2022, the Company entered into an agreement which will provide the Company a license to the Monterey Research patents. The agreement did not have a material adverse effect on the Company’s financial condition, cash flows, or results of operation. Analog Devices Litigation On December 5, 2019, Analog Devices, Inc. (ADI) filed a lawsuit against Xilinx alleging infringement of eight patents related to switching circuits, comparators, analog to digital convertors, signal conditioners, and switched capacitors.

Advanced Micro Devices, Inc. names Nintendo as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2021-01-29 (this filer's naming: stale); last named 2019-02-08; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

Historically we have leveraged our core graphics processing technology into the game console market by licensing our graphic technology in game consoles such as the Microsoft ® Xbox 360™ and Nintendo Wii and Wii U.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2019-02-08, accession 000000248819000011, period December 29, 2018, under ITEM 1. BUSINESS; characters 47769 to 47983; re-found.

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Rambus, Inc. names Advanced Micro Devices, Inc. as its licence customer (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2014-02-21 (this filer's naming: stale); last named 2012-02-24; not named in Rambus, Inc.'s 2026-02-18 filing as read.

For the year ended December 31, 2009, revenue from AMD, Fujitsu, NEC, Panasonic and Toshiba, each accounted for 10% or more of our total revenue.

From RAMBUS INC.'s 10-K filed 2012-02-24, accession 000104746912001391, period December 31, 2011, under Item 1A. Risk Factors; characters 62631 to 62776; re-found.

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We have a high degree of revenue concentration. Our top five licensees represented approximately 66%, 85% and 77% of our revenues for the years ended December 31, 2011, 2010 and 2009, respectively. For the years ended December 31, 2011, revenues from Elpida, NVIDIA and Samsung, each accounted for 10% or more of our revenue. For the year ended December 31, 2010, revenue from Elpida and Samsung, each accounted for 10% or more of our total revenue. For the year ended December 31, 2009, revenue from AMD, Fujitsu, NEC, Panasonic and Toshiba, each accounted for 10% or more of our total revenue. As a result of our settlement with Samsung in January 2010, Samsung accounted for a significant portion of our ongoing licensing revenue since 2010 as reflected above. We expect to continue to experience significant revenue concentration for the foreseeable future.

Advanced Micro Devices, Inc. names Samsung Electronics Co., Ltd. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2015-02-19 (this filer's naming: stale); last named 2013-02-21; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

Samsung granted us, and we granted to Samsung, non-exclusive, royalty-free licenses to all patents and patent applications for ten years after the effective date of the Agreement to make, have made, use, sell, offer to sell, import and otherwise dispose of certain semiconductor- and electronic-related products anywhere in the world.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2013-02-21, accession 000119312513069422, period December 29, 2012, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 218528 to 218862; re-found.

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Pursuant to this agreement, all claims between the parties were dismissed with prejudice and Samsung agreed to pay us $283 million less any withholding taxes. We received the first payment of $119 million (which represents $143 million less withholding taxes) in December 2010. The remaining amount of $117 million (which represents $140 million less withholding taxes) was paid in two equal installments in May 2011 and in November 2011. In addition, pursuant to the settlement agreement, Samsung granted us, and we granted to Samsung, non-exclusive, royalty-free licenses to all patents and patent applications for ten years after the effective date of the Agreement to make, have made, use, sell, offer to sell, import and otherwise dispose of certain semiconductor- and electronic-related products anywhere in the world. This settlement encompassed all patent litigation and disputes between the parties. At the time we entered into the Agreement, we did not have any future obligations that we were required to perform in order to earn this settlement payment. Accordingly, we recognized the entire settlement amount in our operating results for the fourth quarter of 2010.

Advanced Micro Devices, Inc. names Samsung Electronics Co., Ltd. as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2015-02-19 (this filer's naming: stale); last named 2013-02-21; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

Samsung granted us, and we granted to Samsung, non-exclusive, royalty-free licenses to all patents and patent applications for ten years after the effective date of the Agreement to make, have made, use, sell, offer to sell, import and otherwise dispose of certain semiconductor- and electronic-related products anywhere in the world.

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Advanced Micro Devices, Inc. names Sony, Microsoft and HP Inc. (combined) as its end customer; State stale since 2020-02-04 (this filer's naming: stale); last named 2018-02-27; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

Collectively, Sony Interactive Entertainment LLC, Microsoft Corporation and HP Inc. accounted for approximately 44% of our consolidated net revenue for the year ended December 30, 2017

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2018-02-27, accession 000000248818000042, period December 30, 2017, under ITEM 1A. RISK FACTORS; characters 92234 to 92418; re-found.

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Advanced Micro Devices, Inc. names US Department of Energy / Oak Ridge National Laboratory as its government customer; State stale since 2022-02-03 (this filer's naming: stale); last named 2020-02-04; not named in Advanced Micro Devices, Inc.'s 2026-02-04 filing as read.

In May 2019, the US Department of Energy announced the Frontier exascale A+A (AMD CPUs plus AMD GPUs) system with Oakridge National Labs (ORNL).

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2020-02-04, accession 000000248820000008, period December 28, 2019, under ITEM 1. BUSINESS; characters 62159 to 62303; re-found.

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Combined with our open-source software, Radeon™ Open eCosystem (ROCm), our customers can deliver a differentiated acceleration platforms to address the next-generation of computing challenges while minimizing power and space needs in the data center. In March 2019, Google announced its new Stadia™ cloud gaming service using high-performance, custom AMD Radeon data center GPUs. In May 2019, the US Department of Energy announced the Frontier exascale A+A (AMD CPUs plus AMD GPUs) system with Oakridge National Labs (ORNL). In August 2019, Microsoft announced its new NVv4-series cloud offering of Azure Virtual Machines based on Radeon Instinct™ MI25 GPUs. And in November 2019, we released ROCm 3.0, marking a major milestone in the path to Exascale class systems and platforms. Enterprise, Embedded and Semi-Custom The Enterprise, Embedded and Semi-Custom Markets Server.

Amkor Technology, Inc. (AMKR): current 5, stale 37

current (5)

Amkor Technology, Inc. names Apple Inc. as its end customer; State current since 2026-02-20 (this filer's naming: current); last named 2026-02-20.

Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 1. Business; characters 92238 to 92372; re-found.

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Broadcom Inc. names Amkor Technology, Inc. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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Cirrus Logic, Inc. names Amkor Technology, Inc. as its assembly and test provider; State current since 2026-05-21 (this filer's naming: current); last named 2026-05-21.

The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.

From CIRRUS LOGIC, INC.'s 10-K filed 2026-05-21, accession 000077240626000018, period March 28, 2026, under ITEM 1. Business; characters 37310 to 37525; re-found.

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Amkor Technology, Inc. names QUALCOMM INC as its end customer; State current since 2026-02-20 (this filer's naming: current); last named 2026-02-20.

Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 1. Business; characters 92238 to 92372; re-found.

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QUALCOMM INC names Amkor Technology, Inc. as its assembly and test provider; State current since 2026-02-20 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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stale (37)

Amkor Technology, Inc. names Adeia Inc. as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2019-02-22 (this filer's naming: stale); last named 2017-02-24; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

In January 2015, we settled our patent license litigation with Tessera.

From Amkor Technology, Inc.'s 10-K filed 2017-02-24, accession 000104712717000011, period December 31, 2016, under Item 7. Management’s Discussion and Analysis of Financial Condition and Results of Operations; characters 170837 to 170908; re-found.

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We have never paid a dividend to our stockholders, and we do not have any present plans for doing so. From time to time, Amkor Technology, Inc. also guarantees certain debt of our subsidiaries. Our subsidiary in Korea maintains an unfunded severance plan that covers certain employees that were employed prior to August 1, 2015. As of December 31, 2016 , the severance liability was $136.2 million . For service periods subsequent to August 1, 2015, employees participate in either a defined benefit pension plan or a defined contribution pension plan. In January 2015, we settled our patent license litigation with Tessera. Under the terms of the settlement, Amkor agreed to pay Tessera a total of $155.0 million in 16 equal quarterly recurring payments commencing in the first quarter of 2015 and continuing through the fourth quarter of 2018. As of December 31, 2016 , we owe $77.5 million to Tessera. In April 2016, our Kumamoto factory was damaged by the earthquakes in Japan.

Amkor Technology, Inc. names Adeia Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2017-02-24 (this filer's naming: stale); last named 2015-02-19; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

In January 2015, the parties entered into a settlement agreement to end all pending proceedings related to the dispute.

From Amkor Technology, Inc.'s 10-K filed 2015-02-19, accession 000104712715000010, period December 31, 2014, under Item 8. Financial Statements and Supplementary Data; characters 283611 to 283730; re-found.

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In the second quarter of 2014, the arbitration panel awarded Tessera $113 million plus interest for these past royalties due under the License Agreement. In October 2014, the Superior Court for San Francisco County formally confirmed the arbitration panel's award and entered judgment against Amkor for $128 million plus post-judgment interest at 10% per annum. In November 2014, the California First District Court of Appeal affirmed the Superior Court’s ruling. In January 2015, the parties entered into a settlement agreement to end all pending proceedings related to the dispute. Under the terms of the settlement, Amkor agreed to pay Tessera a total of $155.0 million in 16 equal quarterly recurring payments commencing in the first quarter of 2015, and continuing through the fourth quarter of 2018, and the parties agreed to a mutual release and dismissal of all claims relating to their pending litigation and arbitration proceedings, including the previously awarded …

Amkor Technology, Inc. names Altera Corporation as its end customer; State stale since 2017-02-24 (this filer's naming: stale); last named 2015-02-19; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our fabless customers include: Altera Corporation; Avago Technologies; Broadcom Corporation and Qualcomm Incorporated.

From Amkor Technology, Inc.'s 10-K filed 2015-02-19, accession 000104712715000010, period December 31, 2014, under Item 1. Business; characters 11254 to 11372; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Micron Technology, Inc.; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Altera Corporation; Avago Technologies; Broadcom Corporation and Qualcomm Incorporated. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Amkor Technology, Inc. names Analog Devices, Inc. as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our customers include, among others: Altera Corporation; Analog Devices, Inc.; Broadcom Corporation; Intel Corporation; LSI Corporation; Qualcomm Incorporated; Sony Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 9340 to 9598; re-found.

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The test services we offer include probe testing and final testing. Our packaging services are designed to meet application and chip specific requirements including the type of interconnect technology employed; size; thickness and electrical, mechanical and thermal performance. We are able to provide turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. Our customers include, among others: Altera Corporation; Analog Devices, Inc.; Broadcom Corporation; Intel Corporation; LSI Corporation; Qualcomm Incorporated; Sony Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. The outsourced semiconductor packaging and test market is very competitive. We also compete with the internal semiconductor packaging and test capabilities of many of our customers. 2 Table of Contents AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Amkor Technology, Inc. names Atmel Corporation as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation Atmel Corporation

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45667; re-found.

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SEASONALITY Our sales have generally been higher in the second half of the year than in the first half due to the effect of consumer buying patterns in the U.S., Europe and Asia. In addition, semiconductor companies generally reduce their production during the holidays at the end of December which results in a decrease in units for packaging and test services during the first quarter. 12 Table of Contents CUSTOMERS As of December 31, 2012 , we had approximately 200 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc. RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) …

Amkor Technology, Inc. names Broadcom Corporation as its end customer; State stale since 2017-02-24 (this filer's naming: stale); last named 2015-02-19; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our fabless customers include: Altera Corporation; Avago Technologies; Broadcom Corporation and Qualcomm Incorporated.

From Amkor Technology, Inc.'s 10-K filed 2015-02-19, accession 000104712715000010, period December 31, 2014, under Item 1. Business; characters 11254 to 11372; re-found.

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Amkor Technology, Inc. names Broadcom Inc. as its end customer; State current since 2025-12-18 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11517 to 11619; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Amkor Technology, Inc. names Cypress Semiconductor Technology Ltd. as its end customer; State stale since 2014-02-28 (this filer's naming: stale); last named 2012-02-24; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc. Nordic Semiconductor ASA Atmel Corporation ON Semiconductor Corporation Avago Technologies Limited Panasonic Corporation Broadcom Corporation Qualcomm Incorporated Cypress Semiconductor Corporation

From Amkor Technology, Inc.'s 10-K filed 2012-02-24, accession 000144530512000428, period December 31, 2011, under Item 1. Business; characters 42775 to 43108; re-found.

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Our business is tied to market conditions in the semiconductor industry which is highly cyclical. The semiconductor industry has experienced significant and sometimes prolonged cyclical downturns in the past. We cannot predict the timing, strength or duration of any economic slowdown or subsequent economic recovery. CUSTOMERS As of December 31, 2011 , we had approximately 225 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc. Nordic Semiconductor ASA Atmel Corporation ON Semiconductor Corporation Avago Technologies Limited Panasonic Corporation Broadcom Corporation Qualcomm Incorporated Cypress Semiconductor Corporation Renesas Electronics Corporation Entropic Communications, Inc. Samsung Electronics Co., Ltd. Freescale Semiconductor, Inc. Sony Corporation Global Unichip Corp. ST Microelectronics N.V. Infineon Technologies AG Texas Instruments Incorporated International Business Machines Corporation (“IBM”) Toshiba Corporation LSI Corporation Xilinx, Inc. Maxim Integrated Products, Inc. Our top 25 customers …

Amkor Technology, Inc. names Entropic Communications, Inc. as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45772; re-found.

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Amkor Technology, Inc. names Freescale Semiconductor, Inc. as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc. RF Micro Devices, Inc. Freescale Semiconductor, Ltd.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45826; re-found.

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Amkor Technology, Inc. names Global Unichip Corporation as its end customer; State stale since 2014-02-28 (this filer's naming: stale); last named 2012-02-24; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Global Unichip Corp. ST Microelectronics N.V. Infineon Technologies AG Texas Instruments Incorporated International Business Machines Corporation (“IBM”) Toshiba Corporation LSI Corporation Xilinx, Inc. Maxim Integrated Products, Inc. Our top 25 customers accounted for 83.1% of our net sales in

From Amkor Technology, Inc.'s 10-K filed 2012-02-24, accession 000144530512000428, period December 31, 2011, under Item 1. Business; characters 43249 to 43546; re-found.

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The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc. Nordic Semiconductor ASA Atmel Corporation ON Semiconductor Corporation Avago Technologies Limited Panasonic Corporation Broadcom Corporation Qualcomm Incorporated Cypress Semiconductor Corporation Renesas Electronics Corporation Entropic Communications, Inc. Samsung Electronics Co., Ltd. Freescale Semiconductor, Inc. Sony Corporation Global Unichip Corp. ST Microelectronics N.V. Infineon Technologies AG Texas Instruments Incorporated International Business Machines Corporation (“IBM”) Toshiba Corporation LSI Corporation Xilinx, Inc. Maxim Integrated Products, Inc. Our top 25 customers accounted for 83.1% of our net sales in 2011 , and our ten largest customers accounted for approximately 61.0% , 54.2% and 53.4% of our net sales for the years ended December 31, 2011 , 2010 and 2009 , respectively. Qualcomm Incorporated and Texas Instruments Incorporated each accounted for more than 10% of our consolidated net sales in 2011. No customer accounted for more than 10% of our consolidated net sales in 2010.

Amkor Technology, Inc. names GLOBALFOUNDRIES Inc. as its contract-manufacturer customer; State stale since 2020-02-19 (this filer's naming: stale); last named 2018-02-23; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited.

From Amkor Technology, Inc.'s 10-K filed 2018-02-23, accession 000104712718000009, period December 31, 2017, under Item 1. Business; characters 11553 to 11669; re-found.

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Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited, Qualcomm Incorporated and Socionext Inc. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”). You may read and copy any document we file at the SEC’s Public Reference Room, 100 F Street, NE, Washington, D.C. 20549. Please call the SEC at 1-800-SEC-0330 for information on the Public Reference Room.

Amkor Technology, Inc. names Infineon Technologies AG as its end customer; State stale since 2018-02-23 (this filer's naming: stale); last named 2016-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our IDM customers include: Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2016-02-22, accession 000104712716000049, period December 31, 2015, under Item 1. Business; characters 11194 to 11404; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Avago Technologies; Broadcom Corporation and Qualcomm Incorporated. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. J-Devices Corporation On December 30, 2015 , we increased our ownership in J-Devices Corporation from 65.7% to 100% through the exercise of existing options.

Amkor Technology, Inc. names Intel Corporation as its end customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

Amkor Technology, Inc. names International Business Machines Corporation as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc. Our top 25 customers accounted for 83.9% of our net sales in

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 46013 to 46263; re-found.

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The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc. RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc. Our top 25 customers accounted for 83.9% of our net sales in 2012 , and our ten largest customers accounted for approximately 62.2% , 61.0% and 54.2% and of our net sales for the years ended December 31, 2012 , 2011 and 2010 , respectively. Qualcomm Incorporated accounted for more than 10% of our net sales in 2012. Qualcomm Incorporated and Texas Instruments Incorporated each accounted for more than 10% of our consolidated net sales in 2011.

Kulicke and Soffa Industries, Inc. names Amkor Technology, Inc. as its end customer; State stale since 2021-11-18 (this filer's naming: stale); last named 2019-11-15; not named in Kulicke and Soffa Industries, Inc.'s 2025-11-20 filing as read.

4 ASE Industrial Holding (3) 4 Micron Technology Incorporated 4 Amkor Technology Inc.

From KULICKE AND SOFFA INDUSTRIES, INC.'s 10-K filed 2019-11-15, accession 000005697819000130, period September 28, 2019, under Item 1. BUSINESS; characters 45996 to 46081; re-found.

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There was no customer with sales representing more than 10% of net revenue in fiscal 2019. The following table reflects our top ten customers, based on net revenue, for each of the last three fiscal years: Fiscal 2019 Fiscal 2018 Fiscal 2017 1 Super Power International Ltd (2) 1 Haoseng Industrial Co., Ltd. (1)(2) 1 Haoseng Industrial Co., Ltd. (1)(2) 2 Micron Technology Incorporated 2 ASE Industrial Holding (3) 2 Siliconware Precision Industries Ltd. (3) 3 First Technology China, Ltd. (2) 3 Super Power International Ltd (2) 3 Advanced Semiconductor Engineering (3) 4 ASE Industrial Holding (3) 4 Micron Technology Incorporated 4 Amkor Technology Inc. 5 Xinye Electronics. Co (2) 5 First Technology China, Ltd. (2) 5 Super Power International Ltd (2) 6 Forehope Electronic Co., Ltd 6 Tesla Motors 6 Samsung 7 Infineon Technologies 7 Samsung 7 First Technology China, Ltd. (2) 8 ST Microelectronics 8 Texas Instruments, Inc. 8 LG Innotek Co. Ltd. 9 On Semiconductor 9 Xinye Electronics.

Amkor Technology, Inc. names LSI Corporation as its end customer; State stale since 2016-02-22 (this filer's naming: stale); last named 2014-02-28; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our fabless customers include: Altera Corporation; Broadcom Corporation; LSI Corporation and Qualcomm Incorporated.

From Amkor Technology, Inc.'s 10-K filed 2014-02-28, accession 000104712714000006, period December 31, 2013, under Item 1. Business; characters 10995 to 11110; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Micron Technology, Inc.; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Altera Corporation; Broadcom Corporation; LSI Corporation and Qualcomm Incorporated. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Amkor Technology, Inc. names Maxim Integrated Products, Inc. as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc. Our top 25 customers accounted for 83.9% of our net sales in

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 46132 to 46263; re-found.

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… 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc. RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc. Our top 25 customers accounted for 83.9% of our net sales in 2012 , and our ten largest customers accounted for approximately 62.2% , 61.0% and 54.2% and of our net sales for the years ended December 31, 2012 , 2011 and 2010 , respectively. Qualcomm Incorporated accounted for more than 10% of our net sales in 2012. Qualcomm Incorporated and Texas Instruments Incorporated each accounted for more than 10% of our consolidated net sales in 2011.

Amkor Technology, Inc. names Micron Technology, Inc. as its end customer; State stale since 2018-02-23 (this filer's naming: stale); last named 2016-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our IDM customers include: Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2016-02-22, accession 000104712716000049, period December 31, 2015, under Item 1. Business; characters 11194 to 11404; re-found.

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Amkor Technology, Inc. names Nordic Semiconductor ASA as its end customer; State stale since 2014-02-28 (this filer's naming: stale); last named 2012-02-24; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc. Nordic Semiconductor ASA

From Amkor Technology, Inc.'s 10-K filed 2012-02-24, accession 000144530512000428, period December 31, 2011, under Item 1. Business; characters 42775 to 42935; re-found.

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NVIDIA Corporation names Amkor Technology, Inc. as its assembly and test provider; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 59750 to 60115; re-found.

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We have placed non-cancellable inventory orders for certain product components in advance of our historical lead times, paid premiums and provided deposits to secure future supply and capacity and may need to continue to do so in the future. We have expanded our supplier relationships to build redundancy and resilience in our operations. We utilize suppliers, such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Electronics Co. Ltd, to produce our semiconductor wafers. We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products and platforms. We use contract manufacturers such as Flex Ltd., Jabil Inc., and Universal Scientific Industrial Co., Ltd., to manufacture our standard and custom adapter card products and switch systems, and Fabrinet to manufacture our networking cables.

Amkor Technology, Inc. names ON Semiconductor Corporation as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45605; re-found.

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ON Semiconductor Corporation names Amkor Technology, Inc. as its assembly and test provider; State stale since 2015-02-19 (this filer's naming: stale); last named 2018-02-21; not named in ON Semiconductor Corporation's 2026-02-09 filing as read.

These contract manufacturers, including Amkor, ASE, Kingpak, SMIC, TPSCo and TSMC, collectively accounted for approximately 36%, 36% and 39% of our manufacturing costs in 2017, 2016 and 2015, respectively.

From ON SEMICONDUCTOR CORPORATION's 10-K filed 2018-02-21, accession 000119312518051397, period December 31, 2017, under Item 1. Business; characters 40372 to 40577; re-found.

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forecast product needs and commit to purchase services consistent with these forecasts. In some cases, longer-term commitments are required in the early stages of the relationship. These contract manufacturers, including Amkor, ASE, Kingpak, SMIC, TPSCo and TSMC, collectively accounted for approximately 36%, 36% and 39% of our manufacturing costs in 2017, 2016 and 2015, respectively. For information regarding risks associated with our foreign operations, see “Risk Factors - Trends, Risks and Uncertainties Related to Our Business” included elsewhere in this Form 10-K.

ON Semiconductor Corporation names Amkor Technology, Inc. as its end customer; State stale since 2014-02-21 (this filer's naming: stale); last named 2012-02-22; not named in ON Semiconductor Corporation's 2026-02-09 filing as read.

Honeywell Inc. Amkor Technology Inc Delta Elec Int’l Ltd

From ON SEMICONDUCTOR CORPORATION's 10-K filed 2012-02-22, accession 000119312512072371, period December 31, 2011, under Item 1. Business; characters 41586 to 41654; re-found.

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… Emerson Electric Co Echostar Delphi Flir Systems Huawei Tech Co., Ltd. Ericson ITT Corporation St. Jude Medical Schneider Electric Xerox Corp CAS-Former Motorola Automotive Emerson Electric Co Motorola Nokia Siemens Networks Stellar Microelectronics Medtronic Dell Computer Scientific Atlanta Visteon Siemens Industrial ZTE Hong Kong Ltd Nortel Networks Sofradir Cardic Pacemakers Inc LG Electronics Sony Corp Bosch GMBH Honeywell Inc. Amkor Technology Inc Delta Elec Int’l Ltd Honeywell Inc ELA Medical Samsung Elec Co. Philips Valeo Tyco International Kyocera Foxconn L-3 Communications Intricon Corp Surface Mount Technology Whirlpool Corp TRW Inc Belimo Automation AG V.Tech Adtran Inc British Aerospace Philips Lite-On Electronics, Inc AP …

Amkor Technology, Inc. names Panasonic Corporation as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45649; re-found.

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Amkor Technology, Inc. names Renesas Electronics Corporation as its end customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

Amkor Technology, Inc. names RF Micro Devices, Inc. as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc. RF Micro Devices, Inc.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45796; re-found.

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Amkor Technology, Inc. names Samsung Electronics Co., Ltd. as its contract-manufacturer customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11620 to 11751; re-found.

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Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Amkor Technology, Inc. names Socionext Inc. as its end customer; State stale since 2020-02-19 (this filer's naming: stale); last named 2018-02-23; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our fabless customers include: Broadcom Limited, Qualcomm Incorporated and Socionext Inc.

From Amkor Technology, Inc.'s 10-K filed 2018-02-23, accession 000104712718000009, period December 31, 2017, under Item 1. Business; characters 11463 to 11552; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited, Qualcomm Incorporated and Socionext Inc. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Amkor Technology, Inc. names Sony Group Corp as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our customers include, among others: Altera Corporation; Analog Devices, Inc.; Broadcom Corporation; Intel Corporation; LSI Corporation; Qualcomm Incorporated; Sony Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 9340 to 9598; re-found.

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Amkor Technology, Inc. names STMicroelectronics N.V. as its end customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

Amkor Technology, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its contract-manufacturer customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11620 to 11751; re-found.

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Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Amkor Technology, Inc. names Texas Instruments Incorporated as its end customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

Amkor Technology, Inc. names Toshiba Corporation as its end customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Toshiba accounted for more than 10% of our net sales in 2018 .

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 54449 to 54511; re-found.

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In addition, semiconductor companies generally reduce their production during the holidays at the end of December which generally results in a decrease in packaging and test services during the first quarter. General economic conditions, changes in our supply chain or overall demand in any of our end-markets can impact our seasonality. CUSTOMERS In 2018 , we had approximately 275 customers, including many of the largest semiconductor companies in the world. Our ten largest customers accounted for 62% of our net sales in 2018 . Toshiba accounted for more than 10% of our net sales in 2018 . MATERIALS AND EQUIPMENT Materials Our materials are used primarily for packaging activities. Our packaging operations depend upon obtaining adequate supplies of materials on a timely basis. The principal materials used in our packaging process are leadframes, laminate substrates, gold and copper wire, mold compound, epoxy, tubes and trays.

Amkor Technology, Inc. names Toshiba Corporation as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2018-02-23 (this filer's naming: stale); last named 2016-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

We were also granted a non-exclusive, royalty bearing license by Toshiba to certain intellectual property rights for providing packaging and test services for power discrete and certain other semiconductor products.

From Amkor Technology, Inc.'s 10-K filed 2016-02-22, accession 000104712716000049, period December 31, 2015, under Item 8. Financial Statements and Supplementary Data; characters 247648 to 247863; re-found.

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Bhd. On July 31, 2013, we completed the purchase of 100% of the shares of Toshiba Electronics Malaysia Sdn. Bhd., Toshiba’s power discrete semiconductor packaging and test operation in Malaysia, and subsequently changed the name of the entity to Amkor Technology Malaysia Sdn. Bhd. The total price for the shares was $61.2 million , based on the net asset value at closing. We paid $42.4 million in cash at closing and paid the remaining $18.8 million in March 2014. We were also granted a non-exclusive, royalty bearing license by Toshiba to certain intellectual property rights for providing packaging and test services for power discrete and certain other semiconductor products. The license has a royalty cap of ¥1.5 billion (approximately $12 million ). Under the purchase method of accounting, we allocated the purchase price to the assets acquired and liabilities assumed based on their estimated fair values on the date of acquisition. We did not record any goodwill as a result of the acquisition.

Amkor Technology, Inc. names Toshiba Memory Corporation as its end customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-22; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11517 to 11619; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Amkor Technology, Inc. names Xilinx, Inc. as its end customer; State stale since 2015-02-19 (this filer's naming: stale); last named 2013-03-08; not named in Amkor Technology, Inc.'s 2026-02-20 filing as read.

Xilinx, Inc. Micron Technology, Inc. Our top 25 customers accounted for 83.9% of our net sales in

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 46164 to 46263; re-found.

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… Corporation ON Semiconductor Corporation Analog Devices, Inc. Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc. RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc. Our top 25 customers accounted for 83.9% of our net sales in 2012 , and our ten largest customers accounted for approximately 62.2% , 61.0% and 54.2% and of our net sales for the years ended December 31, 2012 , 2011 and 2010 , respectively. Qualcomm Incorporated accounted for more than 10% of our net sales in 2012. Qualcomm Incorporated and Texas Instruments Incorporated each accounted for more than 10% of our consolidated net sales in 2011.

ASML Holding N.V. (ASML): current 4, stale 12

current (4)

ASML Holding N.V. names Carl Zeiss SMT GmbH as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

Carl Zeiss SMT GmbH is our single supplier, and we are their single customer, of optical columns for lithography systems.

From ASML HOLDING NV's 20-F filed 2026-02-25, accession 000162828026011378, period December 31, 2025, under Item 6 Any; characters 1277561 to 1277682; re-found.

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Maturities are one year or less. No held to maturity securities were sold before expiration date. Assets and liabilities measured at fair value on a non-recurring basis In 2024 and 2025 , we ha d no significant fair value measurements on a non-recurring basis from regular business activities. For impairment charges regarding goodwill and other intangible assets, reference is made to Note 11 . Goodwill and 12 . Intangible assets, net respectively. 26 . Related parties and variable interest entities Carl Zeiss SMT GmbH is our single supplier, and we are their single customer, of optical columns for lithography systems. Carl Zeiss SMT GmbH is capable of developing and producing these items only in limited numbers and only through the use of manufacturing and testing facilities in Oberkochen and Wetzlar, Germany.

systems were assembled and installed at an Intel plant near Hillsboro, Oregon (US)

From ASML HOLDING NV's 20-F filed 2025-03-05, accession 000093796625000009, period December 31, 2024; characters 88179 to 88261; re-found.

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Intel Corporation names ASML Holding N.V. as its supplier; State current since 2025-03-05 (this filer's naming: current); last named 2026-01-23.

Sourcing in the filing's own words: sole supplier.

For example, ASML Holding N.V. (ASML) is currently the sole supplier of EUV lithography tools that we are deploying in our Intel 4, Intel 3, Intel 18A and planned future leading-edge manufacturing process nodes.

From INTEL CORPORATION's 10-K filed 2026-01-23, accession 000005086326000011, period December 27, 2025; characters 287602 to 287813; re-found.

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ASML Holding N.V. names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

In November 2025, we were honored to receive the TSMC Supplier ‘Excellence in Green Manufacturing’ Award

From ASML HOLDING NV's 20-F filed 2026-02-25, accession 000162828026011378, period December 31, 2025, under Item 6 Any; characters 677109 to 677213; re-found.

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stale (12)

ASML Holding N.V. names Berliner Glas Group as its supplier; State stale since 2023-02-15 (this filer's naming: stale); last named 2021-02-10; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

Prior to the acquisition, supply and investment arrangements existed between Berliner Glas and ASML.

From ASML HOLDING NV's 20-F filed 2021-02-10, accession 000093796621000007, period December 31, 2020; characters 617803 to 617903; re-found.

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The Accrued and other liabilities include a net pension liability of € 14.8 million for a defined benefit pension plan in Switzerland. For details see Note 19 Employee benefits. Prior to the acquisition, supply and investment arrangements existed between Berliner Glas and ASML. These pre-existing relationships were effectively settled as a result of the acquisition. We determined that the supply arrangements as well as the investment arrangement were at current market terms and therefore no gain or loss was recognized. In addition, the consideration has not been adjusted for the settlement of the pre-existing relationships between ASML and Berliner Glas.

ASML Holding N.V. names Carl Zeiss SMT as its supplier; State stale since 2025-03-05 (this filer's naming: stale); last named 2023-02-15; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

The number of lithography systems we are able to produce may be limited by the production capacity of one of our key suppliers, Carl Zeiss SMT GmbH, which is our sole supplier of lenses, mirrors, illuminators, collectors and other critical optical components (which we refer to as optics).

From ASML HOLDING NV's 20-F filed 2023-02-15, accession 000093796623000014, period December 31, 2022; characters 229640 to 229929; re-found.

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For example, certain of our suppliers experienced disruptions in their operations as a result of chip and material shortages. A prolonged inability to obtain adequate deliveries of components or subassemblies, or any other circumstance that requires us to seek alternative sources of supply, could significantly hinder our ability to deliver our products in a timely manner, which could damage relationships with our customers and materially impact our business. The number of lithography systems we are able to produce may be limited by the production capacity of one of our key suppliers, Carl Zeiss SMT GmbH, which is our sole supplier of lenses, mirrors, illuminators, collectors and other critical optical components (which we refer to as optics). We have an exclusive arrangement with Carl Zeiss SMT GmbH, and if they are unable to maintain and increase production levels, we could be unable to fulfill orders, which could have a material impact on our business and damage relationships with our customers.

COHERENT CORP. names ASML Holding N.V. as its end customer; State stale since 2024-08-16 (this filer's naming: stale); last named 2022-08-29; not named in COHERENT CORP.'s 2025-08-15 filing as read.

Manufacturers and developers of integrated-circuit capital equipment for the semiconductor capital equipment industry • ASML Holding NV • Carl Zeiss AG • KLA Corporation • Nikon Corporation

From II-VI INCORPORATED's 10-K filed 2022-08-29, accession 000082031822000019, period June 30, 2022, under Item 1. BUSINESS; characters 111110 to 111299; re-found.

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• Han’s Laser Technology Industry Group Co. Ltd. 17 Compound Semiconductors Business Unit: Our Customers Are: Representative Customers: Engineered Materials & Laser Optics OEM and system integrators of industrial, medical, personal comfort, and aerospace and defense laser systems; laser end users who require replacement optics for their existing laser systems • Bystronic Laser AG • Coherent, Inc. • TRUMPF GmbH + Co. KG Manufacturers and developers of integrated-circuit capital equipment for the semiconductor capital equipment industry • ASML Holding NV • Carl Zeiss AG • KLA Corporation • Nikon Corporation Primary mineral processors, refiners, and providers of specialized materials used in laser optics, photovoltaics, semiconductors, thermoelectric coolers, metallurgy, and industrial products • Aurubis AG Manufacturers of equipment and devices for aerospace, defense, and commercial markets • Lockheed Martin Corporation • Raytheon Technologies Corporation Laser Devices & Systems Manufacturers of …

ASML Holding N.V. names Cymer Inc. as its supplier; State stale since 2015-02-11 (this filer's naming: stale); last named 2013-02-13; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

In the fourth quarter of 2012, we announced the intended cash-and-stock acquisition of lithographic light source supplier Cymer.

From ASML HOLDING NV's 20-F filed 2013-02-13, accession 000119312513053249, period December 31, 2012, under Item 5 Operating and Financial Review and Prospects; characters 189528 to 189656; re-found.

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In addition we will ship our first NXE:3300B EUV tool in the second quarter targeting for a maximum of 11 potential shipments in 2013. For the first quarter of 2013, we expect net sales of about EUR 850 million, gross margin of about 38 percent, R&D costs of EUR 185 million, other income of EUR 16 million which consists of contributions from participants of the Customer Co-Investment Program and SG&A costs of EUR 63 million including EUR 6 million expenses related to the pending Cymer acquisition. ASML ANNUAL REPORT 2012 37 Table of Contents In the fourth quarter of 2012, we announced the intended cash-and-stock acquisition of lithographic light source supplier Cymer. As part of the regulatory review process, clearance has been granted by the U.S. Committee on Foreign Investment in the United States (CFIUS) and German anti-trust authorities.

Entegris, Inc. names ASML Holding N.V. as its end customer; State stale since 2016-02-29 (this filer's naming: stale); last named 2014-02-20; not named in Entegris, Inc.'s 2026-02-11 filing as read.

Our most significant customers based on sales in 2013 include leading device makers such as Micron Technology, Inc., Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corporation (UMC), leading OEM companies such as Applied Materials, Inc., ASML Holding N.V. Dainippon Screen Mfg. Co., Ltd. (DNS), Lam Research Corporation and Tokyo Electron Ltd. and leading wafer grower companies such as MEMC Electronic Materials, Inc., Shin-Etsu Chemical Co. Ltd., Siltronic AG and SUMCO Oregon Corp.

From Entegris, Inc.'s 10-K filed 2014-02-20, accession 000110130214000002, period December 31, 2013, under Item 1. Business.; characters 47884 to 48424; re-found.

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Our applications laboratories maintain process equipment that simulate customers’ applications and industry test standards and provide product evaluation, technical support and complaint resolution for our customers. OUR CUSTOMERS AND MARKETS Within the semiconductor market, our major customer groups include integrated circuit device manufacturers, OEMs that provide equipment to integrated circuit device manufacturers, gas and chemical manufacturing companies and manufacturers of high-precision electronics. 7 Table of Contents Our most significant customers based on sales in 2013 include leading device makers such as Micron Technology, Inc., Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corporation (UMC), leading OEM companies such as Applied Materials, Inc., ASML Holding N.V. Dainippon Screen Mfg. Co., Ltd. (DNS), Lam Research Corporation and Tokyo Electron Ltd. and leading wafer grower companies such as MEMC Electronic Materials, Inc., Shin-Etsu Chemical Co. Ltd., Siltronic AG and SUMCO Oregon Corp. We also sell our products to flat panel display OEMs, materials suppliers and end users. The major manufacturers for flat panel displays and flat panel display equipment are concentrated in Japan, Korea and other parts of Asia.

Lumentum Holdings Inc. names ASML Holding N.V. as its end customer; State stale since 2023-08-23 (this filer's naming: stale); last named 2021-08-31; not named in Lumentum Holdings Inc.'s 2025-08-19 filing as read.

Our Lasers customers include Amada, ASML Holding, Beckman Coulter, DISCO, Electro Scientific Industries (acquired by MKS Instruments in February 2019), Han’s Laser Technology, KLA-Tencor, Lasertec, Life Technologies, and NR Electric.

From Lumentum Holdings Inc.'s 10-K filed 2021-08-31, accession 000162828021017799, period July 3, 2021, under ITEM 1. BUSINESS; characters 88222 to 88455; re-found.

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Use of ultrafast lasers for micromachining applications is being driven primarily by the increasing use of consumer electronics and connected devices globally. Our portfolio of Lasers products includes components and subsystems used in a variety of OEM applications that range in output power from milliwatts to kilowatts and include ultraviolet, visible and infrared wavelengths. We support customer applications in the biotechnology, graphics and imaging, remote sensing, materials processing and other precision machining areas. Customers Our Lasers customers include Amada, ASML Holding, Beckman Coulter, DISCO, Electro Scientific Industries (acquired by MKS Instruments in February 2019), Han’s Laser Technology, KLA-Tencor, Lasertec, Life Technologies, and NR Electric. During fiscal 2021, 2020, and 2019, we did not have any single customer attributable to our Lasers segment that generated net revenue of 10% or more of our total net revenue for the applicable fiscal year.

ASML Holding N.V. names Nikon Corporation as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2022-02-09 (this filer's naming: stale); last named 2020-02-12; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

The terms include a payment to Nikon by ASML and Zeiss of a total of € 150.0 million and royalty payments of 0.8 % by ASML and Zeiss to Nikon, and by Nikon to ASML and Zeiss, over the sales of their respective immersion lithography systems for 10 years from date of the agreement.

From ASML HOLDING NV's 20-F filed 2020-02-12, accession 000093796620000011, period December 31, 2019; characters 598644 to 598924; re-found.

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Management determined that either a loss (or gain) was not probable and/or was not reasonably estimable and in 2019 , no losses or gains related to legal contingencies are charged to our Consolidated Statements of Operations ( 2018 : € 131.0 million and 2017 : € 0.0 million ). On January 23, 2019 , ASML entered into a binding MOU with Nikon and Carl Zeiss SMT relating to a comprehensive settlement of all pending disputes between Nikon, ASML and Zeiss. On February 18, 2019 , the parties executed the settlement and cross-license agreement contemplated by the MOU. The terms include a payment to Nikon by ASML and Zeiss of a total of € 150.0 million and royalty payments of 0.8 % by ASML and Zeiss to Nikon, and by Nikon to ASML and Zeiss, over the sales of their respective immersion lithography systems for 10 years from date of the agreement. As of December 31, 2018 we accrued an amount in the accrued and other liabilities of € 131.0 million representing ASML’s share of the € 150.0 million , which was paid during the first half of 2019 . See Note 14 Accrued and other liabilities .

ASML Holding N.V. names Nikon Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2022-02-09 (this filer's naming: stale); last named 2020-02-12; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

The terms include a payment to Nikon by ASML and Zeiss of a total of € 150.0 million and royalty payments of 0.8 % by ASML and Zeiss to Nikon, and by Nikon to ASML and Zeiss, over the sales of their respective immersion lithography systems for 10 years from date of the agreement.

From ASML HOLDING NV's 20-F filed 2020-02-12, accession 000093796620000011, period December 31, 2019; characters 598644 to 598924; re-found.

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ASML Holding N.V. names Prodrive Technologies as its supplier; State stale since 2021-02-10 (this filer's naming: stale); last named 2019-02-06; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

In December 2018, ASML was confronted with a risk in its supply chain when a major fire destroyed a large part of the production facility of Prodrive Technologies, an important supplier of ASML.

From ASML HOLDING NV's 20-F filed 2019-02-06, accession 000093796619000007, period December 31, 2018; characters 244497 to 244691; re-found.

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ASML INTEGRATED REPORT 2018 65 A considerable amount of attention was paid to a review of ASML’s risk landscape as well as the measures required to mitigate such risks. Part of a significant review of our risk-management approach were the assessment and mitigation of risks resulting from the aforementioned rapid growth of ASML and related operational and organizational challenges, as well as of risks related to ASML's supply chain, as part of which the SB reviewed ASML's supplier risk-management process. In December 2018, ASML was confronted with a risk in its supply chain when a major fire destroyed a large part of the production facility of Prodrive Technologies, an important supplier of ASML. As a result of having the right processes in place, the company was able to react quickly and could start working immediately with Prodrive to mitigate the impact of the fire. Nonetheless, the risks in the supply chain will remain an important point of attention for the SB.

ASML Holding N.V. names Samsung Electronics Co., Ltd. as its end customer; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-14; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

In 2012, we issued shares to three key customers – Intel, TSMC and Samsung – as part of the customer co- investment program (CCIP) to accelerate ASML’s development of EUV.

From ASML HOLDING NV's 20-F filed 2024-02-14, accession 000093796624000008, period December 31, 2023, under Item 5 The; characters 1019446 to 1019617; re-found.

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Shareholders who hold ordinary shares through the deposit system under the Dutch Securities Bank Giro Transfer Act maintained by the Dutch central securities depository Euroclear Nederland or through the Depository Trust Company cannot hold fractional shares. No cumulative preference shares have been issued. Each share carries one vote. There are no special voting rights on the issued shares in our share capital. In 2012, we issued shares to three key customers – Intel, TSMC and Samsung – as part of the customer co- investment program (CCIP) to accelerate ASML’s development of EUV. Under this program, the participating customers funded certain development programs and invested in ASML’s ordinary shares. The shares issued in the CCIP were held by foundations which issued depository receipts to participants in the CCIP.

Taiwan Semiconductor Manufacturing Company Limited names ASML Holding N.V. as its supplier; State current since 2026-02-25 (this filer's naming: stale); last named 2019-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

TSMC joined the Customer Co-Investment Program of ASML Holding N.V. (“ASML”) in August 2012.

From TSM's 20-F filed 2019-04-17, accession 000119312519108390, period December 31, 2018, under ITEM 10. ADDITIONAL INFORMATION; characters 248763 to 248855; re-found.

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The above sale and transfer of shares can be made only after that person (as well as its/his/her respective spouse, minor children or nominees) has held the shares for more than six months and that person should report to the Securities and Futures Bureau at least three days before the intended sale or transfer; unless the number of shares to be sold or transferred does not exceed 10,000. 51 Table of Contents Material Contracts TSMC joined the Customer Co-Investment Program of ASML Holding N.V. (“ASML”) in August 2012. As part of this program, TSMC and ASML signed a research and development funding agreement whereby TSMC shall provide EUR276 million to ASML’s research and development programs from 2013 to 2017. TSMC is not currently a party to any other material contract, other than contracts entered into in the ordinary course of our business.

ASML Holding N.V. names VDL as its supplier; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-14; not named in ASML Holding N.V.'s 2026-02-25 filing as read.

I am responsible for ASML’s relationship with one of our largest suppliers: VDL

From ASML HOLDING NV's 20-F filed 2024-02-14, accession 000093796624000008, period December 31, 2023; characters 482893 to 482972; re-found.

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In this latest role, I found my energy came mostly from connecting people – between sectors within ASML, but also with our suppliers. So the question was: how could I bring more of that to my work? A role in procurement was the answer. This was an even bigger step outside my comfort zone than program management. But I knew I had the trust of my management and the network within ASML to ensure I had the right team supporting me. A new direction As of this year, I am responsible for ASML’s relationship with one of our largest suppliers: VDL . ASML doesn’t really have a traditional supply chain – we have a supply network. About 80% of our cost base comes from our suppliers, as our main role is as system integrator. This means suppliers could be supplying us directly while also supplying each other, and even receiving components from us to integrate into their modules before shipping them back to us.

Broadcom Inc. (AVGO): current 13, stale 21

current (13)

Broadcom Inc. names Advanced Semiconductor Engineering, Inc. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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Broadcom Inc. names Amkor Technology, Inc. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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Arista Networks, Inc. names Broadcom Inc. as its supplier; State current since 2026-02-17 (this filer's naming: current); last named 2026-02-17.

In particular, we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.

From ARISTA NETWORKS, INC.'s 10-K filed 2026-02-17, accession 000159653226000013, period December 31, 2025, under Item 1. Business; characters 51624 to 51744; re-found.

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We retain complete control over the bill of materials, qualified component suppliers, test procedures and quality assurance programs. Our personnel work closely with our partners and review forecasts, inventory levels, processes, capacity, yields and overall quality on an ongoing basis. Our products rely on key components, including merchant silicon, integrated circuit components and power supplies, which are purchased from a limited number of suppliers, including certain sole source providers. We may also see increased consolidation among our component suppliers. In particular, we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips. Generally, neither we nor our contract manufacturers have a written agreement with these component providers to guarantee the supply of the key components used in our products, nor do we have exclusive rights to such key components.

CEVA, Inc. names Broadcom Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-27 (this filer's naming: current); last named 2026-02-27.

Our publicly announced licensees include companies such as Actions, Ambiq, ASPEED, ASR Microelectronics, Atmosic, Beken, Bestechnic, boAt, Broadcom

From CEVA, INC.'s 10-K filed 2026-02-27, accession 000143774926006091, period December 31, 2025, under ITEM 1. BUSINESS; characters 66247 to 66394; re-found.

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We have licensed our IP to hundreds of semiconductor and OEM customers worldwide, including seven of the world’s top ten MCU vendors, with adoption spanning mobile, audio, consumer IoT, wearables, industrial automation, automotive, and infrastructure markets. Our publicly announced licensees include companies such as Actions, Ambiq, ASPEED, ASR Microelectronics, Atmosic, Beken, Bestechnic, boAt, Broadcom, Ceragon, Cirrus Logic, Espressif Systems, ESWIN, Fujifilm, Rockchip, Goodix, Hisense, iCatch Technology, iCOM, InPlay, Intel, Itron, LG Electronics, LifeSignals, ListenAI, MediaTek, Microchip, Nations Technologies, Nextchip, Nordic Semiconductor, Nothing, Novatek, NXP, onsemi, Oticon, Panasonic, Qualcomm, Realtek, Renesas, Rohm, Samsung, SatixFy, Sharp, SiFli, SigmaStar, Socionext, Sony, …

Extreme Networks, Inc. names Broadcom Inc. as its supplier; State current since 2025-08-18 (this filer's naming: current); last named 2025-08-18.

Our product development efforts also depend upon continued collaboration with our key suppliers, including our merchant silicon vendors such as Broadcom.

From Extreme Networks, Inc.'s 10-K filed 2025-08-18, accession 000095017025109742, period June 30, 2025, under Item 1. B; characters 82698 to 82851; re-found.

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Utilizing technology brought forward from our ongoing Digital Transformation project, which has entailed integrating digital technology into all areas of our business, changing how we operate and deliver value to customers. In this case, new systems and processes have given us better visibility and control over inventory. Collaborative partnerships with our ODMs and diversified sourcing strategies have also emerged, fostering greater flexibility and risk mitigation. Our product development efforts also depend upon continued collaboration with our key suppliers, including our merchant silicon vendors such as Broadcom. As we develop our product roadmap and continue to expand our relationships with these and other merchant silicon vendors, it is critical that we work in tandem with our key vendors to ensure that their silicon includes improved features and that our products take advantage of such improved features.

Fortinet, Inc. names Broadcom Inc. as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

Some of the components important to our business, including certain Central Processing Units (“CPUs”) from Intel Corporation (“Intel”) and Advanced Micro Devices, Inc. (“AMD”), network and wireless chips from Broadcom Inc. (“Broadcom”), Marvell Technology Group Ltd. (“Marvell”), Qualcomm Incorporated (“Qualcomm”) and Intel and memory devices from Intel, Micron Technology (“Micron”), ADATA Technology Co., Ltd. (“ADATA”), Toshiba Corporation (“Toshiba”), Samsung Electronics Co., Ltd. (“Samsung”), and Western Digital Technologies, Inc. (“Western Digital”), are available from limited or sole sources of supply.

From FORTINET, INC.'s 10-K filed 2026-02-25, accession 000126203926000007, period 2025-12-31, under ITEM 1. Business; characters 80561 to 81174; re-found.

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Hewlett Packard Enterprise Company names Broadcom Inc. as its supplier; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

Sourcing in the filing's own words: single-source.

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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Broadcom Inc. names Hon Hai Precision Industry Co., Ltd. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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Nokia Corporation names Broadcom Inc. as its supplier; State current since 2026-03-05 (this filer's naming: current); last named 2026-03-05.

We expanded our data center switching offer with our new 7220 IXR H6 switching platform, powered by Broadcom's Tomahawk 6 chipset.

From Nokia Corporation's 20-F filed 2026-03-05, accession 000162828026015034, period 2025-12-31, under ITEM 19 EXHIBITS; characters 171798 to 171928; re-found.

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Rambus, Inc. names Broadcom Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-18 (this filer's naming: current); last named 2026-02-18.

Leading semiconductor and electronic system companies, such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents

From RAMBUS INC .'s 10-K filed 2026-02-18, accession 000119312526057101, period December 31, 2025, under Item 1. Business; characters 42010 to 42323; re-found.

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Broadcom Inc. names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1A. RISK FACTORS; characters 114481 to 114584; re-found.

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We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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stale (21)

Adeia Inc. names Broadcom Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2023-03-01 (this filer's naming: stale); last named 2021-02-26; not named in Adeia Inc.'s 2026-02-26 filing as read.

RF Components . Providers of switches and filters for cellular and wireless products such as mobile phones, tablets and laptops. Customers typically have paid us fixed fees for specified periods of time or a per-unit fee and include Broadcom and Silanna RF (acquired by Qualcomm).

From ADEA's 10-K filed 2021-02-26, accession 000156459021009444, period December 31, 2020, under Item 1. Business; characters 98002 to 98282; re-found.

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Providers of DRAM, High Bandwidth Memory (HBM) and NAND semiconductors commonly used in electronic products such as mobile phones, laptops, PCs, game consoles, and servers. Customers typically have paid us fixed fees for specified periods of time and include Samsung and SK hynix. • Sensors . Providers of image and time-of-flights sensors used in mobile phones, consumer electronics and automobiles. Customers typically have paid us fixed fees for specified periods of time or a per-unit fee and include Canon, Omnivision, Samsung, and Sony. • RF Components . Providers of switches and filters for cellular and wireless products such as mobile phones, tablets and laptops. Customers typically have paid us fixed fees for specified periods of time or a per-unit fee and include Broadcom and Silanna RF (acquired by Qualcomm). • Foundry . Manufacturing service providers for fabless semiconductor companies who design and sell semiconductor products. Customers typically pay us a per-unit fee and include Teledyne DALSA, Tower Semiconductor, and UMC.

Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11517 to 11619; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Broadcom Inc. names Apple Inc. as its end customer; State stale since 2025-12-18 (this filer's naming: stale); last named 2023-12-14; not named in Broadcom Inc.'s 2025-12-18 filing as read.

We believe aggregate sales to Apple Inc., through all channels, accounted for approximately 20% of our net revenue for each of fiscal years 2023 and 2022.

From Broadcom Inc.'s 10-K filed 2023-12-14, accession 000173016823000096, period October 29, 2023, under ITEM 1. BUSINESS; characters 71958 to 72112; re-found.

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Distributors and OEMs, or their contract manufacturers, typically account for the substantial majority of our semiconductor sales. A relatively small number of customers account for a significant portion of our net revenue. Sales to distributors accounted for 57% and 56% of our net revenue for fiscal years 2023 and 2022, respectively. We believe aggregate sales to our top five end customers, through all channels, accounted for approximately 35% of our net revenue for each of our fiscal years 2023 and 2022. We believe aggregate sales to Apple Inc., through all channels, accounted for approximately 20% of our net revenue for each of fiscal years 2023 and 2022. We expect to continue to experience significant customer concentration in future periods. The loss of, or significant decrease in demand from, any of our top five end customers could have a material adverse effect on our business, results of operations and financial condition. Many of our semiconductor customers design products in North America or Europe that are then manufactured in Asia.

Broadcom Inc. names Arrow Central Europe GmbH as its distributor; State stale since 2020-12-18 (this filer's naming: stale); last named 2018-12-21; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The named defendants also included distributors EBV Elektronik GmbH, Arrow Central Europe GmbH, and Mouser Electronics Netherlands B.V.

From Broadcom Inc.'s 10-K filed 2018-12-21, accession 000173016818000084, period November 4, 2018, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 416461 to 416596; re-found.

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The complaint sought compensatory damages in an unspecified amount, as well as an award of reasonable attorneys’ fees, interest, and costs. On May 23, 2016, Invensas filed a Writ of Summons against Broadcom, BRCM, Broadcom Netherlands B.V. and Broadcom Communications Netherlands B.V. in the Hague District Court in the Netherlands, Case No. L1422381, alleging infringement of a single European patent that is a foreign counterpart to one of the patents subject to the ITC Investigation, or the European Patent. The named defendants also included distributors EBV Elektronik GmbH, Arrow Central Europe GmbH, and Mouser Electronics Netherlands B.V. The requested relief included a cease-and-desist order and damages in an unspecified amount. On May 23, 2016, Invensas also filed a complaint against each of (i) Broadcom Germany GmbH and Broadcom‘s German distributors, Case No. 7 O 97/16, and (ii) Broadcom and BRCM, Case No. 7 O 98/16, in the Mannheim District Court in Germany, alleging infringement of the European Patent.

ASE Technology Holding Co., Ltd. names Broadcom Inc. as its end customer; State current since 2025-12-18 (this filer's naming: stale); last named 2023-04-10; not named in ASE Technology Holding Co., Ltd.'s 2026-04-01 filing as read.

a Semiconductor Packaging Agreement that Broadcom and SPIL entered into in September 2012 (the “Semiconductor Packaging Agreement”). The Semiconductor Packaging Agreement stipulates that in the event the products provided by SPIL to Broadcom

From ASE Technology Holding Co., Ltd.'s 20-F filed 2023-04-10, accession 000119312523095811, period December 31, 2022, under Item 8. Financial Information; characters 540157 to 540398; re-found.

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After we filed an administrative appeal against the New Fine, the Administrative Appeal Review Committee of Kaohsiung City Government revoked the New Fine on December 15, 2020 and remanded to KEPB for another legitimate administrative action. Broadcom Patent Dispute In May 2019, Broadcom Corporation, Broadcom Singapore Pte. Ltd. and Broadcom Limited (collectively, “Broadcom”) filed a request for arbitration with the American Arbitration Association for a dispute over a Semiconductor Packaging Agreement that Broadcom and SPIL entered into in September 2012 (the “Semiconductor Packaging Agreement”). The Semiconductor Packaging Agreement stipulates that in the event the products provided by SPIL to Broadcom infringe upon third-party patent rights, SPIL must indemnify Broadcom for relevant loss suffered. In connection to the 2016 patent dispute between Broadcom and Tessera, Broadcom requested SPIL to indemnify Broadcom pursuant to the Semiconductor Packaging Agreement. In February 2020, Broadcom and SPIL settled this matter for a total amount of US$5.0 million. 85

Broadcom Inc. names EBV Elektronik GmbH as its distributor; State stale since 2020-12-18 (this filer's naming: stale); last named 2018-12-21; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The named defendants also included distributors EBV Elektronik GmbH, Arrow Central Europe GmbH, and Mouser Electronics Netherlands B.V.

From Broadcom Inc.'s 10-K filed 2018-12-21, accession 000173016818000084, period November 4, 2018, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 416461 to 416596; re-found.

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Extreme Networks, Inc. names Broadcom Inc. as its channel customer; State stale since 2024-08-16 (this filer's naming: stale); last named 2022-08-29; not named in Extreme Networks, Inc.'s 2025-08-18 filing as read.

We have active alliance, OEM and strategic relationships with Broadcom, Barco NV, Ericsson Enterprise AB, Lenovo, Verizon, NFL, MLB, VMware and Nutanix as well as other global industry technology leaders in which our products are qualified to be included into an overall solution or reference architecture. These tested and validated solutions are then marketed and sold by the alliance, OEM or strategic partners into their specific verticals, market segments and customers as turnkey offerings.

From Extreme Networks, Inc.'s 10-K filed 2022-08-29, accession 000156459022030248, period June 30, 2022, under Item 1. Business; characters 82227 to 82723; re-found.

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Alliance, Original Equipment Manufacturers ("OEM") and Strategic Relationships . We have active alliance, OEM and strategic relationships with Broadcom, Barco NV, Ericsson Enterprise AB, Lenovo, Verizon, NFL, MLB, VMware and Nutanix as well as other global industry technology leaders in which our products are qualified to be included into an overall solution or reference architecture. These tested and validated solutions are then marketed and sold by the alliance, OEM or strategic partners into their specific verticals, market segments and customers as turnkey offerings. • Distributors . We have established several key relationships with leading distributors in the electronics and computer networking industries. Each of our distributors primarily resells our products to resellers.

Broadcom Inc. names Flextronics Telecom Systems, Ltd. as its assembly and test provider; State stale since 2020-12-18 (this filer's naming: stale); last named 2018-12-21; not named in Broadcom Inc.'s 2025-12-18 filing as read.

We use third-party contract manufacturers for a significant majority of our assembly and test operations, including Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Inari Technology Sdn Bhd and Flextronics Telecom Systems, Ltd.

From Broadcom Inc.'s 10-K filed 2018-12-21, accession 000173016818000084, period November 4, 2018, under ITEM 1. BUSINESS; characters 44925 to 45213; re-found.

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We believe we are well-positioned to support our customers throughout the design, technology transfer and manufacturing stages across all geographies. 7 Table of Contents Operations The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited, or TSMC, primarily, as well as United Microelectronics Corporation, Semiconductor Manufacturing International Corporation, GlobalFoundries, TowerJazz and WIN Semiconductors Corp. We use third-party contract manufacturers for a significant majority of our assembly and test operations, including Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Inari Technology Sdn Bhd and Flextronics Telecom Systems, Ltd. We use our internal fabrication facilities for products utilizing our innovative and proprietary processes, to protect our IP and to accelerate time to market for our products.

Broadcom Inc. names GLOBALFOUNDRIES Inc. as its foundry; State stale since 2021-12-17 (this filer's naming: stale); last named 2019-12-20; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), primarily, as well as United Microelectronics Corporation, GlobalFoundries, Silicon Manufacturing Partners Pte. Ltd., Tower Semiconductor Ltd. and WIN Semiconductors Corp.

From Broadcom Inc.'s 10-K filed 2019-12-20, accession 000173016819000144, period November 3, 2019, under ITEM 1. BUSINESS; characters 110666 to 111006; re-found.

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We believe our enterprise-wide license model will continue to offer our customers reduced complexity, more flexibility and an easier renewal process that will help drive revenue growth. 9 Table of Contents Manufacturing Operations We focus on maintaining an efficient global supply chain and a variable, low-cost operating model. Accordingly, we outsource a majority of our manufacturing operations, utilizing third-party foundry and assembly and test capabilities, as well as some of our corporate infrastructure functions. The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), primarily, as well as United Microelectronics Corporation, GlobalFoundries, Silicon Manufacturing Partners Pte. Ltd., Tower Semiconductor Ltd. and WIN Semiconductors Corp. We use third-party contract manufacturers for a significant majority of our assembly and test operations, including Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd. We use our internal fabrication facilities for products utilizing our innovative and proprietary processes, to protect our IP and to accelerate …

Broadcom Inc. names Hon Hai Precision Industry Co., Ltd. as its contract-manufacturer customer; State stale since 2020-12-18 (this filer's naming: stale); last named 2018-12-21; not named in Broadcom Inc.'s 2025-12-18 filing as read.

Direct sales to Foxconn Technology Group companies (including Hon Hai Precision Industries), together referred to as Foxconn, accounted for 9% and 14% of our net revenue for fiscal years 2018 and 2017 , respectively.

From Broadcom Inc.'s 10-K filed 2018-12-21, accession 000173016818000084, period November 4, 2018, under ITEM 1. BUSINESS; characters 42494 to 42710; re-found.

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Certain customers require us to contract with them directly and with specified intermediaries, such as contract manufacturers, and both they and their contract manufacturers often require time-critical delivery of our products to multiple locations around the world. Historically, a relatively small number of customers have accounted for a significant portion of our net revenue. Sales to distributors accounted for 34% and 28% of our net revenue for fiscal years 2018 and 2017 , respectively. Direct sales to Foxconn Technology Group companies (including Hon Hai Precision Industries), together referred to as Foxconn, accounted for 9% and 14% of our net revenue for fiscal years 2018 and 2017 , respectively. We believe our aggregate sales to our top five end customers, through all channels, accounted for more than 40% of our net revenue for each of fiscal years 2018 and 2017 . We believe aggregate sales to Apple, Inc., through all channels, accounted for approximately 25% of our net revenue for fiscal year 2018 and more than 20% for fiscal year 2017 .

Broadcom Inc. names Huawei Technologies Co., Ltd. as its end customer; State stale since 2025-12-18 (this filer's naming: stale); last named 2023-12-14; not named in Broadcom Inc.'s 2025-12-18 filing as read.

For example, Huawei Technologies Co., Ltd., one of our customers, is subject to certain U.S. export restrictions, which has required us to suspend sales to Huawei until we obtain licenses from the U.S. Department of Commerce.

From Broadcom Inc.'s 10-K filed 2023-12-14, accession 000173016823000096, period October 29, 2023, under ITEM 1A. RISK FACTORS; characters 104230 to 104455; re-found.

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We may be required to incur significant expense to comply with, or to remedy violations of, these regulations. In addition, if our customers fail to comply with these regulations, we may be required to suspend sales to these customers, which could damage our reputation and negatively impact our results of operations. The U.S. government may also add companies to its restricted entity list and/or technologies to its list of prohibited exports to specific countries, which have had and may continue to have an adverse effect on our ability to sell our products and our revenue. For example, Huawei Technologies Co., Ltd., one of our customers, is subject to certain U.S. export restrictions, which has required us to suspend sales to Huawei until we obtain licenses from the U.S. Department of Commerce. We may be unable to obtain or maintain the necessary licenses to allow us to export products to them.

Broadcom Inc. names Inari Technology Sdn Bhd as its assembly and test provider; State stale since 2020-12-18 (this filer's naming: stale); last named 2018-12-21; not named in Broadcom Inc.'s 2025-12-18 filing as read.

We use third-party contract manufacturers for a significant majority of our assembly and test operations, including Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Inari Technology Sdn Bhd and Flextronics Telecom Systems, Ltd.

From Broadcom Inc.'s 10-K filed 2018-12-21, accession 000173016818000084, period November 4, 2018, under ITEM 1. BUSINESS; characters 44925 to 45213; re-found.

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Broadcom Inc. names Mouser Electronics Netherlands B.V. as its distributor; State stale since 2020-12-18 (this filer's naming: stale); last named 2018-12-21; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The named defendants also included distributors EBV Elektronik GmbH, Arrow Central Europe GmbH, and Mouser Electronics Netherlands B.V.

From Broadcom Inc.'s 10-K filed 2018-12-21, accession 000173016818000084, period November 4, 2018, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 416461 to 416596; re-found.

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NETGEAR, Inc. names Broadcom Inc. as its supplier; State stale since 2020-02-18 (this filer's naming: stale); last named 2018-02-16; not named in NETGEAR, Inc.'s 2026-02-13 filing as read.

As part of the settlement, Broadcom received a license for itself and its customers, including the Company, to Tessera’s portfolio of semiconductor manufacturing patents, including the three patents in the ITC action.

From NETGEAR, Inc.'s 10-K filed 2018-02-16, accession 000112290418000076, period December 31, 2017, under Item 8. Financial Statements and Supplementary Data; characters 393133 to 393350; re-found.

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On October 13, 2017, the respondents and Tessera submitted their Opening Submissions to the Commission. These Opening Submissions included opening briefs on infringement and invalidity topics, opening briefs on remedy, opening briefs on the public interest, opening briefs on bonding, and public interest submissions by the public. The Reply Submissions to the opening briefs were submitted on October 23, 2017. On December 12, 2017, Tessera and Broadcom reached a verbal agreement to settle all the litigation matters between the two companies. As part of the settlement, Broadcom received a license for itself and its customers, including the Company, to Tessera’s portfolio of semiconductor manufacturing patents, including the three patents in the ITC action. On December 15, 2017, the ITC respondents, including the Company, entered into a written settlement agreement with Tessera, whereby dismissal of the ITC action was agreed upon. As part of the settlement agreement, the parties admitted no wrongdoing or violation of law. On December 19, 2017, the ITC granted the parties’ joint motion to terminate the ITC action.

Rambus, Inc. names Broadcom Inc. as its licence customer (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2022-02-28 (this filer's naming: stale); last named 2020-02-26; not named in Rambus, Inc.'s 2026-02-18 filing as read.

For 2019, revenue from Broadcom and SK hynix each accounted for 10% or more of our total revenue.

From RAMBUS INC.'s 10-K filed 2020-02-26, accession 000091727320000005, period December 31, 2019, under Item 1A. Risk Factors; characters 72556 to 72653; re-found.

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9 Table of Contents Our revenue is concentrated in a few customers, and if we lose any of these customers through contract terminations or acquisitions, our revenue may decrease substantially. We have a high degree of revenue concentration. Our top five customers for each reporting period represented approximately 46% , 49% and 55% of our revenue for the years ended December 31, 2019, 2018 and 2017, respectively. For 2019, revenue from Broadcom and SK hynix each accounted for 10% or more of our total revenue. For 2018, revenue from Broadcom and NVIDIA each accounted for 10% or more of our total revenue. For 2017, revenue from Micron, Samsung and SK hynix each accounted for 10% or more of our total revenue. We expect to continue to experience significant revenue concentration for the foreseeable future.

Broadcom Inc. names Semiconductor Manufacturing International Corporation as its foundry; State stale since 2020-12-18 (this filer's naming: stale); last named 2018-12-21; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited, or TSMC, primarily, as well as United Microelectronics Corporation, Semiconductor Manufacturing International Corporation, GlobalFoundries, TowerJazz and WIN Semiconductors Corp.

From Broadcom Inc.'s 10-K filed 2018-12-21, accession 000173016818000084, period November 4, 2018, under ITEM 1. BUSINESS; characters 44586 to 44924; re-found.

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We have strategically developed distributor relationships to serve thousands of customers around the world. A significant amount of our sales are to large global electronic components distributors, complemented by a number of regional distributors with customer relationships based on their respective product ranges. We believe we are well-positioned to support our customers throughout the design, technology transfer and manufacturing stages across all geographies. 7 Table of Contents Operations The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited, or TSMC, primarily, as well as United Microelectronics Corporation, Semiconductor Manufacturing International Corporation, GlobalFoundries, TowerJazz and WIN Semiconductors Corp. We use third-party contract manufacturers for a significant majority of our assembly and test operations, including Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Inari Technology Sdn Bhd and Flextronics Telecom Systems, Ltd. We use our internal fabrication facilities for products utilizing our innovative and proprietary processes, …

Broadcom Inc. names Silicon Manufacturing Partners Pte Ltd as its foundry; State stale since 2021-12-17 (this filer's naming: stale); last named 2019-12-20; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), primarily, as well as United Microelectronics Corporation, GlobalFoundries, Silicon Manufacturing Partners Pte. Ltd., Tower Semiconductor Ltd. and WIN Semiconductors Corp.

From Broadcom Inc.'s 10-K filed 2019-12-20, accession 000173016819000144, period November 3, 2019, under ITEM 1. BUSINESS; characters 110666 to 111006; re-found.

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Broadcom Inc. names Tower Semiconductor Ltd. as its foundry; State stale since 2021-12-17 (this filer's naming: stale); last named 2019-12-20; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), primarily, as well as United Microelectronics Corporation, GlobalFoundries, Silicon Manufacturing Partners Pte. Ltd., Tower Semiconductor Ltd. and WIN Semiconductors Corp.

From Broadcom Inc.'s 10-K filed 2019-12-20, accession 000173016819000144, period November 3, 2019, under ITEM 1. BUSINESS; characters 110666 to 111006; re-found.

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Broadcom Inc. names United Microelectronics Corporation as its foundry; State stale since 2021-12-17 (this filer's naming: stale); last named 2019-12-20; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), primarily, as well as United Microelectronics Corporation, GlobalFoundries, Silicon Manufacturing Partners Pte. Ltd., Tower Semiconductor Ltd. and WIN Semiconductors Corp.

From Broadcom Inc.'s 10-K filed 2019-12-20, accession 000173016819000144, period November 3, 2019, under ITEM 1. BUSINESS; characters 110666 to 111006; re-found.

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Broadcom Inc. names WIN Semiconductors Corp. as its foundry; State stale since 2021-12-17 (this filer's naming: stale); last named 2019-12-20; not named in Broadcom Inc.'s 2025-12-18 filing as read.

The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), primarily, as well as United Microelectronics Corporation, GlobalFoundries, Silicon Manufacturing Partners Pte. Ltd., Tower Semiconductor Ltd. and WIN Semiconductors Corp.

From Broadcom Inc.'s 10-K filed 2019-12-20, accession 000173016819000144, period November 3, 2019, under ITEM 1. BUSINESS; characters 110666 to 111006; re-found.

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Broadcom Inc. names WT Microelectronics Co., Ltd. as its channel customer; State stale since 2025-12-18 (this filer's naming: stale); last named 2023-12-14; not named in Broadcom Inc.'s 2025-12-18 filing as read.

Direct sales to WT Microelectronics Co., Ltd., a distributor, accounted for 21% and 20% of our net revenue for fiscal years 2023 and 2022, respectively.

From Broadcom Inc.'s 10-K filed 2023-12-14, accession 000173016823000096, period October 29, 2023, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 236409 to 236561; re-found.

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Sales of products to distributors accounted for 57% and 56% of our net revenue for fiscal years 2023 and 2022, respectively. Direct sales to WT Microelectronics Co., Ltd., a distributor, accounted for 21% and 20% of our net revenue for fiscal years 2023 and 2022, respectively. We believe aggregate sales to our top five end customers, through all channels, accounted for approximately 35% of our net revenue for each of fiscal years 2023 and 2022. We believe aggregate sales to Apple Inc., through all channels, accounted for approximately 20% of our net revenue for each of fiscal years 2023 and 2022.

Micron Technology, Inc. (MU): current 6, stale 29, ended 2

current (6)

Adeia Inc. names Micron Technology, Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-26 (this filer's naming: current); last named 2026-02-26.

These agreements are typically for specified periods of time, and our customers include Kioxia, Micron, Samsung, SanDisk, SK Hynix, Sony, ST Microelectronics, and UMC.

From ADEA's 10-K filed 2026-02-26, accession 000119312526076549, period December 31, 2025, under Item 1. B; characters 47316 to 47483; re-found.

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Customers have typically paid us fixed fees for specified periods of time and include several of the leading social media companies. • Semiconductors: includes providers of memory, logic, sensors, and radio frequency (“RF”) devices commonly used in electronic products such as mobile phones, laptops, PCs, game consoles and servers. Our agreements with our semiconductor customers can include fixed fees, per-unit fees, production based fees, milestone based fees, or a combination of these fees. These agreements are typically for specified periods of time, and our customers include Kioxia, Micron, Samsung, SanDisk, SK Hynix, Sony, ST Microelectronics, and UMC. We continue to grow our business with several specific opportunities, including: • Greater penetration in OTT: The OTT market continues to grow. For example, the leading provider of SVOD now has worldwide subscribers in excess of 300 million.

Fortinet, Inc. names Micron Technology, Inc. as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

Some of the components important to our business, including certain Central Processing Units (“CPUs”) from Intel Corporation (“Intel”) and Advanced Micro Devices, Inc. (“AMD”), network and wireless chips from Broadcom Inc. (“Broadcom”), Marvell Technology Group Ltd. (“Marvell”), Qualcomm Incorporated (“Qualcomm”) and Intel and memory devices from Intel, Micron Technology (“Micron”), ADATA Technology Co., Ltd. (“ADATA”), Toshiba Corporation (“Toshiba”), Samsung Electronics Co., Ltd. (“Samsung”), and Western Digital Technologies, Inc. (“Western Digital”), are available from limited or sole sources of supply.

From FORTINET, INC.'s 10-K filed 2026-02-25, accession 000126203926000007, period 2025-12-31, under ITEM 1. Business; characters 80561 to 81174; re-found.

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Our most significant customers during the fiscal years ending June 30, 2024, June 25, 2023, and June 26, 2022 included Micron Technology, Inc.; Samsung Electronics Company, Ltd.; SK hynix Inc.; and Taiwan Semiconductor Manufacturing Company.

From LAM RESEARCH CORPORATION's 10-K filed 2024-08-29, accession 000070754924000106, period June 30, 2024, under Item 1. Business; characters 58164 to 58405; re-found.

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NVIDIA Corporation names Micron Technology, Inc. as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57994 to 58070; re-found.

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Rambus, Inc. names Micron Technology, Inc. as its end customer; State current since 2026-02-18 (this filer's naming: current); last named 2026-02-18.

Our memory interface chips are sold to major DRAM manufacturers, Micron, Samsung and SK hynix, as well as directly to system manufacturers and cloud providers, for integration into server memory modules.

From RAMBUS INC .'s 10-K filed 2026-02-18, accession 000119312526057101, period December 31, 2025, under Ite m 7. Management’s Discussion and Analysis of Financial Condition and Results of Operations; characters 193982 to 194185; re-found.

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Finally, further fueling our continuous technology investment, we successfully secured and extended key patent licensing agreements, providing a strong foundation for sustained cash generation and consistent return of value to our stockholders. Operational Highlights Revenue Sources The Company’s consolidated revenue is comprised of product revenue, royalties, and contract and other revenue. Product revenue consists primarily of memory interface chips and is increasing in strategic significance. Our memory interface chips are sold to major DRAM manufacturers, Micron, Samsung and SK hynix, as well as directly to system manufacturers and cloud providers, for integration into server memory modules. Product revenue accounted for 49%, 44% and 49% of our consolidated revenue for the years ended December 31, 2025, 2024 and 2023, respectively. Royalties revenue is primarily derived from our patent licenses, through which we provide our customers certain rights to our broad worldwide portfolio of patented inventions.

Rambus, Inc. names Micron Technology, Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-18 (this filer's naming: current); last named 2026-02-18.

Leading semiconductor and electronic system companies, such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents

From RAMBUS INC .'s 10-K filed 2026-02-18, accession 000119312526057101, period December 31, 2025, under Item 1. Business; characters 42010 to 42323; re-found.

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stale (29)

Micron Technology, Inc. names Adeia Inc. as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-26 (this filer's naming: stale); last named 2015-10-27; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

a $66 million charge associated with a license agreement with Tessera executed in the fourth quarter of 2014.

From Micron Technology, Inc.'s 10-K filed 2015-10-27, accession 000072312515000112, period September 3, 2015, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 324257 to 324366; re-found.

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Results of operations for the fourth quarter of 2014 included a gain of $93 million from the issuance of shares by Inotera, which reduced our ownership interest from 35% to 33% . (See "Equity Method Investments – Inotera" note.) Results of operations for the fourth quarter of 2014 included a gain of $119 million from the sale of interest in Aptina to ON Semiconductor Corporation. (See "Equity Method Investments – Other" note.) Results of operations for the fourth quarter of 2014 included a $66 million charge associated with a license agreement with Tessera executed in the fourth quarter of 2014. 89 Report of Independent Registered Public Accounting Firm To the Board of Directors and Shareholders of Micron Technology, Inc. In our opinion, the consolidated financial statements listed in the index appearing under Item 8 present fairly, in all material respects, the financial position of Micron Technology, Inc. and its subsidiaries at September 3, 2015 and August 28, 2014, and the results …

Our IDM customers include: Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2016-02-22, accession 000104712716000049, period December 31, 2015, under Item 1. Business; characters 11194 to 11404; re-found.

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Micron Technology, Inc. names Apple Inc. as its end customer; State stale since 2015-10-27 (this filer's naming: stale); last named 2013-10-28; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

NAND Flash Supply Agreement, effective as of January 6, 2006, between Apple Computer, Inc. and Micron Technology, Inc.

From Micron Technology, Inc.'s 10-K filed 2013-10-28, accession 000072312513000228, period August 29, 2013, under ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES; characters 418716 to 418834; re-found.

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… and Amendment to Severance Agreement between the Company and its officers (21) 10.36* Master Agreement dated as of November 18, 2005, between Micron Technology, Inc. and Intel Corporation (22) 10.38* Manufacturing Services Agreement dated as of January 6, 2006, between Micron Technology, Inc. and IM Flash Technologies, LLC (22) 10.40* MTV Lease Agreement dated as of January 6, 2006, between Micron Technology, Inc. and IM Flash Technologies, LLC (22) 10.41* Product Designs Assignment Agreement dated January 6, 2006, between Intel Corporation and Micron Technology, Inc. (22) 10.42* NAND Flash Supply Agreement, effective as of January 6, 2006, between Apple Computer, Inc. and Micron Technology, Inc. (22) 10.43* Supply Agreement dated as of January 6, 2006, between Micron Technology, Inc. and IM Flash Technologies, LLC (22) 10.44* Supply Agreement dated as of January 6, 2006, between Intel Corporation and IM Flash Technologies, LLC (22) 10.45 Capped Call Confirmation (Reference No. CEODL6) by and between Micron Technology, Inc. and Morgan Stanley & Co. International plc (10) 10.46 …

Applied Materials, Inc. names Micron Technology, Inc. as its end customer; State stale since 2020-12-11 (this filer's naming: stale); last named 2018-12-13; not named in Applied Materials, Inc.'s 2025-12-12 filing as read.

The following companies accounted for at least 10 percent of Applied’s net sales in each fiscal year, which were for products and services in multiple reportable segments. 2018 2017 2016 Samsung Electronics Co., Ltd. 13% 23% 13% Taiwan Semiconductor Manufacturing Company Limited 11% 15% 16% Micron Technology, Inc. * * 11%

From Applied Materials, Inc.'s 10-K filed 2018-12-13, accession 000000695118000041, period October 28, 2018, under Item 1: Business; characters 24106 to 24449; re-found.

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In addition, a significant driver in the semiconductor and display industries is end-demand for mobile consumer products, which is characterized by seasonality that impacts the timing of customer investments in manufacturing equipment and, in turn, Applied’s business. Information on net sales to unaffiliated customers and long-lived assets attributable to Applied’s geographic regions is included in Note 15 of Notes to Consolidated Financial Statements. The following companies accounted for at least 10 percent of Applied’s net sales in each fiscal year, which were for products and services in multiple reportable segments. 2018 2017 2016 Samsung Electronics Co., Ltd. 13% 23% 13% Taiwan Semiconductor Manufacturing Company Limited 11% 15% 16% Micron Technology, Inc. * * 11% Intel Corporation 11% * 11% ______________________________ * Less than 10% 9 Table of Contents Competition The industries in which Applied operates are highly competitive and characterized by rapid technological change.

Micron Technology, Inc. names Applied Materials, Inc. as its supplier; State stale since 2020-12-11 (this filer's naming: stale); last named 2012-10-29; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

The complaint alleges that our use of a Reflexion CMP polishing system purchased from Applied Materials infringes a single U.S. patent

From Micron Technology, Inc.'s 10-K filed 2012-10-29, accession 000072312512000156, period August 30, 2012, under ITEM 3. LEGAL PROCEEDINGS; characters 106463 to 106597; re-found.

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The District Court action has been stayed pending the outcome of the ITC matter. On August 27, 2012, we executed a settlement agreement with Anu pursuant to which the parties agreed to a settlement and release of all claims and a dismissal with prejudice of the litigation, which did not have a material effect on our business, results of operations or financial condition. On April 27, 2012, Semcon Tech, LLC filed a patent infringement action against us in the U.S. District Court for the District of Delaware. The complaint alleges that our use of a Reflexion CMP polishing system purchased from Applied Materials infringes a single U.S. patent and seeks injunctive relief, damages, attorneys' fees, and costs. We are unable to predict the outcome of these suits, except as noted in the discussion of the Panavision, TPL and Anu matters above.

Micron Technology, Inc. names Aptina Imaging Corporation as its end customer; State stale since 2015-10-27 (this filer's naming: stale); last named 2013-10-28; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

Through May 3, 2013, we manufactured components for CMOS image sensors for Aptina under a wafer supply agreement. For 2013, 2012 and 2011, we recognized net sales of $182 million , $372 million and $349 million , respectively, from products sold to Aptina

From Micron Technology, Inc.'s 10-K filed 2013-10-28, accession 000072312513000228, period August 29, 2013, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 280209 to 280465; re-found.

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We recognized net sales of $13 million and $20 million in 2012 and 2011, respectively, for transition services provided to Transform. Revenue on our sales to Transform approximated costs. Revenue and associated costs for 2013 were not significant. Aptina: Other equity method investments included a 31% equity interest in Aptina. The amount of cumulative loss we recognized from our investment in Aptina through the second quarter of 2012 reduced our investment balance to zero and we ceased recognizing our proportionate share of Aptina's losses. Through May 3, 2013, we manufactured components for CMOS image sensors for Aptina under a wafer supply agreement. For 2013, 2012 and 2011, we recognized net sales of $182 million , $372 million and $349 million , respectively, from products sold to Aptina, and cost of goods sold of $219 million , $395 million and $358 million , respectively. On May 3, 2013, we assigned to LFoundry our supply agreement with Aptina to manufacture image sensors at our 200 mm Avezzano facility. (See "Restructure and Asset Impairments - Micron Technology Italia, S.r.l." note.)

ASE Technology Holding Co., Ltd. names Micron Technology, Inc. as its end customer; State stale since 2014-04-17 (this filer's naming: stale); last named 2012-04-20; not named in ASE Technology Holding Co., Ltd.'s 2026-04-01 filing as read.

The following table sets forth some of our largest customers, in alphabetical order, categorized by the principal end-use applications of the products which we package and test for them. Communications Computing Consumer Electronics/Industrial/Automotive Atmel Corporation Avago Technologies Broadcom Corporation Cambridge Silicon Radio Limited Media Tek Inc. Micron Technology, Inc.

From ASE Technology Holding Co., Ltd.'s 20-F filed 2012-04-20, accession 000095010312002055, period December 31, 2011, under Item 4. Information on the Company; characters 182292 to 182761; re-found.

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Many of our customers are leaders in their respective end-use markets. For example, we provide Freescale Semiconductor, Inc., an industry leader in automotive semiconductor products, with a substantial portion of its outsourced packaging and testing requirements. The following table sets forth some of our largest customers, in alphabetical order, categorized by the principal end-use applications of the products which we package and test for them. Communications Computing Consumer Electronics/Industrial/Automotive Atmel Corporation Avago Technologies Broadcom Corporation Cambridge Silicon Radio Limited Media Tek Inc. Micron Technology, Inc. Qualcomm Incorporated Spreadtrum Communications, Inc. Atmel Corporation Lenovo Computer Ltd. Marvell Technology Group Ltd. NVIDIA Corporation STMicroelectronics N.V. AU Optronics Corp. Freescale Semiconductor, Inc. Motorola, Inc. Mstar International Inc. Renesas Electronics Corporation STMicroelectronics N.V. …

Entegris, Inc. names Micron Technology, Inc. as its end customer; State stale since 2016-02-29 (this filer's naming: stale); last named 2014-02-20; not named in Entegris, Inc.'s 2026-02-11 filing as read.

Our most significant customers based on sales in 2013 include leading device makers such as Micron Technology, Inc., Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corporation (UMC), leading OEM companies such as Applied Materials, Inc., ASML Holding N.V. Dainippon Screen Mfg. Co., Ltd. (DNS), Lam Research Corporation and Tokyo Electron Ltd. and leading wafer grower companies such as MEMC Electronic Materials, Inc., Shin-Etsu Chemical Co. Ltd., Siltronic AG and SUMCO Oregon Corp.

From Entegris, Inc.'s 10-K filed 2014-02-20, accession 000110130214000002, period December 31, 2013, under Item 1. Business.; characters 47884 to 48424; re-found.

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Micron Technology, Inc. names HP Inc. as its end customer; State stale since 2017-10-26 (this filer's naming: stale); last named 2015-10-27; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

Sales to HP, primarily DRAM, were 7% of our net sales in 2015 , 9% of our net sales in 2014 , and 10% of our net sales in 2013

From Micron Technology, Inc.'s 10-K filed 2015-10-27, accession 000072312515000112, period September 3, 2015, under ITEM 1. BUSINESS; characters 31307 to 31433; re-found.

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Market concentrations from 2015 net sales were approximately as follows: 25% for compute and graphics (including desktop PCs, notebooks, and workstations); 25% for mobile; 20% for SSD and other storage; 15% for server; and 10% for automotive, industrial, medical, and other embedded. Sales to Kingston, primarily DRAM, were 11% of our net sales in 2015 and 10% of our net sales in 2014 . Sales to Intel, primarily NAND Flash products through IMFT were 8% of our net sales in 2015 , 8% of our net sales in 2014 , and 10% of our net sales in 2013 . Sales to HP, primarily DRAM, were 7% of our net sales in 2015 , 9% of our net sales in 2014 , and 10% of our net sales in 2013 . Our semiconductor memory products are offered under the Micron ® , Lexar, Crucial ® , SpecTek ® , and Elpida ® brand names and private labels. We market our semiconductor memory products primarily through our own direct sales force and maintain sales or representative offices in our primary markets around the world.

Micron Technology, Inc. names Huawei Technologies Co., Ltd. as its end customer; State stale since 2023-10-06 (this filer's naming: stale); last named 2021-10-08; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

the U.S. Bureau of Industry and Security (“BIS”) has enacted increasingly broad trade restrictions with respect to Huawei (which represented approximately 10% of our revenue in the fourth quarter of 2020), culminating with restrictions that took effect on September 15, 2020 and that prevent us and many other companies from shipping products to Huawei.

From Micron Technology, Inc.'s 10-K filed 2021-10-08, accession 000072312521000065, period September 2, 2021, under ITEM 1A. RISK FACTORS; characters 178182 to 178535; re-found.

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Increasing protectionism, economic nationalism, and national security concerns may lead to further changes in trade policy, domestic sourcing initiatives, or other formal and informal measures that could make it more difficult to sell our products in, or restrict our access to, some markets and/or customers. Escalating tensions between the United States and China have led to increased trade restrictions and have affected customer ordering patterns. For example, the U.S. Bureau of Industry and Security (“BIS”) has enacted increasingly broad trade restrictions with respect to Huawei (which represented approximately 10% of our revenue in the fourth quarter of 2020), culminating with restrictions that took effect on September 15, 2020 and that prevent us and many other companies from shipping products to Huawei. We cannot predict the duration these restrictions will remain in place, whether the BIS will grant us or others licenses to ship products to Huawei, or whether the BIS or other U.S. or foreign government entities will enact similar restrictions with respect to other customers, markets, or products. We may not be able to replace the lost revenue opportunities associated with such restrictions.

Micron Technology, Inc. names Inotera Memories, Inc. as its foundry; State stale since 2018-10-15 (this filer's naming: stale); last named 2016-10-28; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

DRAM products purchased from Inotera accounted for 30% of our aggregate DRAM gigabit production for 2016 as compared to 35% for 2015 and 38% for 2014.

From Micron Technology, Inc.'s 10-K filed 2016-10-28, accession 000072312516000269, period September 1, 2016, under ITEM 7. MANAGEMENT'S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 135026 to 135176; re-found.

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31 From January 2013 through December 2015, we purchased all of Inotera's DRAM output under supply agreements at prices reflecting discounts from market prices for our comparable components. Effective beginning on January 1, 2016, the price for DRAM products purchased by us is based on a formula that equally shares margin between Inotera and us. We purchased $1.43 billion , $2.37 billion , and $2.68 billion of DRAM products from Inotera in 2016, 2015, and 2014, respectively. DRAM products purchased from Inotera accounted for 30% of our aggregate DRAM gigabit production for 2016 as compared to 35% for 2015 and 38% for 2014. In 2015 and 2014, our cost for Inotera products was higher than our cost for similar products manufactured in our wholly-owned facilities.

Intel Corporation names Micron Technology, Inc. as its supplier; State stale since 2023-01-27 (this filer's naming: stale); last named 2021-01-22; not named in Intel Corporation's 2026-01-23 filing as read.

We will continue to purchase product manufactured by Micron under our supply agreement, which includes the next generation of Intel ® 3D XPoint TM technology.

From INTEL CORPORATION's 10-K filed 2021-01-22, accession 000005086321000010, period December 26, 2020; characters 105964 to 106122; re-found.

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This enables fast ramp of the operation, fast learning, and better quality control. Our NAND memory fabrication facility in Dalian, China is included in the transaction entered into with SK hynix to divest our NAND memory business, and is part of the NAND assets held for sale as of December 26, 2020. Our Intel Optane memory business is expressly excluded from this transaction. The next generations of Intel Optane technology and SSDs are being developed in New Mexico following the sale of our non-controlling interest in IMFT to Micron Technology, Inc. (Micron) in 2019. We will continue to purchase product manufactured by Micron under our supply agreement, which includes the next generation of Intel ® 3D XPoint TM technology. Fundamentals of Our Business Our Capital 12 Table of Contents Human Capital Culture is critically important to Intel's success. We are re-energizing our culture to deliver on our corporate purpose and to attract, develop, and retain top talent needed to build transformative products and services that help our customers succeed in an increasingly data-driven world.

Micron Technology, Inc. names Intel Corporation as its end customer; State stale since 2023-01-27 (this filer's naming: stale); last named 2022-10-07; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

In 2020, IMFT manufactured 3D XPoint memory and its sales to Intel were $ 158 million through the date of our purchase of Intel’s noncontrolling interest.

From Micron Technology, Inc.'s 10-K filed 2022-10-07, accession 000072312522000048, period September 1, 2022, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 257992 to 258146; re-found.

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In the first quarter of 2020, we paid $ 1.25 billion to acquire Intel’s noncontrolling interest in IMFT and settle IMFT’s debt obligations to Intel, at which time IMFT became a wholly-owned subsidiary. In connection therewith, we recognized a $ 160 million adjustment to equity for the difference between the $ 744 million of cash consideration allocated to Intel’s noncontrolling interest and its $ 904 million carrying value. IMFT manufactured semiconductor products exclusively for its members under a long-term supply agreement at prices approximating cost. In 2020, IMFT manufactured 3D XPoint memory and its sales to Intel were $ 158 million through the date of our purchase of Intel’s noncontrolling interest. 63 | 2022 10-K Table of Contents Cash and Investments All of our marketable debt investments were classified as available-for-sale as of the dates noted below.

Micron Technology, Inc. names Kingston Technology Company, Inc. as its end customer; State stale since 2025-10-03 (this filer's naming: stale); last named 2023-10-06; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

No customer accounted for 10% or more of total revenue in 2023. Revenue from Kingston Technology Company, Inc. was 12 % of total revenue in 2022 and revenue from WPG Holdings Limited was 11 % and 13 % of total revenue in 2022 and 2021, respectively. Sales to Kingston were primarily included in our CNBU and SBU segments and sales to WPG were primarily included in our MBU, CNBU, and EBU segments.

From Micron Technology, Inc.'s 10-K filed 2023-10-06, accession 000072312523000054, period August 31, 2023, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 327334 to 327731; re-found.

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… income (loss) was as follows: For the year ended 2023 2022 2021 CNBU $ 2,512 $ 2,766 $ 2,497 MBU 2,149 1,725 1,553 EBU 1,324 1,280 1,028 SBU 1,751 1,323 1,101 All Other 1 2 8 Unallocated 19 20 27 $ 7,756 $ 7,116 $ 6,214 88 Table of Contents Certain Concentrations Revenue by market segment as an approximate percent of total revenue is presented in the table below: For the year ended 2023 2022 2021 Automotive, industrial, and consumer 25 % 15 % 15 % Mobile 25 % 25 % 25 % Client and graphics 15 % 20 % 20 % Enterprise and cloud server 15 % 20 % 20 % SSDs and other storage 15 % 15 % 15 % No customer accounted for 10% or more of total revenue in 2023. Revenue from Kingston Technology Company, Inc. was 12 % of total revenue in 2022 and revenue from WPG Holdings Limited was 11 % and 13 % of total revenue in 2022 and 2021, respectively. Sales to Kingston were primarily included in our CNBU and SBU segments and sales to WPG were primarily included in our MBU, CNBU, and EBU segments. We generally have multiple sources of supply for our raw materials and production equipment; however, only a limited number of suppliers are capable of delivering certain raw materials and production equipment that meet our standards and, in some cases, materials or production equipment are provided by a single supplier.

KLA Corporation names Micron Technology, Inc. as its end customer; State stale since 2020-08-07 (this filer's naming: stale); last named 2018-08-06; not named in KLA Corporation's 2025-08-08 filing as read.

The following customers each accounted for more than 10% of total revenues for the indicated periods: Year ended June 30, 2018 2017 2016 Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. Micron Technology, Inc. Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited

From KLA-TENCOR CORPORATION's 10-K filed 2018-08-06, accession 000031920118000045, period June 30, 2018, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 293621 to 293955; re-found.

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In addition, the Company may utilize letters of credit or non-recourse factoring to mitigate credit risk when considered appropriate. The Company is exposed to credit loss in the event of non-performance by counterparties on the foreign exchange contracts that the Company uses in hedging activities and in certain factoring transactions. These counterparties are large international financial institutions, and to date no such counterparty has failed to meet its financial obligations to the Company under such contracts. The following customers each accounted for more than 10% of total revenues for the indicated periods: Year ended June 30, 2018 2017 2016 Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. Micron Technology, Inc. Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited The following customers each accounted for more than 10% of net accounts receivable as of the dates indicated below: As of June 30, 2018 2017 Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited SK Hynix, Inc. Foreign Currency.

Kulicke and Soffa Industries, Inc. names Micron Technology, Inc. as its end customer; State stale since 2023-11-16 (this filer's naming: stale); last named 2021-11-18; not named in Kulicke and Soffa Industries, Inc.'s 2025-11-20 filing as read.

9 Super Power International Ltd. (2) 9 Micron Technology, Inc. 9 On Semiconductor

From KULICKE AND SOFFA INDUSTRIES, INC.'s 10-K filed 2021-11-18, accession 000005697821000153, period October 2, 2021, under Item 1A. Risk Factors; characters 48295 to 48376; re-found.

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… Co., Ltd. (2) 2 Micron Technology, Inc. 3 Tianshui Huatian Technology Co., Ltd. 3 ASE Technology Holding 3 First Technology China, Ltd. (2) 4 Forehope Electronic Co., Ltd 4 Xinye Electronics Co. (2) 4 ASE Technology Holding 5 Powertech Technology Inc. 5 Regent Manner Limited 5 Xinye Electronics Co. (2) 6 Matfron Semiconductor Technology Co. Ltd (2) 6 First Technology China Ltd (2) 6 Forehope Electronic Co., Ltd 7 Regent Manner Limited 7 Matfron Semiconductor Technology Co. Ltd (2) 7 Infineon Technologies 8 Changjin Technology (Shanghai) Co., Ltd. (2) 8 Tesla, Inc. 8 ST Microelectronics 9 Super Power International Ltd. (2) 9 Micron Technology, Inc. 9 On Semiconductor 10 First Technology China Ltd. (2) 10 ST Microelectronics 10 Haoseng Industrial Co., Ltd. (2) (1) Represents more than 10% of our net revenue for the applicable fiscal year. (2) Distributor of our products.

Micron Technology, Inc. names Nanya Technology Corporation as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2014-10-27 (this filer's naming: stale); last named 2012-10-29; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

In connection with the partnering agreement, we have also deployed and licensed certain intellectual property related to the manufacture of DRAM products to Nanya and licensed certain intellectual property from Nanya.

From Micron Technology, Inc.'s 10-K filed 2012-10-29, accession 000072312512000156, period August 30, 2012, under ITEM 1. BUSINESS; characters 19861 to 20078; re-found.

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We have a supply agreement with Inotera and Nanya which gives us the right and obligation to purchase 50% of Inotera's semiconductor memory capacity subject to specific terms and conditions. Under the formula for this supply agreement, all parties' manufacturing costs related to wafers supplied by Inotera, as well as our and Nanya's revenue for the resale of products from wafers supplied by Inotera, are considered in determining costs for wafers purchased by us from Inotera. In connection with the partnering agreement, we have also deployed and licensed certain intellectual property related to the manufacture of DRAM products to Nanya and licensed certain intellectual property from Nanya. We also partner with Nanya to jointly develop process technology and designs to manufacture DRAM products. Under a cost-sharing arrangement effective beginning in April 2010, we generally share DRAM development costs with Nanya. In addition, in 2010 we began receiving royalties from Nanya for sales of DRAM products manufactured by or for Nanya with technology developed prior to April 2010.

Micron Technology, Inc. names Nanya Technology Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2021-10-08 (this filer's naming: stale); last named 2019-10-17; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

If Nanya exercises its right for the 1Y Process Node, Nanya would pay us royalties for a license to the transferred 1Y Process Node technology based on revenues from products utilizing the technology, subject to specified caps, and we would also receive an equity interest in Nanya upon the achievement of certain milestones.

From Micron Technology, Inc.'s 10-K filed 2019-10-17, accession 000072312519000094, period August 29, 2019, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 237050 to 237375; re-found.

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Technology Transfer and License Agreements with Nanya Effective December 6, 2016, the terms of technology transfer and license agreements provided Nanya with options to require us to transfer to Nanya certain technology for Nanya's use and deliverables related to the next DRAM process node generation after our 20nm process node (the "1X Process Node") and the next DRAM process node generation after the 1X Process Node (the "1Y Process Node"). Nanya's option for the 1X Process Node expired unexercised. If Nanya exercises its right for the 1Y Process Node, Nanya would pay us royalties for a license to the transferred 1Y Process Node technology based on revenues from products utilizing the technology, subject to specified caps, and we would also receive an equity interest in Nanya upon the achievement of certain milestones. 55 Cash and Investments Substantially all of our marketable debt and equity investments were classified as available-for-sale as of the dates noted below.

Onto Innovation, Inc. names Micron Technology, Inc. as its end customer; State stale since 2021-02-19 (this filer's naming: stale); last named 2019-02-25; not named in Onto Innovation, Inc.'s 2026-02-24 filing as read.

With respect to customer concentration, the following presents customers who represented 10% or more of total net revenue for any the years ended December 29, 2018, December 30, 2017 and December 31, 2016. 10% or more of total net revenues 2018 2017 2016 Intel Corporation * * * Micron Technology, Inc. ^ * * Samsung Electronics Co. Ltd. * * ^ SK hynix * * * Taiwan Semiconductor Manufacturing Company Limited ^ ^ * Toshiba Corporation * * ^ * The customer accounted for more than 10% of total revenues during the period ^ The customer accounted for less than 10% of total revenues during the period

From NANOMETRICS INCORPORATED's 10-K filed 2019-02-25, accession 000156459019004083, period December 29, 2018, under ITEM 1. BUSINESS; characters 19912 to 20999; re-found.

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End markets include high precision optics surfaces and components, aerospace and defense components, and unique research and scientific instrumentation that requires the unique high-speed results of the 4D systems. Customers We sell our metrology and inspection systems worldwide to semiconductor manufacturers, producers of solid-state devices, wafer manufacturers and industrial and scientific research customers. We sell the majority of our systems to customers located in Asia and the United States With respect to customer concentration, the following presents customers who represented 10% or more of total net revenue for any the years ended December 29, 2018, December 30, 2017 and December 31, 2016. 10% or more of total net revenues 2018 2017 2016 Intel Corporation * * * Micron Technology, Inc. ^ * * Samsung Electronics Co. Ltd. * * ^ SK hynix * * * Taiwan Semiconductor Manufacturing Company Limited ^ ^ * Toshiba Corporation * * ^ * The customer accounted for more than 10% of total revenues during the period ^ The customer accounted for less than 10% of total revenues during the period Product revenues represented 85%, 83%, and 84% of total net revenues in 2018, 2017 and 2016, respectively. Sales and Marketing We believe that the capability for direct sales and support is beneficial for developing and maintaining close customer relationships and for rapidly responding to changing customer requirements.

Micron Technology, Inc. names Photronics, Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2014-10-27 (this filer's naming: stale); last named 2012-10-29; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

In connection with the formation of the joint venture, we received $72 million in 2006 in exchange for entering into a license agreement with Photronics

From Micron Technology, Inc.'s 10-K filed 2012-10-29, accession 000072312512000156, period August 30, 2012, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 328210 to 328362; re-found.

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R&D expenses were reduced by reimbursements from Intel of $87 million , $95 million and $104 million for 2012 , 2011 and 2010 , respectively. MP Mask In 2006, we formed a joint venture with Photronics to produce photomasks for leading-edge and advanced next generation semiconductors. At inception and through August 30, 2012 , we owned 50.01% and Photronics owned 49.99% of MP Mask. We contributed $21 million and $9 million to MP Mask in 2012 and 2011 , respectively. Photronics contributed $20 million and $8 million to MP Mask in 2012 , 2011 , respectively. In connection with the formation of the joint venture, we received $72 million in 2006 in exchange for entering into a license agreement with Photronics, which is being recognized over the term of the 10 -year agreement. Deferred income and other noncurrent liabilities included an aggregate of $26 million and $34 million as of August 30, 2012 and September 1, 2011 , respectively, related to this agreement. We purchase a substantial majority of the reticles produced by MP Mask pursuant to a supply arrangement.

Plexus Corp. names Micron Technology, Inc. as its end customer; State stale since 2020-11-20 (this filer's naming: stale); last named 2018-11-16; not named in Plexus Corp.'s 2025-11-14 filing as read.

GE, Micron Technology, Inc. ("Micron") and ARRIS Group, Inc. ("Arris") accounted for 11.1% , 10.4% , and 10.1% , respectively, of our net sales in fiscal 2016 .

From PLEXUS CORP's 10-K filed 2018-11-16, accession 000078578618000051, period September 29, 2018, under ITEM 1. BUSINESS; characters 22021 to 22181; re-found.

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During fiscal 2018, we served approximately 140 customers. We offer advanced design and production capabilities, allowing our customers to concentrate on their core competencies. Plexus helps accelerate our customers' time to market, reduce their investment in engineering and manufacturing capacity, and optimize total product cost. General Electric Company ("GE") accounted for 12.3% of our net sales during fiscal 2018 . GE accounted for 12.2% of our net sales in fiscal 2017 . GE, Micron Technology, Inc. ("Micron") and ARRIS Group, Inc. ("Arris") accounted for 11.1% , 10.4% , and 10.1% , respectively, of our net sales in fiscal 2016 . No other customers accounted for 10.0% or more of our net sales in any of the last three fiscal years. Net sales to our largest customers may vary from time to time depending on the size and timing of customer program commencements, terminations, delays, modifications and transitions. We generally do not obtain firm, long-term purchase commitments from our customers.

Micron Technology, Inc. names Powertech Technology Inc. as its assembly and test provider; State stale since 2022-10-07 (this filer's naming: stale); last named 2020-10-19; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

Powertech Technology Inc. Xi’an (“PTI Xi’an”) is a wholly-owned subsidiary of Powertech Technology Inc. (“PTI”) and was created to provide assembly services to us at our manufacturing site in Xi’an, China.

From Micron Technology, Inc.'s 10-K filed 2020-10-19, accession 000072312520000082, period September 3, 2020, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 255867 to 256072; re-found.

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Our evaluation includes identification of significant activities and an assessment of our ability to direct those activities based on governance provisions and arrangements to provide or receive product and process technology, product supply, operations services, equity funding, financing, and other applicable agreements and circumstances. Our assessments of whether we are the primary beneficiary of our VIEs require significant assumptions and judgments. Unconsolidated VIE PTI Xi’an : Powertech Technology Inc. Xi’an (“PTI Xi’an”) is a wholly-owned subsidiary of Powertech Technology Inc. (“PTI”) and was created to provide assembly services to us at our manufacturing site in Xi’an, China. We do not have an equity interest in PTI Xi’an. PTI Xi’an is a VIE because of the terms of its service agreement with us and its dependency on PTI to finance its operations. We do not have the power to direct the activities of PTI Xi’an that most significantly impact its economic performance, primarily because we do not have governance rights. Therefore, we do not consolidate PTI Xi’an.

Rambus, Inc. names Micron Technology, Inc. as its licence customer (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2024-02-23 (this filer's naming: stale); last named 2022-02-28; not named in Rambus, Inc.'s 2026-02-18 filing as read.

For 2021, revenue from Micron, Samsung and SK hynix each accounted for 10% or more of our total revenue.

From RAMBUS INC.'s 10-K filed 2022-02-28, accession 000091727322000010, period December 31, 2021, under Item 1A. Risk Factors; characters 69125 to 69229; re-found.

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These and other new offerings may present new and difficult challenges, which could negatively affect our operating results. Our revenue is concentrated in a few customers, and if we lose any of these customers through contract terminations or acquisitions, our revenue may decrease substantially. We have a high degree of revenue concentration. Our top five customers for each reporting period represented approximately 56%, 46% and 45% of our revenue for the years ended December 31, 2021, 2020 and 2019, respectively. For 2021, revenue from Micron, Samsung and SK hynix each accounted for 10% or more of our total revenue. For 2020, revenue from Micron and SK hynix each accounted for 10% or more of our total revenue. For 2019, revenue from Broadcom and SK hynix each accounted for 10% or more of our total revenue. We expect to continue to experience significant revenue concentration for the foreseeable future.

Micron Technology, Inc. names SC Hiroshima Energy Corporation as its supplier; State stale since 2018-10-15 (this filer's naming: stale); last named 2016-10-28; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

SC Hiroshima Energy Corporation ("SCHE") is an entity created to construct and operate a cogeneration, electrical power plant to support our wafer manufacturing facility in Hiroshima, Japan.

From Micron Technology, Inc.'s 10-K filed 2016-10-28, accession 000072312516000269, period September 1, 2016, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 213973 to 214163; re-found.

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By design, the arrangement with EQUVO is merely a financing vehicle and we do not bear any significant risks from variable interests with EQUVO. Therefore, we have determined that we do not have the power to direct the activities of EQUVO that most significantly impact its economic performance and we do not consolidate EQUVO. SC Hiroshima Energy Corporation : SC Hiroshima Energy Corporation ("SCHE") is an entity created to construct and operate a cogeneration, electrical power plant to support our wafer manufacturing facility in Hiroshima, Japan. We do not have an equity interest in SCHE. SCHE is a VIE due to the nature of its tolling agreements with us and our option to purchase SCHE's assets. We do not control the operation and maintenance of the plant, which we have determined are the activities of SCHE that most significantly impact its economic performance. Therefore, we do not consolidate SCHE.

Micron Technology, Inc. names SK hynix Inc. as its supplier; State stale since 2014-10-27 (this filer's naming: stale); last named 2012-10-29; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

During 2011 and 2010, a portion of the NAND Flash sold by WSG was obtained from Hynix at market prices and by the end of 2011, substantially all of this supply was obtained from lower-cost Micron production.

From Micron Technology, Inc.'s 10-K filed 2012-10-29, accession 000072312512000156, period August 30, 2012, under ITEM 7. MANAGEMENT'S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 147573 to 147780; re-found.

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The decline in WSG operating margin for 2012 was primarily due to the reductions in average selling prices and in NOR Flash sales volumes. In addition, WSG operating margin for 2011 benefited from a $95 million gain from an allocated portion of the Samsung patent cross-license agreement. The 152% increase in WSG sales for 2011 as compared to 2010 was primarily due to the acquisition of Numonyx in May 2010. WSG experienced pricing pressure in 2011 due to weakness in demand from certain customers. During 2011 and 2010, a portion of the NAND Flash sold by WSG was obtained from Hynix at market prices and by the end of 2011, substantially all of this supply was obtained from lower-cost Micron production. The improvement in WSG operating margin for 2011 was primarily due to the $95 million gain from the license agreement with Samsung. 33 Embedded Solutions Group ("ESG") For the year ended 2012 2011 2010 Net sales $ 1,054 $ 1,002 $ 521 Operating income 156 237 152 In 2012, ESG sales were comprised of NOR Flash, DRAM and NAND Flash in decreasing order of revenue.

Micron Technology, Inc. names Tera Probe, Inc. as its assembly and test provider; State stale since 2018-10-15 (this filer's naming: stale); last named 2016-10-28; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

Tera Probe : We have an approximate 40% ownership interest in Tera Probe, an entity that provides semiconductor wafer testing and probe services to us and others.

From Micron Technology, Inc.'s 10-K filed 2016-10-28, accession 000072312516000269, period September 1, 2016, under ITEM 1. BUSINESS; characters 28883 to 29045; re-found.

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Upon termination of the initial three-year term, the share of Inotera's capacity we would purchase would decline over the wind-down period. In 2016, we entered into agreements to acquire the remaining interest in Inotera. (See "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Equity Method Investments – Inotera" and "Proposed Acquisition of Inotera.") (3) Tera Probe : We have an approximate 40% ownership interest in Tera Probe, an entity that provides semiconductor wafer testing and probe services to us and others. 5 Manufacturing Our manufacturing facilities are located in the United States, China, Japan, Malaysia, Singapore, and Taiwan. Inotera has a wafer fabrication facility in Taiwan. Nearly all of our products are manufactured on 300mm wafers in facilities that generally operate 24 hours per day, 7 days per week.

Tower Semiconductor Ltd. names Micron Technology, Inc. as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2016-05-11 (this filer's naming: stale); last named 2014-05-14; not named in Tower Semiconductor Ltd.'s 2026-04-30 filing as read.

In accordance with this agreement, TJP manufactured products for Micron at the Nishiwaki facility for three years from the acquisition date with process technologies licensed from Micron under a technology licensing agreement signed between the companies

From TOWER SEMICONDUCTOR LTD.'s 20-F filed 2014-05-14, accession 000117891314001662, period December 31, 2013, under ITEM 5. OPERATING AND FINANCIAL REVIEW AND PROSPECTS; characters 214875 to 215129; re-found.

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As part of the TJP acquisition, TJP entered into a supply agreement with Micron. In accordance with this agreement, TJP manufactured products for Micron at the Nishiwaki facility for three years from the acquisition date with process technologies licensed from Micron under a technology licensing agreement signed between the companies. Under the supply agreement, Micron was committed to purchase certain minimum volumes, with periodic reductions through expiration of the agreement in June 2014. The companies also agreed to provide each other with transition services required for the duration of the transition period of approximately two to three years.

Micron Technology, Inc. names Tower Semiconductor Ltd. as its foundry; State stale since 2015-10-27 (this filer's naming: stale); last named 2013-10-28; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

In 2011, we sold our wafer fabrication facility in Japan to Tower Semiconductor Ltd. ("Tower") and entered into a supply agreement for Tower to manufacture products for us in the facility through approximately May 2014.

From Micron Technology, Inc.'s 10-K filed 2013-10-28, accession 000072312513000228, period August 29, 2013, under ITEM 1. BUSINESS; characters 27089 to 27308; re-found.

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Manufacturing Our manufacturing facilities are located in the United States, China, Israel, Japan, Malaysia, Puerto Rico, Singapore and Taiwan. Our Inotera joint venture also has a wafer fabrication facility in Taiwan. In September 2013, we entered into an agreement to sell our 200mm wafer fabrication equipment in Kiryat Gat, Israel to Intel and to terminate the related facility lease with Intel. If this transaction is completed, Intel will manufacture wafers for us at the Kiryat Gat facility through 2014 through a series of arrangements. In 2011, we sold our wafer fabrication facility in Japan to Tower Semiconductor Ltd. ("Tower") and entered into a supply agreement for Tower to manufacture products for us in the facility through approximately May 2014. Our manufacturing facilities generally operate 24 hours per day, 7 days per week. Semiconductor manufacturing is extremely capital intensive, requiring large investments in sophisticated facilities and equipment. A significant portion of our semiconductor equipment is replaced every three to five years with increasingly advanced equipment.

Micron Technology, Inc. names WPG Holdings Limited as its channel customer; State stale since 2025-10-03 (this filer's naming: stale); last named 2023-10-06; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

No customer accounted for 10% or more of total revenue in 2023. Revenue from Kingston Technology Company, Inc. was 12 % of total revenue in 2022 and revenue from WPG Holdings Limited was 11 % and 13 % of total revenue in 2022 and 2021, respectively. Sales to Kingston were primarily included in our CNBU and SBU segments and sales to WPG were primarily included in our MBU, CNBU, and EBU segments.

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ended (2)

Micron Technology, Inc. names Intel Corporation as its foundry; State ended since 2014-10-27 (this filer's naming: ended); last named 2014-10-27; not named in Micron Technology, Inc.'s 2025-10-03 filing as read.

Intel manufactured wafers for us at the Kiryat Gat facility through 2014 through a series of arrangements.

From Micron Technology, Inc.'s 10-K filed 2014-10-27, accession 000072312514000195, period August 28, 2014, under ITEM 2. PROPERTIES; characters 97553 to 97659; re-found.

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Our Inotera joint venture has a 300mm wafer fabrication facility in Kueishan, Taiwan. Under our supply agreement with Inotera, we purchase substantially all of the output of Inotera. We also own and lease a number of other facilities in locations throughout the world that are used for design, research and development, and sales and marketing activities. In December 2013, we sold our 200mm wafer fabrication equipment in Kiryat Gat, Israel to Intel and terminated the related facility lease with Intel. Intel manufactured wafers for us at the Kiryat Gat facility through 2014 through a series of arrangements. Our facility in Lehi is owned and operated by our IMFT joint venture with Intel. (See "Part II – Item 8. Financial Statements and Supplementary Data – Notes to Consolidated Financial Statements – Equity – Noncontrolling Interests in Subsidiaries – IMFT" note.) We believe that our existing facilities are suitable and adequate for our present purposes.

Tower Semiconductor Ltd. names Micron Technology, Inc. as its end customer; State stale since 2015-10-27 (this filer's naming: ended); last named 2015-05-14; not named in Tower Semiconductor Ltd.'s 2026-04-30 filing as read.

the previously disclosed contractual decrease in the volumes of wafers manufactured in our Fab 4 in Japan under our committed volume agreement which we entered into with Micron in June 2011, resulted in periodic pre-scheduled reductions of revenue from Micron, amounted to $139.4 million lower revenue in 2013 as compared to 2012 (which trend we expect to continue due to the expiration of this contract from June 2014 and the cessation of Fab 4 operations

From TOWER SEMICONDUCTOR LTD.'s 20-F filed 2015-05-14, accession 000117891315001676, period December 31, 2014, under ITEM 5. OPERATING AND FINANCIAL REVIEW AND PROSPECTS; characters 195291 to 195747; re-found.

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Revenues . Revenue for the year ended December 31, 2013 amounted to $505.0 million, as compared to $638.8 million for the year ended December 31, 2012. This decrease in revenues was attributed to: (i) the previously disclosed contractual decrease in the volumes of wafers manufactured in our Fab 4 in Japan under our committed volume agreement which we entered into with Micron in June 2011, resulted in periodic pre-scheduled reductions of revenue from Micron, amounted to $139.4 million lower revenue in 2013 as compared to 2012 (which trend we expect to continue due to the expiration of this contract from June 2014 and the cessation of Fab 4 operations; See Item 5.B. “our operations in Japan”); (ii) a definitive agreement we entered in November 2009 with an Asian entity for the capacity ramp-up and upgrade of the entity’s eight inch refurbished wafer fabrication facility (see note 16D(2) to our financial statements) resulted in approximately $13.4 million lower revenue in 2013 as compared to 2012; and offset by (iii) $19.0 million increase in …

NVIDIA Corporation (NVDA): current 17, stale 92

current (17)

Fabrinet names NVIDIA Corporation as its end customer; State current since 2025-08-19 (this filer's naming: current); last named 2025-08-19.

During fiscal year 2025, NVIDIA Corporation and Cisco Systems, Inc. contributed 27.6% and 18.2%, respectively, of our revenues.

From FABRINET's 10-K filed 2025-08-19, accession 000140871025000039, period June 27, 2025, under ITEM 1. BUSINESS.; characters 79738 to 79865; re-found.

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We also anticipate our customers will continue to desire our vertically integrated capabilities, designing customized optics and glass to be incorporated into optical components, modules and complete network or laser systems. Customers, Sales and Marketing The optical communications market we serve is highly concentrated. Therefore, we expect a significant percentage of our revenues will continue to come from a small number of customers. During fiscal years 2025 and 2024, we had two customers that each contributed 10% or more of our revenues. During fiscal year 2025, NVIDIA Corporation and Cisco Systems, Inc. contributed 27.6% and 18.2%, respectively, of our revenues. During fiscal year 2024, NVIDIA Corporation and Cisco Systems, Inc. contributed 35.1% and 13.4%, respectively, of our revenues. The production of optical devices is characterized by a lengthy qualification process. In particular, the qualification and field testing of the products that we produce for our customers may take three to six months or longer to complete.

Accounts receivable from individual customers representing 10% or more of accounts receivable as of June 27, 2025 and June 28, 2024, respectively, were as follows: As of June 27, 2025 As of June 28, 2024 NVIDIA Corporation 25.5 % 22.7 % Cisco Systems, Inc. 13.7 % 12.4 % Nokia Corporation (1) 12.0 % 19.3 % * Represents less than 10% of total accounts receivable.

From FABRINET's 10-K filed 2025-08-19, accession 000140871025000039, period June 27, 2025, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA.; characters 375964 to 376327; re-found.

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… $ 338,127 $ 261,378 $ 264,452 U.S. 30,374 31,383 25,914 China 14,378 16,618 17,646 Israel 2,727 2,269 3,254 Others 802 928 718 Total 386,408 312,576 311,984 87 Table of contents Significant customers Total revenues, by percentage, from individual customers representing 10% or more of total revenues in the respective periods were as follows: Years Ended June 27, 2025 June 28, 2024 June 30, 2023 NVIDIA Corporation 27.6 % 35.1 % 12.5 % Cisco Systems, Inc. 18.2 % 13.4 % 15.6 % Lumentum Operations LLC * * 15.4 % Infinera Corporation * * 12.4 % * Represents less than 10% of total revenues. Accounts receivable from individual customers representing 10% or more of accounts receivable as of June 27, 2025 and June 28, 2024, respectively, were as follows: As of June 27, 2025 As of June 28, 2024 NVIDIA Corporation 25.5 % 22.7 % Cisco Systems, Inc. 13.7 % 12.4 % Nokia Corporation (1) 12.0 % 19.3 % * Represents less than 10% of total accounts receivable. (1) Includes Infinera Corporation as of June 27, 2025. 21. Financial instruments Objectives and significant terms and conditions The principal financial risks faced by the Company are foreign currency risk and interest rate risk. The Company borrows at floating rates of interest to finance its operations.

NVIDIA Corporation names Fabrinet as its assembly and test provider; State current since 2025-08-19 (this filer's naming: current); last named 2026-02-25.

We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 58128 to 58342; re-found.

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NVIDIA Corporation names Groq, Inc. as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

In December 2025, we entered into a non‑exclusive license agreement with Groq, Inc., or Groq, for its language processing unit technology and hired certain Groq employees.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 15. Exhibits and Financial Statement Schedules; characters 296439 to 296610; re-found.

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We will adopt this standard in the fiscal year 2028 annual report. We do not expect the adoption of this standard to have a material impact on our Consolidated Financial Statements other than additional disclosures. 60 Table of Contents NVIDIA Corporation and Subsidiaries Notes to the Consolidated Financial Statements (Continued) Note 2 - Groq In December 2025, we entered into a non‑exclusive license agreement with Groq, Inc., or Groq, for its language processing unit technology and hired certain Groq employees. No customer contracts, existing products, or equity interests were purchased. We recorded $ 14.4 billion of goodwill and a $ 2.5 billion developed technology intangible asset, valued using a cost‑to‑recreate methodology with a five‑year useful life.

Hewlett Packard Enterprise Company names NVIDIA Corporation as its supplier; State current since 2025-12-18 (this filer's naming: current); last named 2025-12-18.

Sourcing in the filing's own words: single-source.

However, we do rely on single-source suppliers for certain customized parts (although some of these sources have operations in multiple locations in the event of a disruption) and a disruption or loss of a single-source supplier could delay production of some products. In some instances, our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units) are also the single-source suppliers for the entire market; disruptions with these suppliers would result in industry-wide dislocations and therefore would not disproportionately disadvantage us relative to our competitors.

From HEWLETT PACKARD ENTERPRISE COMPANY's 10-K filed 2025-12-18, accession 000164559025000130, period October 31, 2025, under ITEM 1. Business; characters 136872 to 137594; re-found.

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NVIDIA Corporation names Hon Hai Precision Industry Co., Ltd. as its assembly and test provider; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 58128 to 58342; re-found.

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HP Inc. names NVIDIA Corporation as its supplier; State current since 2025-12-10 (this filer's naming: current); last named 2025-12-10.

We also rely on Intel, AMD, and NVIDIA, or other suppliers to provide us with a sufficient supply of processors for the majority of our PCs and workstations.

From HP Inc.'s 10-K filed 2025-12-10, accession 000004721725000071, period October 31, 2025, under ITEM 1A. Risk Factors.; characters 142661 to 142818; re-found.

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NVIDIA Corporation names Micron Technology, Inc. as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57994 to 58070; re-found.

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Under our agreement with Microsoft for the Xbox, if someone makes an offer to purchase at least 30% of our outstanding common stock, Microsoft may have first and last rights of refusal to purchase the stock.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1A. Risk Factors; characters 193339 to 193546; re-found.

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Monolithic Power Systems, Inc. names NVIDIA Corporation as its customer; State current since 2025-03-03 (this filer's naming: current); last named 2025-03-03; not named in Monolithic Power Systems, Inc.'s 2026-02-27 filing as read.

by making material misstatements or omissions relating to our business, including with respect to our business relationship with Nvidia.

From Monolithic Power Systems, Inc.'s 10-K filed 2025-03-03, accession 000143774925005903, period December 31, 2024, under Item 3. Legal Proceedings; characters 183919 to 184055; re-found.

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On February 4, 2025, a purported class action lawsuit was filed against us and certain of our executives. The lawsuit is captioned Waterford Twp. Gen. Emps. Ret. Sys. v. Monolithic Power Systems, Inc., et al. , No. 25-cv-220 (W.D. Wash.), and alleges that we violated Sections 10(b) and 20(a) of the Securities Exchange Act of 1934, as amended, and Rule 10b-5 promulgated thereunder, by making material misstatements or omissions relating to our business, including with respect to our business relationship with Nvidia. The lawsuit seeks an unspecified amount of damages as well as attorneys’ fees and other relief. We believe the lawsuit is meritless and intend to defend against it vigorously.

NIO Inc. names NVIDIA Corporation as its supplier; State current since 2026-04-10 (this filer's naming: current); last named 2026-04-10.

Equipped with Lidars and NVIDIA DRIVE Orin X chips, our Power Swap Station 4.0 can conduct fully automatic swaps

From NIO Inc.'s 20-F filed 2026-04-10, accession 000110465926041765, period 2025-12-31, under ITEM 4. INFORMATION ON THE COMPANY; characters 437090 to 437202; re-found.

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Power Swap Station All of our vehicles support battery swapping. Once a vehicle is parked at a Power Swap Station and the swap function is activated, the battery is automatically replaced within minutes. Automatic battery and electric drive system health assessments are performed during each swap to enhance safety and reliability. Since the establishment of our first battery swap station in 2018, we have been committed to the ongoing development and improvement of our Power Swap systems. Equipped with Lidars and NVIDIA DRIVE Orin X chips, our Power Swap Station 4.0 can conduct fully automatic swaps up to 480 times per day and support intelligent vehicle-station connectivity in complex environments. As of December 31, 2025, we had 3,737 Power Swap Stations covering urban areas and expressways globally, through which we had completed over 96 million battery swaps cumulatively.

Nokia Corporation names NVIDIA Corporation as its supplier; State current since 2026-03-05 (this filer's naming: current); last named 2026-03-05.

As the first supplier to introduce commercial- grade AI-RAN products for 5G-Advanced and 6G networks, we leverage the NVIDIA ARC-Pro accelerated computing platform to evolve our Cloud RAN into a Cloud AI-RAN solution, and in our AirScale RAN solutions.

From Nokia Corporation's 20-F filed 2026-03-05, accession 000162828026015034, period 2025-12-31, under ITEM 19 EXHIBITS; characters 191919 to 192171; re-found.

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Rambus, Inc. names NVIDIA Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-18 (this filer's naming: current); last named 2026-02-18.

Leading semiconductor and electronic system companies, such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents

From RAMBUS INC .'s 10-K filed 2026-02-18, accession 000119312526057101, period December 31, 2025, under Item 1. Business; characters 42010 to 42323; re-found.

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NVIDIA Corporation names Samsung Electronics Co., Ltd. as its foundry and supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57819 to 57993; re-found.

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We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57994 to 58070; re-found.

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NVIDIA Corporation names SK hynix Inc. as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57994 to 58070; re-found.

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NVIDIA Corporation names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57819 to 57993; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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NVIDIA Corporation names Wistron Corporation as its assembly and test provider; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 58128 to 58342; re-found.

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stale (92)

NVIDIA Corporation names ?hp as its end customer; State stale since 2023-02-24 (this filer's naming: stale); last named 2021-02-26; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker worldwide, including Cisco, Dell, HP, Inspur, and Lenovo; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, and Oracle Cloud;

From NVIDIA CORP ORATION's 10-K filed 2021-02-26, accession 000104581021000010, period January 31, 2021, under ITEM 1. BUSINESS; characters 44631 to 44920; re-found.

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We partnered with industry leaders such as IBM, Microsoft, Oracle, SAP, and VMware to bring AI to enterprise users. We also have partnerships in transportation, retail, healthcare and manufacturing, among others, to accelerate the adoption of AI. At the foundation of the NVIDIA accelerated computing platform are our GPUs, which excel at parallel workloads such as the training and inferencing of neural networks. They are available in industry standard servers from every major computer maker worldwide, including Cisco, Dell, HP, Inspur, and Lenovo; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, and Oracle Cloud; as well as in our DGX AI supercomputer, a purpose-built system for deep learning and GPU accelerated applications. To facilitate customer adoption, we have also built other ready-to-use systems and reference designs around our GPUs, including 6 Table of Contents HGX for hyperscale and supercomputing data centers, EGX for enterprise and edge computing, and AGX for autonomous machines.

NVIDIA Corporation names Acer Incorporated as its end customer; State stale since 2017-03-01 (this filer's naming: stale); last named 2015-03-12; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Our Tegra K1 processor was featured in Google’s Nexus 9 and Project Tango tablets, in NVIDIA's SHIELD tablet and in Chromebooks made by Acer and HP, and was one of the first processors to support Android TV.

From NVIDIA CORPORATION's 10-K filed 2015-03-12, accession 000104581015000036, period January 25, 2015, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 97429 to 97636; re-found.

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Tegra Processor Business During fiscal year 2015, we expanded our SHIELD family of gaming devices, adding the SHIELD tablet and SHIELD wireless controller to the product family that also includes the SHIELD portable. We also launched our GRID On-Demand Streaming Service, providing it free for SHIELD users through June 30, 2015. We announced the NVIDIA Tegra X1 mobile processor, a 256-core Maxwell architecture-based mobile super chip with over one teraflops of computing power. Our Tegra K1 processor was featured in Google’s Nexus 9 and Project Tango tablets, in NVIDIA's SHIELD tablet and in Chromebooks made by Acer and HP, and was one of the first processors to support Android TV. Tegra K1 was also included in our launch of Jetson TK1, a development platform aimed at automotive, robotics, defense and embedded applications. In automotive, we launched NVIDIA DRIVE automotive computers - a computing platform for advanced driver assistance systems and digital cockpits that could enable auto-piloted cars and run state of the art infotainment systems.

NVIDIA Corporation names Advantest America Inc. as its supplier; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

test equipment purchased from industry-leading suppliers such as Advantest America Inc.

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60845 to 60932; re-found.

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We purchase substrates from Ibiden Co. Ltd., Kinsus Interconnect Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., or Samsung, and SK Hynix. We often consign key components or materials such as the GPU, SoC, memory, and integrated circuit to the contract manufacturers. We typically receive semiconductor products from our subcontractors, perform incoming quality assurance and configuration using test equipment purchased from industry-leading suppliers such as Advantest America Inc. and Chroma ATE Inc., and then ship the semiconductors to contract manufacturers, such as BYD Auto and Hon Hai, distributors, motherboard and add-in card, or AIC, customers from our third-party warehouses in Hong Kong, Israel, and the United States.

NVIDIA Corporation names Alicloud as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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We partnered with industry leaders such as Amazon, Inc., or Amazon, Alphabet Inc., or Alphabet, International Business Machines Corporation, or IBM, Microsoft Corporation, or Microsoft, Oracle Corporation, or Oracle, SAP SE, and VMware Inc. to bring AI to enterprise users. We also have partnerships in transportation, retail, healthcare, and manufacturing, among others, to accelerate the adoption of AI. At the foundation of the NVIDIA accelerated computing platform are our GPUs, which excel at parallel workloads such as the training and inferencing of neural networks. They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud; as well as in our DGX AI supercomputer, a purpose-built system for deep learning and GPU accelerated applications. To facilitate customer adoption, we have also built other ready-to-use system reference designs around our GPUs, including HGX for hyperscale and supercomputing data centers, EGX for enterprise and edge computing, and AGX for autonomous machines.

NVIDIA Corporation names Amazon Web Services, Inc. as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 59750 to 60115; re-found.

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NVIDIA Corporation names ARM HOLDINGS PLC as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2023-02-24 (this filer's naming: stale); last named 2021-02-26; not named in NVIDIA Corporation's 2026-02-25 filing as read.

The $2 billion paid upon signing was allocated between advanced consideration for the acquisition of $1.36 billion and the prepayment of intellectual property licenses from Arm of $0.17 billion and royalties of $0.47 billion, both with a 20-year term.

From NVIDIA CORP ORATION's 10-K filed 2021-02-26, accession 000104581021000010, period January 31, 2021, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 155414 to 155665; re-found.

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The transaction includes a potential earn out, which is contingent on the achievement of certain financial performance targets by Arm during the fiscal year ending March 31, 2022. If the financial performance targets are achieved, Softbank can elect to receive either up to an additional $5 billion in cash or up to an additional 10.3 million shares of our common stock. We will issue up to $1.5 billion in restricted stock units to Arm employees after closing. The $2 billion paid upon signing was allocated between advanced consideration for the acquisition of $1.36 billion and the prepayment of intellectual property licenses from Arm of $0.17 billion and royalties of $0.47 billion, both with a 20-year term. The closing of the acquisition is subject to customary closing conditions, including receipt of specified governmental and regulatory consents and approvals and expiration of any related mandatory waiting period, and Arm's implementation of the reorganization and distribution of Arm’s IoT Services Group and certain other assets and liabilities.

ASE Technology Holding Co., Ltd. names NVIDIA Corporation as its end customer; State stale since 2014-04-17 (this filer's naming: stale); last named 2012-04-20; not named in ASE Technology Holding Co., Ltd.'s 2026-04-01 filing as read.

The following table sets forth some of our largest customers, in alphabetical order, categorized by the principal end-use applications of the products which we package and test for them. Communications Computing Consumer Electronics/Industrial/Automotive Atmel Corporation Avago Technologies Broadcom Corporation Cambridge Silicon Radio Limited Media Tek Inc. Micron Technology, Inc. Qualcomm Incorporated Spreadtrum Communications, Inc. Atmel Corporation Lenovo Computer Ltd. Marvell Technology Group Ltd. NVIDIA Corporation

From ASE Technology Holding Co., Ltd.'s 20-F filed 2012-04-20, accession 000095010312002055, period December 31, 2011, under Item 4. Information on the Company; characters 182292 to 182928; re-found.

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NVIDIA Corporation names ASUSTeK Computer Inc. as its channel customer; State stale since 2019-02-21 (this filer's naming: stale); last named 2017-03-01; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Sales to ASUSTeK Computer Inc. accounted for 12% of our total revenue for fiscal year 2017

From NVIDIA CORPORATION's 10-K filed 2017-03-01, accession 000104581017000027, period January 29, 2017, under ITEM 1. BUSINESS; characters 30052 to 30142; re-found.

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We believe that the depth and quality of our design support are keys to improving our partner network’s time-to-market, maintaining a high level of customer satisfaction and fostering relationships that encourage our end customers and partner network to use the next generation of our products within each platform. As a result of our partner network strategy, a small number of customers within that network represent the majority of our sold to revenue. Sales to ASUSTeK Computer Inc. accounted for 12% of our total revenue for fiscal year 2017 . To encourage software title developers and publishers to develop games optimized for platforms utilizing our products, and enterprise applications optimized for our GPUs, we seek to establish and maintain strong relationships in the software development community.

NVIDIA Corporation names AUDI AG as its end customer; State stale since 2018-02-28 (this filer's naming: stale); last named 2016-03-17; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We were featured in new production vehicles and concept cars with NVIDIA-powered digital cockpits, including Mercedes-Benz, Audi, Porsche, Bentley and Honda, at the International Auto Show in Frankfurt

From NVIDIA CORPORATION's 10-K filed 2016-03-17, accession 000104581016000205, period January 31, 2016, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 107047 to 107248; re-found.

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Tegra Processor Business For the automotive market, we are partnering with several companies to use our NVIDIA DRIVE PX platform - a car computer that utilizes deep learning to enable self-driving capabilities - in their autonomous driving efforts. We launched NVIDIA DRIVE™ PX 2, a powerful engine for in-vehicle artificial intelligence and announced that Volvo will use DRIVE PX 2 in their autonomous-car pilot program next year. We were featured in new production vehicles and concept cars with NVIDIA-powered digital cockpits, including Mercedes-Benz, Audi, Porsche, Bentley and Honda, at the International Auto Show in Frankfurt, Germany, and also furthered our relationship with Tesla Motors, which introduced the Model X equipped with an NVIDIA-powered infotainment system and digital instrument cluster. During fiscal year 2016, we launched the NVIDIA SHIELD Android TV device and GeForce NOW, which allows players to stream video games from the cloud to their SHIELD devices.

NVIDIA Corporation names AutoX as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with robotaxis including Cruise, Amazon Zoox, Pony.ai and AutoX

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 172809 to 172872; re-found.

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32 Table of Contents In our Automotive platform, we unveiled the NVIDIA DRIVE Atlan next-generation SOC; announced design wins with Mercedes-Benz for the AI cockpit in its new EQS sedan; with Volvo Cars for the autonomous driving computer in its next-generation cars, beginning with the XC90 in 2022; with energy vehicles from R-Auto, IM Motors, NIO, Faraday Future, VinFast and Xpeng; with robotaxis including Cruise, Amazon Zoox, Pony.ai and AutoX; with autonomous trucking companies Embark, Kodiak Robotics and Plus; formed a multi-year partnership with Jaguar Land Rover to jointly develop and deliver next-generation automated driving systems, plus AI-enabled services and experiences; and announced that Desay, Flex, Quanta, Valeo and ZF are using the NVIDIA DRIVE Hyperion platform to manufacture safe and secure AV systems for vehicle …

NVIDIA Corporation names Baidu Cloud as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Bentley as its end customer; State stale since 2018-02-28 (this filer's naming: stale); last named 2016-03-17; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We were featured in new production vehicles and concept cars with NVIDIA-powered digital cockpits, including Mercedes-Benz, Audi, Porsche, Bentley and Honda, at the International Auto Show in Frankfurt

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BlackBerry Limited names NVIDIA Corporation as its end customer; State stale since 2021-03-31 (this filer's naming: stale); last named 2019-04-05; not named in BlackBerry Limited's 2026-04-09 filing as read.

Announced that NVIDIA Corporation selected BlackBerry QNX to be the software foundation for its functionally safe self-driving development platform

From BlackBerry Limited's 40-F filed 2019-04-05, accession 000107023519000014, period February 28, 2019; characters 16777 to 16924; re-found.

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… (“BlackBerry QNX”) for use in virtual cockpit controllers, telematics, electronic control gateways, digital instrument clusters and infotainment systems, and to optimize the Company’s over-the-air (“OTA”) software and secure credential management services for use with select Qualcomm modems; • Announced a commercial partnership agreement with Delphi Automotive PLC (now Aptiv) to provide the operating system for its autonomous driving system; • Selected by Baidu to power Baidu’s Apollo autonomous driving open platform, CarLife infotainment platform and DuerOS artificial intelligence system; • Announced that NVIDIA Corporation selected BlackBerry QNX to be the software foundation for its functionally safe self-driving development platform; • Announced that, in partnership with DENSO Corporation, the Company has developed the world’s first integrated Human Machine Interface platform for automobiles; • Added numerous Gold-level partners to the BlackBerry Enterprise Partner Program, furthering the Company’s commitment to establishing and growing its global ecosystem of enterprise software partners and developers; • Entered into a …

NVIDIA Corporation names Bosch as its end customer; State stale since 2021-02-26 (this filer's naming: stale); last named 2019-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced that Daimler and Bosch have selected NVIDIA’s DRIVE platform to bring automated and driverless vehicles to city streets.

From NVIDIA CORPORATION's 10-K filed 2019-02-21, accession 000104581019000023, period January 27, 2019, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 114417 to 114547; re-found.

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Tegra Processor Business During fiscal year 2019, for the automotive market, we introduced the NVIDIA DRIVE AutoPilot Level 2+ automated driving system, announced NVIDIA DRIVE AGX design wins with Toyota, Volvo Cars and Isuzu Motors, and announced that Daimler and Bosch have selected NVIDIA’s DRIVE platform to bring automated and driverless vehicles to city streets. We also began production of our Xavier single-chip autopilot SOC, started shipping the NVIDIA DRIVE AGX Xavier developer kit, and introduced the NVIDIA DRIVE Constellation server with DRIVE Sim software to safely test drive autonomous vehicles over billions of miles in virtual reality by leveraging NVIDIA GPUs and NVIDIA DRIVE Pegasus.

NVIDIA Corporation names BYD Auto Co. Ltd. as its assembly and test provider and contract manufacturer; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 59750 to 60115; re-found.

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then ship the semiconductors to contract manufacturers, such as BYD Auto and Hon Hai

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60958 to 61042; re-found.

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NVIDIA Corporation names BYD Company Limited as its end customer; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced further adoption of NVIDIA DRIVE platform with BYD, XPENG, GWM, Li Auto, ZEEKR and Xiaomi.

From NVIDIA CORP ORATION's 10-K filed 2024-02-21, accession 000104581024000029, period January 28, 2024, under Item 7. Management's Discussion and Analysis of Financial Condition and Results of Operations; characters 211717 to 211817; re-found.

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Automotive revenue for fiscal year 2024 was $1.1 billion, up 21% from fiscal year 2023. In Automotive, we announced a partnership with MediaTek, which will develop mainstream automotive systems on chips for global OEMs integrating a new NVIDIA GPU chiplet IP for AI and graphics. We furthered our collaboration with Foxconn to develop next-generation 36 Table of Contents electric vehicles, and announced further adoption of NVIDIA DRIVE platform with BYD, XPENG, GWM, Li Auto, ZEEKR and Xiaomi. Critical Accounting Estimates Our consolidated financial statements are prepared in accordance with accounting principles generally accepted in the United States, or U.S. GAAP. The preparation of these financial statements requires us to make estimates and judgments that affect the reported amounts of assets, liabilities, revenue, cost of revenue, expenses and related disclosure of contingencies.

NVIDIA Corporation names Chroma ATE Inc. as its supplier; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

test equipment purchased from industry-leading suppliers such as Advantest America Inc. and Chroma ATE Inc.

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60845 to 60952; re-found.

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NVIDIA Corporation names Cisco Systems, Inc. as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Cruise as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with robotaxis including Cruise, Amazon Zoox, Pony.ai and AutoX

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NVIDIA Corporation names Dell Technologies Inc. as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Desay as its contract-manufacturer customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced that Desay, Flex, Quanta, Valeo and ZF are using the NVIDIA DRIVE Hyperion platform to manufacture safe and secure AV systems for vehicle makers.

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… SOC; announced design wins with Mercedes-Benz for the AI cockpit in its new EQS sedan; with Volvo Cars for the autonomous driving computer in its next-generation cars, beginning with the XC90 in 2022; with energy vehicles from R-Auto, IM Motors, NIO, Faraday Future, VinFast and Xpeng; with robotaxis including Cruise, Amazon Zoox, Pony.ai and AutoX; with autonomous trucking companies Embark, Kodiak Robotics and Plus; formed a multi-year partnership with Jaguar Land Rover to jointly develop and deliver next-generation automated driving systems, plus AI-enabled services and experiences; and announced that Desay, Flex, Quanta, Valeo and ZF are using the NVIDIA DRIVE Hyperion platform to manufacture safe and secure AV systems for vehicle makers. Critical Accounting Policies and Estimates Management’s discussion and analysis of financial condition and results of operations are based upon our consolidated financial statements, which have been prepared in accordance with accounting principles generally accepted in the United States, or U.S. GAAP.

NVIDIA Corporation names Dr. Ing. h.c. F. Porsche AG as its end customer; State stale since 2018-02-28 (this filer's naming: stale); last named 2016-03-17; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We were featured in new production vehicles and concept cars with NVIDIA-powered digital cockpits, including Mercedes-Benz, Audi, Porsche, Bentley and Honda, at the International Auto Show in Frankfurt

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NVIDIA Corporation names Einride as its end customer; State stale since 2023-02-24 (this filer's naming: stale); last named 2021-02-26; not named in NVIDIA Corporation's 2026-02-25 filing as read.

driving technology is powering a range of electric vehicles from carmakers SAIC, Nio, Li Auto, Xpeng, robotaxi-maker Zoox, and cabless truck-maker Einride

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In our Automotive platform, we announced with Mercedes-Benz that the automaker will launch software-defined, intelligent vehicles using end-to-end NVIDIA technology starting in 2024; announced that NVIDIA DRIVE autonomous 31 Table of Contents driving technology is powering a range of electric vehicles from carmakers SAIC, Nio, Li Auto, Xpeng, robotaxi-maker Zoox, and cabless truck-maker Einride; announced that NVIDIA is powering the new Mercedes-Benz AI cockpit in the first half of 2021; announced that Hyundai Motor Group’s entire lineup of Hyundai, Kia and Genesis models will come standard with NVIDIA DRIVE in-vehicle infotainment systems starting in 2022; and expanded the NVIDIA DRIVE sensor ecosystem with new solutions.

NVIDIA Corporation names Embark as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with autonomous trucking companies Embark, Kodiak Robotics and Plus

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NVIDIA Corporation names Faraday Future as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with energy vehicles from R-Auto, IM Motors, NIO, Faraday Future, VinFast and Xpeng

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In our Professional Visualization platform, we unveiled NVIDIA RTX GPUs for next-generation notebook and desktop workstations; and launched NVIDIA Omniverse Enterprise for collaborative 3D design, digital twins and virtual worlds and NVIDIA Omniverse for Creators. 32 Table of Contents In our Automotive platform, we unveiled the NVIDIA DRIVE Atlan next-generation SOC; announced design wins with Mercedes-Benz for the AI cockpit in its new EQS sedan; with Volvo Cars for the autonomous driving computer in its next-generation cars, beginning with the XC90 in 2022; with energy vehicles from R-Auto, IM Motors, NIO, Faraday Future, VinFast and Xpeng; with robotaxis including Cruise, Amazon Zoox, Pony.ai and AutoX; with autonomous trucking companies Embark, Kodiak Robotics and Plus; formed a multi-year partnership with Jaguar Land Rover to jointly develop and deliver next-generation automated driving systems, plus AI-enabled services and experiences; and announced that Desay, Flex, Quanta, Valeo and ZF are using the NVIDIA DRIVE Hyperion …

NVIDIA Corporation names Flex Ltd. as its contract manufacturer; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We use contract manufacturers such as Flex Ltd., Jabil Inc., and Universal Scientific Industrial Co., Ltd., to manufacture our standard and custom adapter card products and switch systems, and Fabrinet to manufacture our

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60131 to 60351; re-found.

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We utilize suppliers, such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Electronics Co. Ltd, to produce our semiconductor wafers. We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products and platforms. We use contract manufacturers such as Flex Ltd., Jabil Inc., and Universal Scientific Industrial Co., Ltd., to manufacture our standard and custom adapter card products and switch systems, and Fabrinet to manufacture our networking cables. We purchase substrates from Ibiden Co. Ltd., Kinsus Interconnect Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., or Samsung, and SK Hynix. We often consign key components or materials such as the GPU, SoC, memory, and integrated circuit to the contract manufacturers.

NVIDIA Corporation names Flex Ltd. as its contract-manufacturer customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced that Desay, Flex, Quanta, Valeo and ZF are using the NVIDIA DRIVE Hyperion platform to manufacture safe and secure AV systems for vehicle makers.

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NVIDIA Corporation names Fujitsu Limited as its end customer; State stale since 2015-03-12 (this filer's naming: stale); last named 2013-03-12; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Fujitsu's Arrows X, a quad-core LTE smartphone powered by Tegra 3

From NVIDIA CORPORATION's 10-K filed 2013-03-12, accession 000104581013000008, period January 27, 2013, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 159161 to 159226; re-found.

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Additionally, we launched the GRID VGX, a first-of-its kind technology, which makes it possible to access graphics-intensive applications on a remote server from virtually any computing device, anywhere by connecting to the cloud, instead of on a local PC or workstation. With our new GRID VGX product line, we are leveraging GPUs beyond the PC into the server. Tegra Processor Business During fiscal year 2013, the first Tegra 3 phone, the HTC One X, was launched. Further, Fujitsu's Arrows X, a quad-core LTE smartphone powered by Tegra 3, began shipping into Japan in the second quarter of fiscal year 2013. During fiscal year 2013, Google launched its Nexus 7 tablet powered by our Tegra 3. Nexus was the first device to run Jelly Bean, the latest version of the Android operating system.

NVIDIA Corporation names Google Cloud as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names GWM (Great Wall Motor) as its end customer; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced further adoption of NVIDIA DRIVE platform with BYD, XPENG, GWM, Li Auto, ZEEKR and Xiaomi.

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NVIDIA Corporation names Hewlett Packard Enterprise Company as its end customer; State current since 2025-12-18 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Hitachi Vantara as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Honda as its end customer; State stale since 2018-02-28 (this filer's naming: stale); last named 2016-03-17; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We were featured in new production vehicles and concept cars with NVIDIA-powered digital cockpits, including Mercedes-Benz, Audi, Porsche, Bentley and Honda, at the International Auto Show in Frankfurt

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NVIDIA Corporation names HP Inc. as its end customer; State current since 2025-12-10 (this filer's naming: stale); last named 2015-03-12; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Our Tegra K1 processor was featured in Google’s Nexus 9 and Project Tango tablets, in NVIDIA's SHIELD tablet and in Chromebooks made by Acer and HP, and was one of the first processors to support Android TV.

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NVIDIA Corporation names HTC Corporation as its end customer; State stale since 2014-03-13 (this filer's naming: stale); last named 2012-03-13; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Tegra 3 phones have been announced by HTC, LG, Fujitsu, ZTE and Tianyu.

From NVIDIA CORPORATION's 10-K filed 2012-03-13, accession 000104581012000013, period January 29, 2012, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 170223 to 170294; re-found.

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Another notable innovation is DirectTouch, which significantly improves the responsiveness of touch-screen user interfaces on devices and simultaneously reduces costs for the device manufacturer. Our software expertise makes both of these inventions completely transparent to the operating system; that is, neither the operating system nor the application developer has to know about them for users to benefit from them. 38 Table of Contents Tegra 3 is currently available to consumers in the Asus Transformer Prime, with additional products expected throughout calendar year 2012. Tegra 3 phones have been announced by HTC, LG, Fujitsu, ZTE and Tianyu. Tegra 3 tablets have been announced from ASUS, Acer, Fujitsu, Lenovo, Toshiba and ZTE and we continue to work with a number of other device makers on Tegra 3-powered devices. In addition, ZTE, the world's fourth-largest cell phone manufacturer, has announced the first phone to use an Icera baseband processor.

NVIDIA Corporation names Hyundai as its end customer; State stale since 2023-02-24 (this filer's naming: stale); last named 2021-02-26; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced that Hyundai Motor Group’s entire lineup of Hyundai, Kia and Genesis models will come standard with NVIDIA DRIVE in-vehicle infotainment systems starting in 2022

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NVIDIA Corporation names Ibiden Co., Ltd. as its supplier; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We purchase substrates from Ibiden Co. Ltd., Kinsus Interconnect Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., or Samsung, and SK Hynix.

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60371 to 60587; re-found.

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We use contract manufacturers such as Flex Ltd., Jabil Inc., and Universal Scientific Industrial Co., Ltd., to manufacture our standard and custom adapter card products and switch systems, and Fabrinet to manufacture our networking cables. We purchase substrates from Ibiden Co. Ltd., Kinsus Interconnect Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., or Samsung, and SK Hynix. We often consign key components or materials such as the GPU, SoC, memory, and integrated circuit to the contract manufacturers.

NVIDIA Corporation names IBM Cloud as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names IM Motors as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with energy vehicles from R-Auto, IM Motors, NIO, Faraday Future, VinFast and Xpeng

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NVIDIA Corporation names Inspur Group Co., Ltd. as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Intel Corporation as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2015-03-12 (this filer's naming: stale); last named 2013-03-12; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Under the License Agreement, Intel has granted to NVIDIA and its qualified subsidiaries, and NVIDIA has granted to Intel and Intel’s qualified subsidiaries, a non-exclusive, non-transferable, worldwide license

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Accordingly, we do not reasonably expect any material effect on our business, as a whole, or to our financial flexibility with respect to our current cash balances held outside of the United States. Patent Cross License Agreement On January 10, 2011, we entered into a six-year patent cross licensing agreement, or the License Agreement, with Intel. Under the License Agreement, Intel has granted to NVIDIA and its qualified subsidiaries, and NVIDIA has granted to Intel and Intel’s qualified subsidiaries, a non-exclusive, non-transferable, worldwide license, without the right to sublicense to all patents that are either owned or controlled by the parties at any time that have a first filing date on or before March 31, 2017, to make, have made (subject to certain limitations), use, sell, offer to sell, import and otherwise dispose of certain semiconductor- and electronic-related products anywhere in the world.

NVIDIA Corporation names Intel Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2015-03-12 (this filer's naming: stale); last named 2013-03-12; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Under the License Agreement, Intel will pay NVIDIA an aggregate amount of $1.5 billion, payable in annual installments, as follows: a $300 million payment on each of January 18, 2011, January 13, 2012 and January 15, 2013 and a $200 million payment on each of January 15, 2014, 2015 and 2016.

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NVIDIA’s rights to Intel’s patents have certain specified limitations, including but not limited to, NVIDIA was not granted a license to: (1) certain microprocessors, defined in the License Agreement as “Intel Processors” or “Intel Compatible Processors;” (2) certain chipsets that connect to Intel Processors; or (3) certain flash memory products. In connection with the License Agreement, NVIDIA and Intel mutually agreed to settle all outstanding legal disputes. Under the License Agreement, Intel will pay NVIDIA an aggregate amount of $1.5 billion, payable in annual installments, as follows: a $300 million payment on each of January 18, 2011, January 13, 2012 and January 15, 2013 and a $200 million payment on each of January 15, 2014, 2015 and 2016. Please refer to Note 3 of the Notes to the Consolidated Financial Statements in Part IV, Item 15 of this Annual Report on Form 10-K for further information regarding this cross license and the settlement.

Intel Corporation names NVIDIA Corporation as its end customer; State stale since 2026-01-23 (this filer's naming: stale); last named 2024-01-26; not named in Intel Corporation's 2026-01-23 filing as read.

The combination of expanded partnerships and RAMP-C enables customers to develop and fabricate chips on Intel 18A, including customers such as Nvidia, IBM, Microsoft, Boeing, and Northrop Grumman.

From INTEL CORPORATION's 10-K filed 2024-01-26, accession 000005086324000010, period December 30, 2023; characters 176087 to 176283; re-found.

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The Synopsys agreement expands the development of a portfolio of IP on Intel 3 and Intel 18A. These agreements and the IFS accelerator program are expected to enable customers to design using a robust suite of EDA and IP across IFS nodes, similar to the way they would design with their existing foundry supplier. ■ We expanded partnerships under the Rapid Assured Microelectronics Prototypes-Commercial (RAMP-C) program created by the US Department of Defense in 2021 to assure domestic access to leading-edge technology and the US-based foundry ecosystem. The combination of expanded partnerships and RAMP-C enables customers to develop and fabricate chips on Intel 18A, including customers such as Nvidia, IBM, Microsoft, Boeing, and Northrop Grumman. ■ We announced a commercial agreement with Tower, pursuant to which we are expected to provide foundry services and manufacturing capacity through our New Mexico advanced manufacturing facility for 300mm advanced analog processing.

NVIDIA Corporation names Isuzu Motors as its end customer; State stale since 2021-02-26 (this filer's naming: stale); last named 2019-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced NVIDIA DRIVE AGX design wins with Toyota, Volvo Cars and Isuzu Motors

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NVIDIA Corporation names Jabil Inc. as its contract manufacturer; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We use contract manufacturers such as Flex Ltd., Jabil Inc., and Universal Scientific Industrial Co., Ltd., to manufacture our standard and custom adapter card products and switch systems, and Fabrinet to manufacture our

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60131 to 60351; re-found.

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NVIDIA Corporation names JSI Logistics Ltd. as its assembly and test provider; State stale since 2022-03-18 (this filer's naming: stale); last named 2020-02-20; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, Inc., Amkor Technology, BYD Auto Co. Ltd., Hon Hai Precision Industry Co., Ltd., JSI Logistics Ltd., King Yuan Electronics Co., Ltd., and Siliconware Precision Industries Company Ltd. to perform assembly, testing, and packaging of most of our products

From NVIDIA CORP ORATION's 10-K filed 2020-02-20, accession 000104581020000010, period January 26, 2020, under ITEM 1. BUSINESS; characters 62249 to 62588; re-found.

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While we may directly procure certain raw materials used in the production of our products, such as substrates and a variety of components, our suppliers are responsible for procurement of the majority of the raw materials used in the production of our products. As a result, we can focus our resources on product design, additional quality assurance, marketing, and customer support. We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Electronics Co. Ltd, to produce our semiconductor wafers. We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, Inc., Amkor Technology, BYD Auto Co. Ltd., Hon Hai Precision Industry Co., Ltd., JSI Logistics Ltd., King Yuan Electronics Co., Ltd., and Siliconware Precision Industries Company Ltd. to perform assembly, testing, and packaging of most of our products and platforms. We purchase substrates from IbidenCo. Ltd., Kinsus Interconnect Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., and SK Hynix.

NVIDIA Corporation names King Yuan Electronics Co., Ltd. as its assembly and test provider; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 59750 to 60115; re-found.

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NVIDIA Corporation names Kinsus Interconnect Technology Corporation as its supplier; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We purchase substrates from Ibiden Co. Ltd., Kinsus Interconnect Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., or Samsung, and SK Hynix.

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60371 to 60587; re-found.

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NVIDIA Corporation names Kodiak Robotics as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with autonomous trucking companies Embark, Kodiak Robotics and Plus

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NVIDIA Corporation names Lenovo Group Limited as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names LG Electronics Inc. as its end customer; State stale since 2014-03-13 (this filer's naming: stale); last named 2012-03-13; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Tegra 3 phones have been announced by HTC, LG, Fujitsu, ZTE and Tianyu.

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NVIDIA Corporation names Li Auto Inc. as its end customer; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced further adoption of NVIDIA DRIVE platform with BYD, XPENG, GWM, Li Auto, ZEEKR and Xiaomi.

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NVIDIA Corporation names MediaTek Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

we announced a partnership with MediaTek, which will develop mainstream automotive systems on chips for global OEMs integrating a new NVIDIA GPU chiplet IP for AI and graphics.

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Professional Visualization revenue for fiscal year 2024 was $1.6 billion, up 1% from fiscal year 2023. In Professional Visualization, we announced new GPUs based on the NVIDIA RTX Ada Lovelace architecture, and announced NVIDIA Omniverse Cloud, a fully managed service running in Microsoft Azure, for the development and deployment of industrial metaverse applications. Automotive revenue for fiscal year 2024 was $1.1 billion, up 21% from fiscal year 2023. In Automotive, we announced a partnership with MediaTek, which will develop mainstream automotive systems on chips for global OEMs integrating a new NVIDIA GPU chiplet IP for AI and graphics. We furthered our collaboration with Foxconn to develop next-generation 36 Table of Contents electric vehicles, and announced further adoption of NVIDIA DRIVE platform with BYD, XPENG, GWM, Li Auto, ZEEKR and Xiaomi. Critical Accounting Estimates Our consolidated financial statements are prepared in accordance with accounting principles generally accepted in the United States, or U.S. GAAP.

NVIDIA Corporation names Mercedes-Benz as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced design wins with Mercedes-Benz for the AI cockpit in its new EQS sedan

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NVIDIA Corporation names Meta Platforms, Inc. as its end customer; State stale since 2020-02-20 (this filer's naming: stale); last named 2018-02-28; not named in NVIDIA Corporation's 2026-02-25 filing as read.

These organizations include the world’s leading cloud services companies such as Amazon, Baidu, and Facebook, which are infusing AI in applications that enable highly accurate voice recognition and real-time translation

From NVIDIA CORPORATION's 10-K filed 2018-02-28, accession 000104581018000010, period January 28, 2018, under ITEM 1. BUSINESS; characters 22609 to 22828; re-found.

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GPUs excel at parallel workloads, speeding applications by 10-75x compared with CPUs, reducing each of the many data training iterations from weeks to days. In the past year alone, GPUs have sped up training of deep neural networks for AI by as much as 12x. We are engaged with thousands of organizations working on AI in a multitude of industries, from automating tasks such as reading medical images, to enabling fraud detection in financial services, to optimizing oil exploration and drilling. These organizations include the world’s leading cloud services companies such as Amazon, Baidu, and Facebook, which are infusing AI in applications that enable highly accurate voice recognition and real-time translation; enterprises that are increasingly turning to AI to improve products and services; and startups seeking to implement AI in disruptive ways across multiple industries. We have partnered with industry leaders such as IBM, Microsoft, and SAP to bring AI to enterprise users. We also have partnerships in healthcare and manufacturing, among others, to accelerate the adoption of AI.

NVIDIA Corporation names Microsoft Azure as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Microsoft Corporation as its supplier; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced NVIDIA Omniverse Cloud, a fully managed service running in Microsoft Azure, for the development and deployment of industrial metaverse applications.

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Additionally, we released TensorRT-LLM for Windows and launched GeForce RTX 40-Series SUPER GPUs. Gaming reached a milestone of 500 AI-powered RTX games and applications utilizing NVIDIA DLSS, ray tracing and other NVIDIA RTX technologies. Professional Visualization revenue for fiscal year 2024 was $1.6 billion, up 1% from fiscal year 2023. In Professional Visualization, we announced new GPUs based on the NVIDIA RTX Ada Lovelace architecture, and announced NVIDIA Omniverse Cloud, a fully managed service running in Microsoft Azure, for the development and deployment of industrial metaverse applications. Automotive revenue for fiscal year 2024 was $1.1 billion, up 21% from fiscal year 2023. In Automotive, we announced a partnership with MediaTek, which will develop mainstream automotive systems on chips for global OEMs integrating a new NVIDIA GPU chiplet IP for AI and graphics.

NVIDIA Corporation names Nanya Technology Corporation as its supplier; State stale since 2020-02-20 (this filer's naming: stale); last named 2018-02-28; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We purchase substrates from IbidenCo. Ltd., Nanya Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., and SK Hynix.

From NVIDIA CORPORATION's 10-K filed 2018-02-28, accession 000104581018000010, period January 28, 2018, under ITEM 1. BUSINESS; characters 37840 to 38029; re-found.

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We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Electronics Co. Ltd, to produce our semiconductor wafers. We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, Inc., BYD Auto Co. Ltd., Hon Hai Precision Industry Co., Ltd., JSI Logistics Ltd., King Yuan Electronics Co., Ltd., and Siliconware Precision Industries Company Ltd. to perform assembly, testing, and packaging of most of our products and platforms. We purchase substrates from IbidenCo. Ltd., Nanya Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., and SK Hynix. We typically receive semiconductor products from our subcontractors, perform incoming quality assurance, and then ship the semiconductors to contract equipment manufacturers, or CEMs, distributors, motherboard and AIB customers from our third-party warehouse in Hong Kong.

NVIDIA Corporation names Nintendo as its end customer; State stale since 2020-02-20 (this filer's naming: stale); last named 2018-02-28; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Tegra processor business revenue includes SOC modules for the Nintendo Switch gaming console and development services.

From NVIDIA CORPORATION's 10-K filed 2018-02-28, accession 000104581018000010, period January 28, 2018, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 108162 to 108280; re-found.

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Professional visualization revenue grew 12% year over year to $934 million, led by ultra-high-end and high-end desktop workstations, as well as unique form factors and emerging opportunities, including AI, deep learning, VR and rendering. 23 Table of Contents Tegra processor business revenue was $1.53 billion, up 86% from a year ago. Tegra processor business revenue includes SOC modules for the Nintendo Switch gaming console and development services. Also included was automotive revenue of $558 million, which was up 15% from a year earlier, incorporating infotainment modules, production DRIVE PX platforms, and development agreements for self-driving cars. Revenue from our patent license agreement with Intel concluded in the first quarter of fiscal year 2018 .

NVIDIA Corporation names NIO Inc. as its end customer; State current since 2026-04-10 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with energy vehicles from R-Auto, IM Motors, NIO, Faraday Future, VinFast and Xpeng

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NVIDIA Corporation names Omni Logistics, LLC as its assembly and test provider; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 59750 to 60115; re-found.

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ON Semiconductor Corporation names NVIDIA Corporation as its end customer; State stale since 2020-02-19 (this filer's naming: stale); last named 2018-02-21; not named in ON Semiconductor Corporation's 2026-02-09 filing as read.

Philips Nvidia Magneti Marelli

From ON SEMICONDUCTOR CORPORATION's 10-K filed 2018-02-21, accession 000119312518051397, period December 31, 2017, under Item 1. Business; characters 31176 to 31222; re-found.

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… Boston Scientific Cisco Facebook Dell Computer Delphi Delta Electronics Ericsson Google Delta Electronics, Inc. Denso Corporation Emerson Electric Co Huawei Tech Co., Ltd. Gree, Inc. Foxconn Hella General Electric Co Lenovo Microsoft Google Hyundai Mobis Co., Ltd. Hikvision Digital Technology Co., Ltd. Nokia Solutions and Networks Midea Hewlett Packard Co Magna International Honeywell Inc. Samsung Electronics Philips Nvidia Magneti Marelli Medtronic Sony Mobile Samsung Electronics Microsoft Tesla Philips ZTE Hong Kong Ltd Sony Corp Quanta Valeo Schneider Electric Seagate Technology Visteon Siemens Industrial 11 Table of Contents …

NVIDIA Corporation names Oracle Cloud as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Plus as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with autonomous trucking companies Embark, Kodiak Robotics and Plus

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NVIDIA Corporation names Pony AI Inc. as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with robotaxis including Cruise, Amazon Zoox, Pony.ai and AutoX

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NVIDIA Corporation names Quanta as its contract manufacturer; State stale since 2022-03-18 (this filer's naming: stale); last named 2020-02-20; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We also utilize industry-leading contract manufacturers, or CMs, such as BYD and Hon Hai Precision Industry Co., and ODMs such as Quanta Computer and Wistron Corporation, to manufacture some of our products for sale directly to end customers

From NVIDIA CORP ORATION's 10-K filed 2020-02-20, accession 000104581020000010, period January 26, 2020, under ITEM 1. BUSINESS; characters 63308 to 63549; re-found.

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We typically receive semiconductor products from our subcontractors, perform incoming quality assurance and configuration, and then ship the semiconductors to contract equipment manufacturers, or CEMs, distributors, motherboard and AIB customers from our third-party warehouse in Hong Kong. Generally, these manufacturers assemble and test the boards based on our design kit and test specifications, and then ship our products to retailers, system builders, or OEMs as motherboard and AIB solutions. We also utilize industry-leading contract manufacturers, or CMs, such as BYD and Hon Hai Precision Industry Co., and ODMs such as Quanta Computer and Wistron Corporation, to manufacture some of our products for sale directly to end customers. In those cases, key elements such as the GPU, SoC and memory are often consigned by us to the CMs, who are responsible for the procurement of other components used in the production process. 9 Table of Contents Working Capital We focus considerable attention on managing our inventories and other working-capital-related items.

NVIDIA Corporation names Quanta as its contract-manufacturer customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced that Desay, Flex, Quanta, Valeo and ZF are using the NVIDIA DRIVE Hyperion platform to manufacture safe and secure AV systems for vehicle makers.

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NVIDIA Corporation names R-Auto as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with energy vehicles from R-Auto, IM Motors, NIO, Faraday Future, VinFast and Xpeng

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Rambus, Inc. names NVIDIA Corporation as its licence customer (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2021-02-26 (this filer's naming: stale); last named 2019-02-22; not named in Rambus, Inc.'s 2026-02-18 filing as read.

For 2018, revenue from Broadcom and NVIDIA each accounted for 10% or more of our total revenue.

From RAMBUS INC.'s 10-K filed 2019-02-22, accession 000091727319000006, period December 31, 2018, under Item 1A. Risk Factors; characters 46399 to 46494; re-found.

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We expect these expenses to increase in the foreseeable future as our technology development efforts continue. 13 Table of Contents Our revenue is concentrated in a few customers, and if we lose any of these customers through contract terminations or acquisitions, our revenue may decrease substantially. We have a high degree of revenue concentration. Our top five customers for each reporting period represented approximately 49%, 55% and 63% of our revenue for the years ended December 31, 2018, 2017 and 2016, respectively. For 2018, revenue from Broadcom and NVIDIA each accounted for 10% or more of our total revenue. For 2017 and 2016, revenue from Micron, Samsung and SK hynix each accounted for 10% or more of our total revenue. We expect to continue to experience significant revenue concentration for the foreseeable future.

NVIDIA Corporation names SAIC as its end customer; State stale since 2023-02-24 (this filer's naming: stale); last named 2021-02-26; not named in NVIDIA Corporation's 2026-02-25 filing as read.

driving technology is powering a range of electric vehicles from carmakers SAIC, Nio, Li Auto, Xpeng, robotaxi-maker Zoox, and cabless truck-maker Einride

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NVIDIA Corporation names Samsung Electronics Co., Ltd. as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2019-02-21 (this filer's naming: stale); last named 2017-03-01; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Also as part of this agreement, NVIDIA and Samsung each received a license to a small number of patents of the other, but no portfolio license was granted nor was any compensation paid by either party.

From NVIDIA CORPORATION's 10-K filed 2017-03-01, accession 000104581017000027, period January 29, 2017, under ITEM 15. EXHIBITS,; characters 277110 to 277311; re-found.

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On May 11, 2016, NVIDIA voluntarily dismissed its petition to the United States Court of Appeals for the Federal Circuit to review the ITC’s decision in Investigation No. 337-TA-932. On May 12, 2016, NVIDIA voluntarily dismissed its Complaint in the United States District Court for the District of Delaware. On May 19, 2016, Samsung filed a Corrected Joint Motion to Terminate Investigation No. 337-TA-941. On June 16, 2016, the ITC granted the joint motion and terminated the ITC investigation. The parties have also moved to dismiss all pending inter partes reviews. Also as part of this agreement, NVIDIA and Samsung each received a license to a small number of patents of the other, but no portfolio license was granted nor was any compensation paid by either party. On June 28, 2016, NVIDIA and Samsung executed a settlement agreement based on the April 28, 2016 memorandum of understanding. NVIDIA’s dismissals on May 11, 2016 and May 12, 2016 also terminated its claims against Qualcomm.

NVIDIA Corporation names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State stale since 2020-02-20 (this filer's naming: stale); last named 2018-02-28; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, Inc., BYD Auto Co. Ltd., Hon Hai Precision Industry Co., Ltd., JSI Logistics Ltd., King Yuan Electronics Co., Ltd., and Siliconware Precision Industries Company Ltd. to perform assembly, testing, and packaging of most of our products

From NVIDIA CORPORATION's 10-K filed 2018-02-28, accession 000104581018000010, period January 28, 2018, under ITEM 1. BUSINESS; characters 37503 to 37824; re-found.

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While we may directly procure certain raw materials used in the production of our products, such as substrates and a variety of components, our suppliers are responsible for procurement of the majority of the raw materials used in the production of our products. As a result, we can focus our resources on product design, additional quality assurance, marketing, and customer support. We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Electronics Co. Ltd, to produce our semiconductor wafers. We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, Inc., BYD Auto Co. Ltd., Hon Hai Precision Industry Co., Ltd., JSI Logistics Ltd., King Yuan Electronics Co., Ltd., and Siliconware Precision Industries Company Ltd. to perform assembly, testing, and packaging of most of our products and platforms. We purchase substrates from IbidenCo. Ltd., Nanya Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., and SK Hynix.

NVIDIA Corporation names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State stale since 2014-04-17 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 59750 to 60115; re-found.

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NVIDIA Corporation names STATS ChipPAC Ltd. as its assembly and test provider; State stale since 2015-03-12 (this filer's naming: stale); last named 2013-03-12; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, Inc., JSI Logistics Ltd., King Yuan Electronics Co., Ltd., Siliconware Precision Industries Company Ltd. and STATS ChipPAC Incorporated to perform assembly, testing and packaging of most of our products

From NVIDIA CORPORATION's 10-K filed 2013-03-12, accession 000104581013000008, period January 27, 2013, under ITEM 1. BUSINESS; characters 33119 to 33409; re-found.

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In addition, this strategy allows us to avoid many of the significant costs and risks associated with owning and operating manufacturing operations. Our suppliers are also responsible for procurement of most of the raw materials used in the production of our products. As a result, we can focus our resources on product design, additional quality assurance, marketing and customer support. 10 Table of Contents We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Company Limited, to produce our semiconductor wafers. We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, Inc., JSI Logistics Ltd., King Yuan Electronics Co., Ltd., Siliconware Precision Industries Company Ltd. and STATS ChipPAC Incorporated to perform assembly, testing and packaging of most of our products. We purchase substrates from Nanya Technology Corporation, IbidenCo., Ltd. and Unimicron Technology Corporation. We typically receive semiconductor products from our subcontractors, perform incoming quality assurance and then ship the semiconductors to CEMs, distributors, motherboard and AIB customers from our third-party warehouse in Hong Kong.

NVIDIA Corporation names Tencent Cloud as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

They are available in industry standard servers from every major computer maker, including Cisco Systems, Inc., or Cisco, Dell Technologies Inc., Hewlett Packard Enterprise Company, or HP, Hitachi Vantara, Inspur Group, and Lenovo Group Limited; from every major cloud service provider such as Alicloud, Amazon Web Services, Baidu Cloud, Google Cloud, IBM Cloud, Microsoft Azure, Oracle Cloud, and Tencent Cloud;

From NVIDIA CORP ORATION's 10-K filed 2022-03-18, accession 000104581022000036, period January 30, 2022, under ITEM 1. BUSINESS; characters 40985 to 41397; re-found.

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NVIDIA Corporation names Tesla, Inc. as its end customer; State stale since 2019-02-21 (this filer's naming: stale); last named 2017-03-01; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced that NVIDIA DRIVE PX 2 will power a new AutoPilot system in all of Tesla Motors’ factory produced vehicles - the Model S, Model X and upcoming Model 3.

From NVIDIA CORPORATION's 10-K filed 2017-03-01, accession 000104581017000027, period January 29, 2017, under ITEM 7. MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS; characters 111506 to 111667; re-found.

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Tegra Processor Business During fiscal year 2017 , for the automotive market, we introduced the HD Mapping platform for self-driving cars, announced that our NVIDIA DRIVE PX 2 platform will power vehicles in the new ROBORACE autonomous car-racing circuit, initiated collaborative research in advanced self-driving technology with New York University’s pioneering deep learning team, and announced that NVIDIA DRIVE PX 2 will power a new AutoPilot system in all of Tesla Motors’ factory produced vehicles - the Model S, Model X and upcoming Model 3. We also announced a number of new partnerships aimed at getting AI-powered cars, trucks and commercial vehicles on the road, including partnerships with Audi, Bosch, Mercedes-Benz, and ZF.

NVIDIA Corporation names Tianyu as its end customer; State stale since 2014-03-13 (this filer's naming: stale); last named 2012-03-13; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Tegra 3 phones have been announced by HTC, LG, Fujitsu, ZTE and Tianyu.

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NVIDIA Corporation names Toshiba Corporation as its end customer; State stale since 2014-03-13 (this filer's naming: stale); last named 2012-03-13; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Tegra 3 tablets have been announced from ASUS, Acer, Fujitsu, Lenovo, Toshiba and ZTE

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Our software expertise makes both of these inventions completely transparent to the operating system; that is, neither the operating system nor the application developer has to know about them for users to benefit from them. 38 Table of Contents Tegra 3 is currently available to consumers in the Asus Transformer Prime, with additional products expected throughout calendar year 2012. Tegra 3 phones have been announced by HTC, LG, Fujitsu, ZTE and Tianyu. Tegra 3 tablets have been announced from ASUS, Acer, Fujitsu, Lenovo, Toshiba and ZTE and we continue to work with a number of other device makers on Tegra 3-powered devices. In addition, ZTE, the world's fourth-largest cell phone manufacturer, has announced the first phone to use an Icera baseband processor. The ZTE Mimosa X uses Tegra 2 and the Icera i450 baseband processor to deliver superphone performance to the large and rapidly growing mainstream market in China.

NVIDIA Corporation names Toyota Motor Corporation as its end customer; State stale since 2021-02-26 (this filer's naming: stale); last named 2019-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced NVIDIA DRIVE AGX design wins with Toyota, Volvo Cars and Isuzu Motors

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NVIDIA Corporation names Unimicron Technology Corporation as its supplier; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We purchase substrates from Ibiden Co. Ltd., Kinsus Interconnect Technology Corporation, and Unimicron Technology Corporation, and memory from Micron Technology, Samsung Semiconductor, Inc., or Samsung, and SK Hynix.

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60371 to 60587; re-found.

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NVIDIA Corporation names Universal Scientific Industrial Co., Ltd. as its contract manufacturer; State stale since 2025-02-26 (this filer's naming: stale); last named 2023-02-24; not named in NVIDIA Corporation's 2026-02-25 filing as read.

We use contract manufacturers such as Flex Ltd., Jabil Inc., and Universal Scientific Industrial Co., Ltd., to manufacture our standard and custom adapter card products and switch systems, and Fabrinet to manufacture our

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 60131 to 60351; re-found.

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NVIDIA Corporation names Valeo SA as its contract-manufacturer customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced that Desay, Flex, Quanta, Valeo and ZF are using the NVIDIA DRIVE Hyperion platform to manufacture safe and secure AV systems for vehicle makers.

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NVIDIA Corporation names VinFast Auto Ltd. as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with energy vehicles from R-Auto, IM Motors, NIO, Faraday Future, VinFast and Xpeng

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NVIDIA Corporation names Volvo Car AB (publ) as its end customer; State stale since 2021-02-26 (this filer's naming: stale); last named 2019-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced NVIDIA DRIVE AGX design wins with Toyota, Volvo Cars and Isuzu Motors

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NVIDIA Corporation names Volvo Car AB (publ) as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with Volvo Cars for the autonomous driving computer in its next-generation cars, beginning with the XC90 in 2022

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NVIDIA Corporation names Xiaomi Corporation as its end customer; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced further adoption of NVIDIA DRIVE platform with BYD, XPENG, GWM, Li Auto, ZEEKR and Xiaomi.

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NVIDIA Corporation names XPeng Inc. as its end customer; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced further adoption of NVIDIA DRIVE platform with BYD, XPENG, GWM, Li Auto, ZEEKR and Xiaomi.

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NVIDIA Corporation names ZEEKR as its end customer; State stale since 2026-02-25 (this filer's naming: stale); last named 2024-02-21; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced further adoption of NVIDIA DRIVE platform with BYD, XPENG, GWM, Li Auto, ZEEKR and Xiaomi.

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NVIDIA Corporation names ZF as its contract-manufacturer customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

announced that Desay, Flex, Quanta, Valeo and ZF are using the NVIDIA DRIVE Hyperion platform to manufacture safe and secure AV systems for vehicle makers.

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NVIDIA Corporation names Zoox as its end customer; State stale since 2024-02-21 (this filer's naming: stale); last named 2022-03-18; not named in NVIDIA Corporation's 2026-02-25 filing as read.

with robotaxis including Cruise, Amazon Zoox, Pony.ai and AutoX

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NVIDIA Corporation names ZTE Corporation as its end customer; State stale since 2014-03-13 (this filer's naming: stale); last named 2012-03-13; not named in NVIDIA Corporation's 2026-02-25 filing as read.

Tegra 3 phones have been announced by HTC, LG, Fujitsu, ZTE and Tianyu.

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The ZTE Mimosa X uses Tegra 2 and the Icera i450 baseband processor

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38 Table of Contents Tegra 3 is currently available to consumers in the Asus Transformer Prime, with additional products expected throughout calendar year 2012. Tegra 3 phones have been announced by HTC, LG, Fujitsu, ZTE and Tianyu. Tegra 3 tablets have been announced from ASUS, Acer, Fujitsu, Lenovo, Toshiba and ZTE and we continue to work with a number of other device makers on Tegra 3-powered devices. In addition, ZTE, the world's fourth-largest cell phone manufacturer, has announced the first phone to use an Icera baseband processor. The ZTE Mimosa X uses Tegra 2 and the Icera i450 baseband processor to deliver superphone performance to the large and rapidly growing mainstream market in China. During the second quarter of fiscal year 2012, we completed the acquisition of Icera, an innovator of baseband processors for 3G and 4G cellular phones and tablets.

QUALCOMM INC (QCOM): current 19, anonymised 1, stale 38, ended 2

current (19)

QUALCOMM INC names Advanced Semiconductor Engineering, Inc. as its assembly and test provider; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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Amkor Technology, Inc. names QUALCOMM INC as its end customer; State current since 2026-02-20 (this filer's naming: current); last named 2026-02-20.

Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 1. Business; characters 92238 to 92372; re-found.

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QUALCOMM INC names Amkor Technology, Inc. as its assembly and test provider; State current since 2026-02-20 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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QUALCOMM INC names Apple Inc. as its end customer; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 73438 to 73550; re-found.

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QUALCOMM INC names ARM HOLDINGS PLC as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

following the acquisition of Nuvia, our architected cores (including all further developments, iterations or instantiations of the technology we acquired from Nuvia) and System-on-Chip (SoC) products incorporating such cores are fully licensed under our existing Architecture License Agreement with Arm (the Qualcomm ALA) and Technology License Agreement with Arm (the Qualcomm TLA).

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 16. Form 10-K Summary; characters 386119 to 386502; re-found.

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Arm is seeking specific performance, including that we cease all use of and destroy any technology that was developed under the Nuvia ALA, including processor core technology (which Arm alleges includes our custom Qualcomm Oryon CPU cores). On September 30, 2022, we filed our Answer and Counterclaim in response to Arm’s complaint denying Arm’s claims. Our counterclaim seeks a declaratory judgment that we did not breach the Nuvia ALA or the Technology License Agreement between Nuvia and Arm, and that, following the acquisition of Nuvia, our architected cores (including all further developments, iterations or instantiations of the technology we acquired from Nuvia) and System-on-Chip (SoC) products incorporating such cores are fully licensed under our existing Architecture License Agreement with Arm (the Qualcomm ALA) and Technology License Agreement with Arm (the Qualcomm TLA). A trial was held beginning on December 16, 2024, and on December 20, 2024, the jury found that (i) Qualcomm did not breach the Nuvia ALA and (ii) Qualcomm CPUs that include designs acquired in the Nuvia acquisition are licensed under the Qualcomm ALA. The jury was unable to reach a verdict with respect to Arm’s claim as to whether Nuvia breached the Nuvia ALA.

CEVA, Inc. names QUALCOMM INC as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-27 (this filer's naming: current); last named 2026-02-27.

Our publicly announced licensees include companies such as Actions, Ambiq, ASPEED, ASR Microelectronics, Atmosic, Beken, Bestechnic, boAt, Broadcom, Ceragon, Cirrus Logic, Espressif Systems, ESWIN, Fujifilm, Rockchip, Goodix, Hisense, iCatch Technology, iCOM, InPlay, Intel, Itron, LG Electronics, LifeSignals, ListenAI, MediaTek, Microchip, Nations Technologies, Nextchip, Nordic Semiconductor, Nothing, Novatek, NXP, onsemi, Oticon, Panasonic, Qualcomm

From CEVA, INC.'s 10-K filed 2026-02-27, accession 000143774926006091, period December 31, 2025, under ITEM 1. BUSINESS; characters 66247 to 66701; re-found.

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Fortinet, Inc. names QUALCOMM INC as its supplier; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

Some of the components important to our business, including certain Central Processing Units (“CPUs”) from Intel Corporation (“Intel”) and Advanced Micro Devices, Inc. (“AMD”), network and wireless chips from Broadcom Inc. (“Broadcom”), Marvell Technology Group Ltd. (“Marvell”), Qualcomm Incorporated (“Qualcomm”) and Intel and memory devices from Intel, Micron Technology (“Micron”), ADATA Technology Co., Ltd. (“ADATA”), Toshiba Corporation (“Toshiba”), Samsung Electronics Co., Ltd. (“Samsung”), and Western Digital Technologies, Inc. (“Western Digital”), are available from limited or sole sources of supply.

From FORTINET, INC.'s 10-K filed 2026-02-25, accession 000126203926000007, period 2025-12-31, under ITEM 1. Business; characters 80561 to 81174; re-found.

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QUALCOMM INC names GLOBALFOUNDRIES Inc. as its foundry; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 57997 to 58203; re-found.

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decrease in revenues from the ending of the recognition of certain upfront license fee consideration in the first quarter of fiscal 2023 from our long-term license agreement with Nokia

From QUALCOMM Incorporated's 10-K filed 2024-11-06, accession 000080432824000075, period September 29, 2024, under Item 7. Management; characters 261723 to 261907; re-found.

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Rambus, Inc. names QUALCOMM INC as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-02-18 (this filer's naming: current); last named 2026-02-18.

Leading semiconductor and electronic system companies, such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents

From RAMBUS INC .'s 10-K filed 2026-02-18, accession 000119312526057101, period December 31, 2025, under Item 1. Business; characters 42010 to 42323; re-found.

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QUALCOMM INC names Samsung Electronics Co., Ltd. as its foundry; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 57997 to 58203; re-found.

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QUALCOMM INC names Samsung Electronics Co., Ltd. as its end customer; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 73438 to 73550; re-found.

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QUALCOMM INC names Semiconductor Manufacturing International Corporation as its foundry; State current since 2024-11-06 (this filer's naming: current); last named 2024-11-06; not named in QUALCOMM INC's 2025-11-05 filing as read.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Global Foundries, Samsung Electronics and Semiconductor Manufacturing International Corporation (SMIC).

From QUALCOMM Incorporated's 10-K filed 2024-11-06, accession 000080432824000075, period September 29, 2024, under Item 1. Business; characters 68772 to 69040; re-found.

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We employ both turnkey and two-stage manufacturing models to purchase our integrated circuits. Under the turnkey model, our foundry suppliers are responsible for delivering fully assembled and tested integrated circuits. Under the two-stage manufacturing model, we purchase die in singular or wafer form from semiconductor manufacturing foundries and contract with separate third parties for manufacturing services such as wafer bump, probe, assembly and the majority of our final test requirements. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Global Foundries, Samsung Electronics and Semiconductor Manufacturing International Corporation (SMIC). Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region.

QUALCOMM INC names Shenzhen Transsion Holdings Limited as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

During the second quarter of fiscal 2025, we executed final agreements for new long-term licenses with two key Chinese OEMs (for which the initial terms had expired) and entered into comprehensive 4G and 5G license agreements with Transsion (a growing, China-headquartered OEM that sells primarily in developing regions). As a result of our agreements with Transsion, all outstanding litigation between the parties has been dismissed.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 7. Management; characters 248130 to 248564; re-found.

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QTL Segment (in millions, except percentages) 2025 2024 Change Licensing revenues $ 5,582 $ 5,572 $ 10 EBT 4,043 4,027 16 EBT as a % of revenues 72 % 72 % — 2025 vs. 2024 QTL licensing revenues and EBT remained approximately flat in fiscal 2025. During the second quarter of fiscal 2025, we executed final agreements for new long-term licenses with two key Chinese OEMs (for which the initial terms had expired) and entered into comprehensive 4G and 5G license agreements with Transsion (a growing, China-headquartered OEM that sells primarily in developing regions). As a result of our agreements with Transsion, all outstanding litigation between the parties has been dismissed. Beginning in the second quarter of fiscal 2025, QTL revenues did not include royalties from Huawei, whose license agreement has expired.

QUALCOMM INC names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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QUALCOMM INC names STATS ChipPAC Ltd. as its assembly and test provider; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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QUALCOMM INC names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 57997 to 58203; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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QUALCOMM INC names Xiaomi Corporation as its end customer; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 73438 to 73550; re-found.

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anonymised (1)

Teradyne, Inc. names QUALCOMM INC as its end customer; State anonymised since 2026-02-19 (this filer's naming: anonymised); last named 2025-02-20; not named in Teradyne, Inc.'s 2026-02-19 filing as read.

In 2022, we estimate consolidated revenues driven by Qualcomm, a customer of our Semiconductor Test, System Test, and Wireless Test operating segments, combining direct and indirect sales, accounted for approximately 11% of our consolidated revenues.

From TERADYNE, INC's 10-K filed 2025-02-20, accession 000095017025023784, period December 31, 2024, under Item 1: B; characters 89673 to 89923; re-found.

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In all cases when an OSAT customer purchases a test system from us, we consider the OSAT as the customer since credit risk, title and risk of loss, among other things, are between Teradyne and the OSAT. In 2024, we estimate consolidated revenues driven by Samsung, a customer of our Semiconductor Test and Wireless Test segments, combining direct and indirect sales, accounted for appropriately 12.5% of our consolidated revenues. In 2023, revenues driven by Texas Instruments Inc., a customer of our Semiconductor Test segment, accounted for 10% of our consolidated revenues. In 2022, we estimate consolidated revenues driven by Qualcomm, a customer of our Semiconductor Test, System Test, and Wireless Test operating segments, combining direct and indirect sales, accounted for approximately 11% of our consolidated revenues. The loss of, or significant decrease in demand from key OEM customers or any of our five largest direct customers, could have a material adverse effect on our business, results of operations and financial condition. We have sales and service offices located throughout North America, Central America, Asia and Europe.

stale (38)

Adeia Inc. names QUALCOMM INC as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2024-02-23 (this filer's naming: stale); last named 2022-02-24; not named in Adeia Inc.'s 2026-02-26 filing as read.

We license a defined and limited set of rights to incorporate our technology onto IC chips, and the IC manufacturers deliver these Xperi-enabled chips to our customers, the consumer electronics product manufacturers. We also work closely with the world’s leading IC manufacturers to support our technologies on the new programmable architectures that enable our customers to deploy our technologies in their consumer electronic products. Our IC partners specialize in key vertical markets and work closely with us to enable our latest technologies for these programmable parts. Together, we license solutions to Xperi’s consumer electronics manufacturers. We have devoted significant time and resources to develop a broad range of solutions with key partners including Amlogic, Analog Devices, Cadence, Cirrus Logic, Mediatek, Mstar, NXP, Qualcomm, Realtek, Synaptics, Texas Instruments, and others.

From ADEA's 10-K filed 2022-02-24, accession 000156459022006778, period December 31, 2021, under Item 1. Business; characters 84859 to 85760; re-found.

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We have licensed our audio technologies and related trademarks to substantially all of the major consumer electronics product manufacturers worldwide. These customers include Denso, Harman, Hisense, LG, Microsoft, Panasonic, Samsung, Sony, and others. Traditionally, our audio technologies are delivered as software code on integrated circuit (“IC”) chips. We license a defined and limited set of rights to incorporate our technology onto IC chips, and the IC manufacturers deliver these Xperi-enabled chips to our customers, the consumer electronics product manufacturers. We also work closely with the world’s leading IC manufacturers to support our technologies on the new programmable architectures that enable our customers to deploy our technologies in their consumer electronic products. Our IC partners specialize in key vertical markets and work closely with us to enable our latest technologies for these programmable parts. Together, we license solutions to Xperi’s consumer electronics manufacturers. We have devoted significant time and resources to develop a broad range of solutions with key partners including Amlogic, Analog Devices, Cadence, Cirrus Logic, Mediatek, Mstar, NXP, Qualcomm, Realtek, Synaptics, Texas Instruments, and others. Perceive Our Perceive subsidiary provides silicon and software solutions for edge inference, which provides two differentiating factors: low power and high performance.

QUALCOMM INC names Alcatel-Lucent as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2017-11-01 (this filer's naming: stale); last named 2015-11-04; not named in QUALCOMM INC's 2025-11-05 filing as read.

over 155 companies (including Alcatel-Lucent, Huawei, LG, Microsoft, Samsung, Sony and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2015-11-04, accession 000123445215000271, period September 27, 2015, under Item 1. Business; characters 46629 to 46750; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, over 155 companies (including Alcatel-Lucent, Huawei, LG, Microsoft, Samsung, Sony and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. Since our founding in 1985, we have focused heavily on technology development and innovation. These efforts have resulted in a leading intellectual property portfolio related to, among other things, wireless technology.

Apple Inc. names QUALCOMM INC as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-10-30 (this filer's naming: stale); last named 2018-11-05; not named in Apple Inc.'s 2025-10-31 filing as read.

On January 20, 2017, the Company filed a lawsuit against Qualcomm Incorporated and affiliated parties (“Qualcomm”) in the U.S. District Court for the Southern District of California seeking, among other things, to enjoin Qualcomm from requiring the Company to pay royalties at the rate demanded by Qualcomm. As the Company does not believe the demanded royalty it has historically paid contract manufacturers for each applicable device is fair, reasonable and non-discriminatory, and believes it to be invalid and/or overstated in other respects as well, no Qualcomm-related royalty payments have been remitted by the Company to its contract manufacturers since the beginning of the second quarter of 2017.

From Apple Inc.'s 10-K filed 2018-11-05, accession 000032019318000145, period September 29, 2018, under Item 8. Financial Statements and Supplementary Data; characters 251834 to 252540; re-found.

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VirnetX II is currently on appeal. The Company has challenged the validity of the VirnetX Patents at the U.S. Patent and Trademark Office (the “PTO”). In response, the PTO has declared the VirnetX Patents invalid. VirnetX has appealed, and those appeals are currently pending at the Federal Circuit. The Federal Circuit has consolidated the Company’s appeal of the Eastern Texas District Court VirnetX I verdict and VirnetX’s appeals from the PTO invalidity proceedings. The Company believes it will prevail on the merits. Qualcomm On January 20, 2017, the Company filed a lawsuit against Qualcomm Incorporated and affiliated parties (“Qualcomm”) in the U.S. District Court for the Southern District of California seeking, among other things, to enjoin Qualcomm from requiring the Company to pay royalties at the rate demanded by Qualcomm. As the Company does not believe the demanded royalty it has historically paid contract manufacturers for each applicable device is fair, reasonable and non-discriminatory, and believes it to be invalid and/or overstated in other respects as well, no Qualcomm-related royalty payments have been remitted by the Company to its contract manufacturers since the beginning of the second quarter of 2017. The Company believes it will prevail on the merits of the case and has accrued its best estimate for the ultimate resolution of this matter. Note 10 – Segment Information and Geographic Data The Company reports segment information based on the “management” approach.

QUALCOMM INC names Apple Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-10-30 (this filer's naming: stale); last named 2020-11-04; not named in QUALCOMM INC's 2025-11-05 filing as read.

QTL results in fiscal 2020 benefited from the inclusion of a full year of royalties from Apple

From QUALCOMM Incorporated's 10-K filed 2020-11-04, accession 000172894920000067, period September 27, 2020, under Item 7. Management; characters 238597 to 238691; re-found.

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In the fourth quarter of fiscal 2020, Huawei paid the first installment under the settlement agreement and the royalties due for the March 2020 and June 2020 quarters. • QCT results in fiscal 2020 benefited from an increase in demand for 5G and IoT products, partially offset by the negative impact of COVID-19. Additionally, in the second half of fiscal 2020, QCT began shipments under the multi-year chipset supply agreement with Apple to support 2020 iPhone product launches. • QTL results in fiscal 2020 benefited from the inclusion of a full year of royalties from Apple (as a result of the settlement with Apple and its contract manufacturers in April 2019) and an estimate of royalties due from Huawei for sales made in the September 2020 quarter, partially offset by the negative impact of COVID-19.

Apple Inc. names QUALCOMM INC as its supplier; State current since 2025-11-05 (this filer's naming: stale); last named 2019-10-31; not named in Apple Inc.'s 2025-10-31 filing as read.

On April 16, 2019, the Company and Qualcomm reached a settlement agreement to dismiss all litigation between the two companies worldwide. The companies also reached a multi-year license agreement and a multi-year supply agreement.

From Apple Inc.'s 10-K filed 2019-10-31, accession 000032019319000119, period September 28, 2019, under Item 8. Financial Statements and Supplementary Data; characters 236226 to 236456; re-found.

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No Qualcomm-related royalty payments had been remitted by the Company to its contract manufacturers since the beginning of the second quarter of 2017. Following the Company’s lawsuit, Qualcomm filed patent infringement suits against the Company and its affiliates in the U.S. and various international jurisdictions, some of which sought to enjoin the sale of certain of the Company’s products in particular countries. On April 16, 2019, the Company and Qualcomm reached a settlement agreement to dismiss all litigation between the two companies worldwide. The companies also reached a multi-year license agreement and a multi-year supply agreement. Under the terms of the settlement agreement, Apple made a payment to Qualcomm to, among other things, resolve disputes over the withheld royalty payments. iOS Performance Management Cases Various civil litigation matters have been filed in state and federal courts in the U.S. and in various international jurisdictions alleging violation of consumer protection laws, fraud, computer intrusion and …

QUALCOMM INC names Apple suppliers + Samsung + Oppo/vivo (combined) as its customer; State stale since 2019-11-06 (this filer's naming: stale); last named 2017-11-01; not named in QUALCOMM INC's 2025-11-05 filing as read.

QCT and QTL segment revenues related to the products of these customers/licensees comprised 51%, 49% and 47% of total consolidated revenues in fiscal 2017

From QUALCOMM Incorporated's 10-K filed 2017-11-01, accession 000123445217000190, period September 24, 2017, under Item 7. Management; characters 204939 to 205093; re-found.

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The decrease in licensing revenues in fiscal 2016 was primarily due to the decrease in QTL revenues, partially offset by a $143 million increase in revenues of one our nonreportable segments. In fiscal 2017 , 2016 and 2015 , revenues from suppliers to Apple Inc. and from Samsung Electronics each comprised more than 10% of consolidated revenues. Combined revenues from GuangDong OPPO Mobile Telecommunications Corp. Ltd. and vivo Communication Technology Co., Ltd., and their respective affiliates, also comprised more than 10% of consolidated revenues in fiscal 2017 . QCT and QTL segment revenues related to the products of these customers/licensees comprised 51%, 49% and 47% of total consolidated revenues in fiscal 2017 , 2016 and 2015 , respectively. 41 Revenues from customers in China (including Hong Kong) and South Korea comprised 65% and 16% , respectively, of total consolidated revenues for fiscal 2017 , compared to 57% and 17% , respectively, for fiscal 2016 , and 53% and 16% , respectively, for fiscal 2015 .

ASE Technology Holding Co., Ltd. names QUALCOMM INC as its end customer; State current since 2025-11-05 (this filer's naming: stale); last named 2012-04-20; not named in ASE Technology Holding Co., Ltd.'s 2026-04-01 filing as read.

The following table sets forth some of our largest customers, in alphabetical order, categorized by the principal end-use applications of the products which we package and test for them. Communications Computing Consumer Electronics/Industrial/Automotive Atmel Corporation Avago Technologies Broadcom Corporation Cambridge Silicon Radio Limited Media Tek Inc. Micron Technology, Inc. Qualcomm Incorporated

From ASE Technology Holding Co., Ltd.'s 20-F filed 2012-04-20, accession 000095010312002055, period December 31, 2011, under Item 4. Information on the Company; characters 182292 to 182786; re-found.

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ASE Technology Holding Co., Ltd. names QUALCOMM INC as its supplier; State stale since 2026-04-01 (this filer's naming: stale); last named 2024-04-03; not named in ASE Technology Holding Co., Ltd.'s 2026-04-01 filing as read.

Our 5G smart factory, the world’s first, which is supported by the Industrial Development Bureau and Qualcomm Technologies, Inc. and was developed through a strategic multi-organizational collaborations, has commenced operation at Kaohsiung facility.

From ASE Technology Holding Co., Ltd.'s 20-F filed 2024-04-03, accession 000119312524085380, period December 31, 2023, under Item 4. Information on the Company; characters 400395 to 400645; re-found.

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At the end of 2023, we had 46 smart factories in operation and we will continue to make further investment into automating manufacturing capacity. Our Kaohsiung facility is our operation headquarters and houses our industry-leading R&D center, which is dedicated to providing world-class assembly, wafer bumping, and test services and also offers full turnkey services, including substrate design and manufacturing capabilities. Our 5G smart factory, the world’s first, which is supported by the Industrial Development Bureau and Qualcomm Technologies, Inc. and was developed through a strategic multi-organizational collaborations, has commenced operation at Kaohsiung facility. The smart factory features the digital transformation of factory processes that are highly secured and highly reliable through facilitating 5G wireless infrastructure integration, smart heterogeneous equipment integration, and OT security system integration.

QUALCOMM INC names BBK Communication Technology Co., Ltd. (vivo) as its end customer; State stale since 2022-11-02 (this filer's naming: stale); last named 2020-11-04; not named in QUALCOMM INC's 2025-11-05 filing as read.

possible same entity as VIVO (identity view: acronym); not counted together.

In fiscal 2020, 2019 and 2018, revenues from Apple and its contract manufacturers, combined revenues from Guangdong OPPO Mobile Telecommunications Corp., Ltd. (Oppo) and BBK Communication Technology Co., Ltd. (vivo), and their respective affiliates (including BBK), Samsung and Xiaomi each comprised 10% or more of consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2020-11-04, accession 000172894920000067, period September 27, 2020, under Item 1. Business; characters 87257 to 87594; re-found.

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QTL is operated by QUALCOMM Incorporated, which owns the vast majority of our patent portfolio. Neither QTI nor any of its subsidiaries has any right, power or authority to grant any licenses or other rights under or to any patents owned by QUALCOMM Incorporated. Revenue Concentrations and Significant Customers A small number of customers/licensees historically have accounted for a significant portion of our consolidated revenues. In fiscal 2020, 2019 and 2018, revenues from Apple and its contract manufacturers, combined revenues from Guangdong OPPO Mobile Telecommunications Corp., Ltd. (Oppo) and BBK Communication Technology Co., Ltd. (vivo), and their respective affiliates (including BBK), Samsung and Xiaomi each comprised 10% or more of consolidated revenues. Revenues from Huawei also comprised 10% or more of consolidated revenues in fiscal 2020, which were positively impacted by the settlement of our prior dispute. Revenues in fiscal 2018 were negatively impacted by our prior dispute with Apple and its contract manufacturers.

BlackBerry Limited names QUALCOMM INC as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2022-04-01 (this filer's naming: stale); last named 2020-04-07; not named in BlackBerry Limited's 2026-04-09 filing as read.

On April 20, 2016, the Company and Qualcomm Incorporated (“Qualcomm”) entered into an agreement to arbitrate a dispute regarding whether Qualcomm’s agreement to cap certain royalties applied to payments made by the Company under a license between the parties.

From BlackBerry Limited's 10-K filed 2020-04-07, accession 000107023520000025, period February 29, 2020, under ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA; characters 413583 to 413842; re-found.

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This amount, net of legal costs of approximately $ 3 million, was recorded within arbitration awards and settlements, net on the consolidated statements of operations in the fourth quarter of fiscal 2019. Qualcomm arbitration award On April 20, 2016, the Company and Qualcomm Incorporated (“Qualcomm”) entered into an agreement to arbitrate a dispute regarding whether Qualcomm’s agreement to cap certain royalties applied to payments made by the Company under a license between the parties. Following a joint stipulation by the parties, the arbitration panel issued a final award on May 26, 2017 providing for the payment by Qualcomm to the Company of a total amount of $ 940 million including interest and attorneys’ fees, which was net of $ 22 million in certain royalties owed by the Company to Qualcomm for calendar 2016 and the first quarter of calendar 2017 previously recorded …

QUALCOMM INC names BlackBerry Limited as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2022-04-01 (this filer's naming: stale); last named 2017-11-01; not named in QUALCOMM INC's 2025-11-05 filing as read.

In May 2017, in connection with the arbitration decision, we entered into a Joint Stipulation Regarding Final Award Agreement with BlackBerry Limited (BlackBerry) and paid to BlackBerry $940 million

From QUALCOMM Incorporated's 10-K filed 2017-11-01, accession 000123445217000190, period September 24, 2017, under Item 7. Management; characters 198382 to 198580; re-found.

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On October 23, 2017, we received the TFTC’s written decision, which prohibits certain conduct, allows for certain competing chip companies and handset manufacturers to request to amend or enter into patent license and other relevant agreements, and imposes a fine of approximately 23.4 billion Taiwan Dollars (approximately $778 million based on the exchange rate at September 24, 2017), which was recorded as a charge to other expense in the fourth quarter of fiscal 2017. • In May 2017, in connection with the arbitration decision, we entered into a Joint Stipulation Regarding Final Award Agreement with BlackBerry Limited (BlackBerry) and paid to BlackBerry $940 million to cover the award amount, prejudgment interest and attorney’s fees. This amount, which was recorded as a reduction to revenues, also reflected certain amounts that were owed to us by BlackBerry.

GLOBALFOUNDRIES Inc. names QUALCOMM INC as its end customer; State current since 2025-11-05 (this filer's naming: stale); last named 2024-04-29; not named in GLOBALFOUNDRIES Inc.'s 2026-02-27 filing as read.

For the year 2023, our top ten customers, based on wafer shipment volume, included some of the largest semiconductor companies in the world: AMD, Cirrus Logic, Inc. (“Cirrus Logic”), Infineon Technologies AG (“Infineon”), Marvell Technology Inc., MediaTek Inc., NXP Semiconductors N.V., Qorvo, Inc., Qualcomm Inc. (“Qualcomm”), Samsung, and Sony Semiconductor Manufacturing Corporation.

From GFS's 20-F filed 2024-04-29, accession 000170904824000013, period December 31, 2023, under ITEM 4. INFORMATION ON THE COMPANY; characters 269873 to 270259; re-found.

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These agreements include binding, multi-year, reciprocal annual (and, in some cases, quarterly) minimum purchase and supply commitments with wafer pricing and associated mechanics outlined for the contract term. Through an intense focus on collaboration, we have built deep strategic partnerships with a broad base of more than 250 customers as of December 31, 2023, many of whom are the global leaders in their field. For the year 2023, our top ten customers, based on wafer shipment volume, included some of the largest semiconductor companies in the world: AMD, Cirrus Logic, Inc. (“Cirrus Logic”), Infineon Technologies AG (“Infineon”), Marvell Technology Inc., MediaTek Inc., NXP Semiconductors N.V., Qorvo, Inc., Qualcomm Inc. (“Qualcomm”), Samsung, and Sony Semiconductor Manufacturing Corporation. A key measure of our position as a strategic partner to our customers is the mix of our wafer shipment volume attributable to single-sourced business, which represented approximately 62% of wafer shipment volume in 2023.

QUALCOMM INC names Hon Hai Precision Industry Co., Ltd. as its contract-manufacturer customer; State stale since 2021-11-03 (this filer's naming: stale); last named 2019-11-06; not named in QUALCOMM INC's 2025-11-05 filing as read.

In fiscal 2019 , 2018 and 2017 , revenues from Apple Inc. and its contract manufacturers (Hon Hai Precision Industry Co., Ltd./Foxconn, its affiliates and other suppliers to Apple), Samsung Electronics and combined revenues from GuangDong 13 OPPO Mobile Telecommunications and vivo Communication Technology, and their respective affiliates (including BBK), each comprised 10% or more of consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2019-11-06, accession 000172894919000072, period September 29, 2019, under Item 1. Business; characters 100228 to 100637; re-found.

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QTL is operated by QUALCOMM Incorporated, which owns the vast majority of our patent portfolio. Neither QTI nor any of its subsidiaries has any right, power or authority to grant any licenses or other rights under or to any patents owned by QUALCOMM Incorporated. Revenue Concentrations and Significant Customers A small number of customers/licensees historically have accounted for a significant portion of our consolidated revenues. In fiscal 2019 , 2018 and 2017 , revenues from Apple Inc. and its contract manufacturers (Hon Hai Precision Industry Co., Ltd./Foxconn, its affiliates and other suppliers to Apple), Samsung Electronics and combined revenues from GuangDong 13 OPPO Mobile Telecommunications and vivo Communication Technology, and their respective affiliates (including BBK), each comprised 10% or more of consolidated revenues. Revenues from Xiaomi also comprised 10% or more of consolidated revenues in fiscal 2019 and 2018 . Revenues in fiscal 2018 and 2017 were negatively impacted by our prior dispute with Apple Inc. and its contract manufacturers. Revenues in fiscal 2019 were positively impacted by our settlement of such dispute in the third quarter of fiscal 2019.

QUALCOMM INC names HTC Corporation as its end customer; State stale since 2015-11-04 (this filer's naming: stale); last named 2013-11-06; not named in QUALCOMM INC's 2025-11-05 filing as read.

in fiscal 2011 , revenues from HTC constituted more than 10% of consolidated revenues

From QUALCOMM Incorporated's 10-K filed 2013-11-06, accession 000123445213000483, period September 29, 2013, under Item 1. Business; characters 51034 to 51119; re-found.

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A small number of customers/licensees historically have accounted for a significant portion of our consolidated revenues. In fiscal 2013 , 2012 and 2011 , revenues from Samsung Electronics constituted more than 10% of consolidated revenues; in fiscal 2013 and 2012, revenues from Hon Hai Precision Industry Co., Ltd./Foxconn, its affiliates and other suppliers to Apple Inc. constituted more than 10% of consolidated revenues; and in fiscal 2011 , revenues from HTC constituted more than 10% of consolidated revenues. Research and Development The communications industry is characterized by rapid technological change, requiring a continuous effort to enhance existing products and technologies and to develop new products and technologies. We have significant engineering resources, including engineers with substantial expertise in CDMA, OFDMA and a broad range of other technologies.

QUALCOMM INC names International Business Machines Corporation as its foundry; State stale since 2016-11-02 (this filer's naming: stale); last named 2014-11-05; not named in QUALCOMM INC's 2025-11-05 filing as read.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits are Global Foundries Inc., International Business Machines Corporation, Samsung Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company and United Microelectronics Corporation.

From QUALCOMM Incorporated's 10-K filed 2014-11-05, accession 000123445214000320, period September 28, 2014, under Item 1. Business; characters 37115 to 37461; re-found.

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Under the two-stage manufacturing model, we purchase die or wafers from semiconductor manufacturing foundries and contract with separate third-party suppliers for manufacturing services such as wafer bump, probe, assembly and final test. We rely on independent third-party suppliers to perform the manufacturing and assembly, and most of the testing, of our integrated circuits based primarily on our proprietary designs and test programs. Our suppliers also are responsible for the procurement of most of the raw materials used in the production of our integrated circuits. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits are Global Foundries Inc., International Business Machines Corporation, Samsung Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company and United Microelectronics Corporation. The primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region. QCT’s sales are primarily made through standard purchase orders for delivery of products.

Iridium Communications, Inc. names QUALCOMM INC as its channel customer; State stale since 2026-02-12 (this filer's naming: stale); last named 2024-02-15; not named in Iridium Communications, Inc.'s 2026-02-12 filing as read.

For example, in 2023, we announced an arrangement with Qualcomm Technologies, Inc., or Qualcomm, to include our services on a processor for use in smartphones and act as our VAM and service provider with smartphone manufacturers. Although Qualcomm successfully developed and demonstrated the service, they were unable to market the processor successfully to smartphone manufacturers. As a result, Qualcomm elected to terminate our arrangement with them.

From Iridium Communications Inc.'s 10-K filed 2024-02-15, accession 000141881924000008, period December 31, 2023, under Item 1A. Risk Factors; characters 169836 to 170289; re-found.

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If our distributors develop faulty or poorly performing products using our technology or services, we may be subject to claims, and our reputation could be harmed. If current or future distributors do not perform adequately, or if we are unable to locate competent distributors in particular countries and secure their services on favorable terms, we may be unable to increase or maintain our revenue in these 28 markets or enter new markets, we may not realize our expected growth, and our brand image and reputation could be hurt. For example, in 2023, we announced an arrangement with Qualcomm Technologies, Inc., or Qualcomm, to include our services on a processor for use in smartphones and act as our VAM and service provider with smartphone manufacturers. Although Qualcomm successfully developed and demonstrated the service, they were unable to market the processor successfully to smartphone manufacturers. As a result, Qualcomm elected to terminate our arrangement with them. This arrangement included large penalties had we marketed a similar technology with another partner; as a result, we expect a substantial delay in our ability to develop a similar service with a different third party.

QUALCOMM INC names Lenovo Group Limited as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2018-11-07 (this filer's naming: stale); last named 2016-11-02; not named in QUALCOMM INC's 2025-11-05 filing as read.

more than 210 companies (including Huawei, Lenovo, LG, Microsoft, Oppo, Samsung, Sony Mobile, vivo, Xiaomi and ZTE)

From QUALCOMM Incorporated's 10-K filed 2016-11-02, accession 000123445216000552, period September 25, 2016, under Item 1A. Risk Factors; characters 126138 to 126253; re-found.

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While 3G/4G multimode products are generally covered by our existing 3G licensing agreements, products that implement 4G but do not also implement 3G are generally not covered by these agreements. Although we believe that our patented technology is essential and useful to implementation of the LTE industry standards and have granted royalty-bearing licenses to more than 210 companies (including Huawei, Lenovo, LG, Microsoft, Oppo, Samsung, Sony Mobile, vivo, Xiaomi and ZTE) that have realized that they need a license to our patents to make and sell products implementing 4G standards but not implementing 3G standards, it may be difficult to agree on material terms and/or conditions of new license agreements that are acceptable to us with companies that are currently unlicensed.

QUALCOMM INC names LG Electronics Inc. as its end customer; State stale since 2014-11-05 (this filer's naming: stale); last named 2012-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

in fiscal 2010, revenues from LG Electronics constituted more than 10% of consolidated revenues

From QUALCOMM Incorporated's 10-K filed 2012-11-07, accession 000123445212000371, period September 30, 2012, under Item 1. Business; characters 36186 to 36281; re-found.

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A small number of customers/licensees historically have accounted for a significant portion of our consolidated revenues. In fiscal 2012, 2011 and 2010, revenues from Samsung Electronics constituted more than 10% of consolidated revenues. In addition, in fiscal 2012, revenues from Hon Hai Precision Industry Co., Ltd./Foxconn, its affiliates and other suppliers to Apple Inc. constituted more than 10% of consolidated revenues; in fiscal 2011, revenues from HTC constituted more than 10% of consolidated revenues; and in fiscal 2010, revenues from LG Electronics constituted more than 10% of consolidated revenues. Operating Segments QCT Segment. QCT is a leading developer and supplier of integrated circuits and system software based on CDMA, OFDMA and other technologies for use in voice and data communications, networking, application processing, multimedia and global positioning system products.

QUALCOMM INC names LG Electronics Inc. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 1. Business; characters 57808 to 57986; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. As opportunities arise, we are expanding licenses granted under existing agreements to include 5G technologies through Release 15, both for multimode (i.e. 3G/4G/5G) devices as well as single mode 5G devices.

QUALCOMM INC names Microsoft Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 1. Business; characters 57808 to 57986; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. As opportunities arise, we are expanding licenses granted under existing agreements to include 5G technologies through Release 15, both for multimode (i.e. 3G/4G/5G) devices as well as single mode 5G devices.

NIO Inc. names QUALCOMM INC as its supplier; State stale since 2024-04-09 (this filer's naming: stale); last named 2022-04-29; not named in NIO Inc.'s 2026-04-10 filing as read.

The ES8, ES6 and EC6 adopts NVIDIA PARKER SoC while the ET7 and the ET5 use the 3rd Generation Qualcomm® Snapdragon™ Automotive Cockpit Platform for in-car digital cockpit.

From NIO Inc.'s 20-F filed 2022-04-29, accession 000110465922052718, period 2021-12-31, under ITEM 4. INFORMATION ON THE COMPANY; characters 423120 to 423292; re-found.

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NAD is expected to gradually cover use cases from expressways, urban roads, parking, battery swapping to other domains to deliver a safer and more relaxing autonomous driving experience for our users. We plan to roll out NAD through a monthly subscription under ADaaS in the future. Digital Technologies Digital Cockpit Our digital cockpit has an AI-driven, scalable and flexible architecture that presents users with an intelligent and immersive digital experience. The ES8, ES6 and EC6 adopts NVIDIA PARKER SoC while the ET7 and the ET5 use the 3rd Generation Qualcomm® Snapdragon™ Automotive Cockpit Platform for in-car digital cockpit. Inside our digital cockpit, NOMI, our in-car AI companion, can listen to, communicate and interact with users to build a strong emotional connection between vehicles and users. Inspired by the concept of mobile living space, we plan to deliver PanoCinema, a panoramic digital cockpit with AR and VR capabilities, to our users in the future.

Nokia Corporation names QUALCOMM INC as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2024-11-06 (this filer's naming: stale); last named 2014-04-30; not named in Nokia Corporation's 2026-03-05 filing as read.

Total amount of prepaid expenses and accrued income included within Assets of disposal groups classified as held for sale at December 31, 2013, is EUR 1 716 million, of which EUR 829 million relates to the Qualcomm advance payment.

From Nokia Corporation's 20-F filed 2014-04-30, accession 000119312514169071, period December 31, 2013, under ITEM 19. EXHIBITS; characters 909714 to 909945; re-found.

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Prepaid expenses and accrued income also include various other prepaid expenses and accrued income, but no amounts which are individually significant. Total amount of prepaid expenses and accrued income included within Assets of disposal groups classified as held for sale at December 31, 2013, is EUR 1 716 million, of which EUR 829 million relates to the Qualcomm advance payment. Prepaid expenses and accrued income regarding current tax are included in Current income tax assets in the consolidated statement of financial position in 2013, and have also been reclassified for comparability purposes in 2012. F-57

NXP Semiconductors N.V. names QUALCOMM INC as its customer; State stale since 2014-02-28 (this filer's naming: stale); last named 2012-03-13; not named in NXP Semiconductors N.V.'s 2026-02-19 filing as read.

• Oberthur • ORGA • Qualcomm

From NXP Semiconductors N.V.'s 20-F filed 2012-03-13, accession 000119312512112101, period December 31, 2011, under Item 4. Information on the Company; characters 133020 to 133055; re-found.

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Key OEM customers • Becker • Bosch • Continental • Delphi • Desay • Fujitsu • Harman/ Becker • Hella • Humax • Hyundai • JCAE • Lear • LGE • Microsoft • Panasonic • Pioneer • Sony • Valeo • Visteon • VON • Advanide • Apple • ASK • Austria • Avery Dennison • Bundesdr • COV • Gemalto • Giesecke • Google • GTO • LGE • Marvell • Oberthur • ORGA • Qualcomm • Samsung • SDU Identification • SEMC • Smartrac • Alcatel • Andrew Corp. • Arrow • Ericsson • Huawei • NSN • Samsung • ZTE • Flextronics • Neonlite • Osram • Panasonic • Philips • PLI • Sharp • TCP • Arrow • BSS • Continental • Electrolux • Emerson • Luxim • Philips • PNK • Rhodeschw • Samsung …

QUALCOMM INC names OPPO as its end customer; State stale since 2022-11-02 (this filer's naming: stale); last named 2020-11-04; not named in QUALCOMM INC's 2025-11-05 filing as read.

In fiscal 2020, 2019 and 2018, revenues from Apple and its contract manufacturers, combined revenues from Guangdong OPPO Mobile Telecommunications Corp., Ltd. (Oppo) and BBK Communication Technology Co., Ltd. (vivo), and their respective affiliates (including BBK), Samsung and Xiaomi each comprised 10% or more of consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2020-11-04, accession 000172894920000067, period September 27, 2020, under Item 1. Business; characters 87257 to 87594; re-found.

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QUALCOMM INC names OPPO as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 1. Business; characters 57808 to 57986; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. As opportunities arise, we are expanding licenses granted under existing agreements to include 5G technologies through Release 15, both for multimode (i.e. 3G/4G/5G) devices as well as single mode 5G devices.

Rambus, Inc. names QUALCOMM INC as its end customer; State stale since 2021-02-26 (this filer's naming: stale); last named 2019-02-22; not named in Rambus, Inc.'s 2026-02-18 filing as read.

The increase was primarily due to sales of security products to Qualcomm and memory products from the Memory Interconnect Business.

From RAMBUS INC.'s 10-K filed 2019-02-22, accession 000091727319000006, period December 31, 2018, under Item 7. Management’s Discussion and Analysis of Financial Condition and Results of Operations; characters 158133 to 158264; re-found.

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Product Revenue Product revenue consists of revenue from the sale of memory, security and lighting products. Product revenue increased approximately $2.2 million to $38.7 million for the year ended December 31, 2018 from $36.5 million for 2017. The increase was primarily due to higher sales of memory products, partially offset by lower sales of lighting products, as a result of closing our lighting division in the first quarter of 2018. Product revenue increased approximately $10.4 million to $36.5 million for the year ended December 31, 2017 from $26.1 million for 2016. The increase was primarily due to sales of security products to Qualcomm and memory products from the Memory Interconnect Business. We believe that product revenue will increase in 2019, mainly from the sale of our memory products. Our ability to continue to grow product revenue is dependent on, among other things, our ability to continue to obtain orders from customers and our ability to meet our customers' demands.

QUALCOMM INC names Samsung + Xiaomi + Apple suppliers + Oppo/vivo (combined) as its customer; State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

QCT and QTL segment revenues related to the products of these customers/licensees comprised 52%, 58% and 54% of total consolidated revenues in fiscal 2018

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 7. Management; characters 207830 to 207984; re-found.

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In fiscal 2018 and 2017 , combined revenues from GuangDong OPPO Mobile Telecommunications Corp. Ltd. and vivo Communication Technology Co., Ltd., and their respective affiliates, also comprised more than 10% of consolidated revenues. In fiscal 2017 and 2016 , revenues from Samsung Electronics and suppliers to Apple Inc. each comprised more than 10% of consolidated revenues. QCT and QTL segment revenues related to the products of these customers/licensees comprised 52%, 58% and 54% of total consolidated revenues in fiscal 2018 , 2017 and 2016 , respectively. Revenues from customers in China (including Hong Kong) and South Korea comprised 67% and 14% , respectively, of total consolidated revenues for fiscal 2018 , compared to 65% and 16% , respectively, for fiscal 2017 , and 57% and 17% , respectively, for fiscal 2016 .

QUALCOMM INC names Samsung Electronics Co., Ltd. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 1. Business; characters 57808 to 57986; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. As opportunities arise, we are expanding licenses granted under existing agreements to include 5G technologies through Release 15, both for multimode (i.e. 3G/4G/5G) devices as well as single mode 5G devices.

QUALCOMM INC names Siliconware Precision Industries Co., Ltd. as its assembly and test provider; State stale since 2019-11-06 (this filer's naming: stale); last named 2017-11-01; not named in QUALCOMM INC's 2025-11-05 filing as read.

primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2017-11-01, accession 000123445217000190, period September 24, 2017, under Item 1. Business; characters 48950 to 49108; re-found.

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Our suppliers also are responsible for the procurement of most of the raw materials used in the production of our integrated circuits. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits are Global Foundries Inc., Samsung Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company and United Microelectronics Corporation. The primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region. QCT’s sales are primarily made through standard purchase orders for delivery of products.

QUALCOMM INC names Sony Group Corp as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 1. Business; characters 57808 to 57986; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. As opportunities arise, we are expanding licenses granted under existing agreements to include 5G technologies through Release 15, both for multimode (i.e. 3G/4G/5G) devices as well as single mode 5G devices.

Sony Group Corp names QUALCOMM INC as its licensor (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-06-19; not named in Sony Group Corp's 2026-06-18 filing as read.

Sony’s smartphone products are substantially dependent upon patents that relate to technologies specified in certain codec standards and are licensed by MPEG LA LLC and Via Licensing Corporation, as well as patents that relate to CDMA technologies specified by the standard-setting bodies within the telecommunications industry and are licensed by Qualcomm Incorporated and NTT DOCOMO, INC.

From SONY CORP's 20-F filed 2018-06-19, accession 000119312518196263, period March 31, 2018, under Item 4. Information on the Company; characters 108112 to 108502; re-found.

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Sony products that employ Blu-ray Disc™ player functionality and DVD player functionality, including PS4 and PS3 hardware, are substantially dependent upon patents that relate to technologies specified in the Blu-ray Disc™ specifications and are licensed by MPEG LA LLC and One-Blue, LLC, in addition to the patents that relate to technologies specified in the DVD specifications, as described above. Sony’s smartphone products are substantially dependent upon patents that relate to technologies specified in certain codec standards and are licensed by MPEG LA LLC and Via Licensing Corporation, as well as patents that relate to CDMA technologies specified by the standard-setting bodies within the telecommunications industry and are licensed by Qualcomm Incorporated and NTT DOCOMO, INC. Sony considers its overall license position beneficial to its operations. 24

QUALCOMM INC names STATS ChipPAC Ltd. as its assembly and test provider; State stale since 2016-11-02 (this filer's naming: stale); last named 2014-11-05; not named in QUALCOMM INC's 2025-11-05 filing as read.

primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2014-11-05, accession 000123445214000320, period September 28, 2014, under Item 1. Business; characters 37466 to 37624; re-found.

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Our suppliers also are responsible for the procurement of most of the raw materials used in the production of our integrated circuits. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits are Global Foundries Inc., International Business Machines Corporation, Samsung Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company and United Microelectronics Corporation. The primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region. QCT’s sales are primarily made through standard purchase orders for delivery of products.

QUALCOMM INC names United Microelectronics Corporation as its foundry; State stale since 2023-11-01 (this filer's naming: stale); last named 2021-11-03; not named in QUALCOMM INC's 2025-11-05 filing as read.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits are Global Foundries, Samsung Electronics, Semiconductor Manufacturing International Corporation (SMIC), Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics.

From QUALCOMM Incorporated's 10-K filed 2021-11-03, accession 000172894921000076, period September 26, 2021, under Item 1. Business; characters 75853 to 76142; re-found.

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We employ both turnkey and two-stage manufacturing models to purchase our integrated circuits. Under the turnkey model, our foundry suppliers are responsible for delivering fully assembled and tested integrated circuits. Under the two-stage manufacturing model, we purchase die in singular or wafer form from semiconductor manufacturing foundries and contract with separate third parties for manufacturing services such as wafer bump, probe, assembly and the majority of our final test requirements. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits are Global Foundries, Samsung Electronics, Semiconductor Manufacturing International Corporation (SMIC), Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics. The primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region.

Verizon Communications Inc. names QUALCOMM INC as its supplier; State stale since 2019-02-15 (this filer's naming: stale); last named 2017-02-21; not named in Verizon Communications Inc.'s 2026-02-17 filing as read.

most of our wireless device suppliers currently rely on Qualcomm Incorporated for the manufacture and supply of chipsets.

From Verizon Communications Inc.'s 10-K filed 2017-02-21, accession 000119312517050292, period December 31, 2016, under Item 1. Business; characters 20945 to 21066; re-found.

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We purchase a substantial majority of our wireless devices and accessories from Apple, Samsung, Motorola Mobility, Google, LG Electronics and HTC. A key component of all wireless devices is the chipset, which contains the “intelligence” of the device. The LTE chipsets used in our 4G LTE-enabled devices are manufactured by various companies, each using its own 4G LTE chipset technology. To support Code Division Multiple Access (CDMA)-1XRTT and EV-DO technologies (with and without 4G LTE), most of our wireless device suppliers currently rely on Qualcomm Incorporated for the manufacture and supply of chipsets. In addition, there are a number of other components common to wireless devices provided by various electronic component manufacturers that we do not deal with directly. Network We have the largest 4G LTE and 3G EV-DO networks of any service provider in the United States, with licensed and operational coverage in all of the 100 most populous U.S. metropolitan areas.

QUALCOMM INC names VIVO as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

possible same entity as BBK Communication Technology Co., Ltd. (vivo) (identity view: acronym); not counted together.

the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 1. Business; characters 57808 to 57986; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. As opportunities arise, we are expanding licenses granted under existing agreements to include 5G technologies through Release 15, both for multimode (i.e. 3G/4G/5G) devices as well as single mode 5G devices.

QUALCOMM INC names vivo Communication Technology Co., Ltd. as its end customer; State stale since 2021-11-03 (this filer's naming: stale); last named 2019-11-06; not named in QUALCOMM INC's 2025-11-05 filing as read.

In fiscal 2019 , 2018 and 2017 , revenues from Apple Inc. and its contract manufacturers (Hon Hai Precision Industry Co., Ltd./Foxconn, its affiliates and other suppliers to Apple), Samsung Electronics and combined revenues from GuangDong 13 OPPO Mobile Telecommunications and vivo Communication Technology, and their respective affiliates (including BBK), each comprised 10% or more of consolidated revenues.

From QUALCOMM Incorporated's 10-K filed 2019-11-06, accession 000172894919000072, period September 29, 2019, under Item 1. Business; characters 100228 to 100637; re-found.

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QTL is operated by QUALCOMM Incorporated, which owns the vast majority of our patent portfolio. Neither QTI nor any of its subsidiaries has any right, power or authority to grant any licenses or other rights under or to any patents owned by QUALCOMM Incorporated. Revenue Concentrations and Significant Customers A small number of customers/licensees historically have accounted for a significant portion of our consolidated revenues. In fiscal 2019 , 2018 and 2017 , revenues from Apple Inc. and its contract manufacturers (Hon Hai Precision Industry Co., Ltd./Foxconn, its affiliates and other suppliers to Apple), Samsung Electronics and combined revenues from GuangDong 13 OPPO Mobile Telecommunications and vivo Communication Technology, and their respective affiliates (including BBK), each comprised 10% or more of consolidated revenues. Revenues from Xiaomi also comprised 10% or more of consolidated revenues in fiscal 2019 and 2018 . Revenues in fiscal 2018 and 2017 were negatively impacted by our prior dispute with Apple Inc. and its contract manufacturers. Revenues in fiscal 2019 were positively impacted by our settlement of such dispute in the third quarter of fiscal 2019.

QUALCOMM INC names Xiaomi Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 1. Business; characters 57808 to 57986; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. As opportunities arise, we are expanding licenses granted under existing agreements to include 5G technologies through Release 15, both for multimode (i.e. 3G/4G/5G) devices as well as single mode 5G devices.

QUALCOMM INC names ZTE Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-11-04 (this filer's naming: stale); last named 2018-11-07; not named in QUALCOMM INC's 2025-11-05 filing as read.

the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses

From QUALCOMM Incorporated's 10-K filed 2018-11-07, accession 000172894918000095, period September 30, 2018, under Item 1. Business; characters 57808 to 57986; re-found.

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Upon the initial deployment of OFDMA-based networks, the products implementing such technologies generally have been multimode and implement CDMA-based technologies. The licenses granted under our existing CDMA license agreements generally cover multimode CDMA/OFDMA (3G/4G) devices, and our licensees are obligated to pay royalties under their CDMA license agreements for such devices. Further, the majority of the leading handset and other wireless device companies (including Huawei, LG, Microsoft, Oppo, Samsung, Sony, vivo, Xiaomi and ZTE) have royalty-bearing licenses under our patent portfolio for use in LTE or other OFDMA-based products that do not implement any CDMA-based standards. As opportunities arise, we are expanding licenses granted under existing agreements to include 5G technologies through Release 15, both for multimode (i.e. 3G/4G/5G) devices as well as single mode 5G devices.

ended (2)

QUALCOMM INC names Huawei Technologies Co., Ltd. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State ended since 2025-11-05 (this filer's naming: ended); last named 2025-11-05.

Beginning in the second quarter of fiscal 2025, QTL revenues did not include royalties from Huawei, whose license agreement has expired.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 7. Management; characters 248565 to 248701; re-found.

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During the second quarter of fiscal 2025, we executed final agreements for new long-term licenses with two key Chinese OEMs (for which the initial terms had expired) and entered into comprehensive 4G and 5G license agreements with Transsion (a growing, China-headquartered OEM that sells primarily in developing regions). As a result of our agreements with Transsion, all outstanding litigation between the parties has been dismissed. Beginning in the second quarter of fiscal 2025, QTL revenues did not include royalties from Huawei, whose license agreement has expired. 42 QSI Segment (in millions) 2025 2024 Change Equipment and services revenues $ — $ 18 $ (18) EBT 180 104 76 2025 vs. 2024 QSI EBT increased in fiscal 2025 primarily due to higher net gains on marketable securities resulting from the initial public offerings of certain of our equity investments, partially offset by lower net gains from observable price changes on certain of our …

QUALCOMM INC names Huawei Technologies Co., Ltd. as its end customer; State ended since 2024-11-06 (this filer's naming: ended); last named 2024-11-06; not named in QUALCOMM INC's 2025-11-05 filing as read.

On May 7, 2024, the U.S. Department of Commerce informed us that it was revoking our license to export 4G and certain other integrated circuit products to Huawei, effective immediately, and we implemented procedures to immediately comply. Accordingly, we do not expect to receive any further product revenues from Huawei. Product revenues from Huawei in fiscal 2024, prior to our license being revoked on May 7, 2024, were approximately $560 million.

From QUALCOMM Incorporated's 10-K filed 2024-11-06, accession 000080432824000075, period September 29, 2024, under Item 1A. Risk Factors; characters 124741 to 125191; re-found.

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If revenues derived from these customers or licensees decrease or the timing of such revenues fluctuates, our business and results of operations could be negatively affected ” and “ Our business, particularly our semiconductor business, may suffer as a result of our customers vertically integrating (i.e., developing their own integrated circuit products).” For example, we previously sold 4G and other integrated circuit products, including Wi-Fi products, but excluding 5G products, to Huawei under export licenses from the U.S. Department of Commerce. On May 7, 2024, the U.S. Department of Commerce informed us that it was revoking our license to export 4G and certain other integrated circuit products to Huawei, effective immediately, and we implemented procedures to immediately comply. Accordingly, we do not expect to receive any further product revenues from Huawei. Product revenues from Huawei in fiscal 2024, prior to our license being revoked on May 7, 2024, were approximately $560 million. Additionally, to the extent that Huawei’s devices take share from Chinese OEMs that utilize our products or from non-Chinese OEMs that utilize our products in devices they sell into China, our revenues, results of operations and cash flows could be further impacted.

Taiwan Semiconductor Manufacturing Company Limited (TSM): current 35, stale 37

current (35)

Advanced Micro Devices, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-04 (this filer's naming: current); last named 2026-02-04.

We rely on Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of all wafers for microprocessor and GPU products at 7 nanometer (nm) or smaller nodes, and we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.

From ADVANCED MICRO DEVICES, INC.'s 10-K filed 2026-02-04, accession 000000248826000018, period December 27, 2025, under ITEM 1A. RISK FACTORS; characters 127713 to 128034; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Allegro MicroSystems, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-05-21 (this filer's naming: current); last named 2026-05-21.

Our primary fab partners currently include UMC, PSL, Tower and TSMC.

From ALLEGRO MICROSYSTEMS, INC.'s 10-K filed 2026-05-21, accession 000119312526233537, period March 27, 2026, under Item 2. Properties.; characters 238805 to 238873; re-found.

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Our manufacturing strategy consists of a combined internal and external sourcing strategy. This approach enhances security of supply by providing capacity throughout the manufacturing process and has enabled us to reduce capital requirements and reduce fixed costs, access additional capacity during periods of high demand and establish wafer process technology collaborations. We have a fabless business model that provides us with enhanced security of supply and manufacturing flexibility. Our primary fab partners currently include UMC, PSL, Tower and TSMC. We have master service agreements with all primary foundry partners, and we have also engaged in long-term supply agreements with some of our foundry partners. AMPI is our primary internal assembly and testing facility for our sensor and power products, with packaging capabilities and quality standards that meet stringent automotive safety and reliability specification requirements.

Taiwan Semiconductor Manufacturing Company Limited names Amazon Web Services, Inc. as its end customer; State current since 2025-04-17 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Analog Devices, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2025-11-25 (this filer's naming: current); last named 2025-11-25.

We currently source more than half of our wafer requirements annually from third-party wafer foundries, including Taiwan Semiconductor Manufacturing Company (TSMC) and others.

From Analog Devices, Inc.'s 10-K filed 2025-11-25, accession 000000628125000153, period November 1, 2025, under ITEM 1A. RISK FACTORS; characters 93508 to 93683; re-found.

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We rely, and plan to continue to rely, on third-party suppliers and service providers, including raw material and components suppliers, semiconductor wafer foundries, assembly and test contractors and freight carriers (collectively, vendors), in manufacturing and shipping our products. This reliance involves several risks, including reduced control over availability, pricing, capacity utilization, delivery schedules, manufacturing yields, costs and supply chain allocations. We currently source more than half of our wafer requirements annually from third-party wafer foundries, including Taiwan Semiconductor Manufacturing Company (TSMC) and others. These foundries often provide wafer foundry services to our competitors and therefore periods of increased industry demand may result in capacity constraints.

Applied Materials, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2024-12-13 (this filer's naming: current); last named 2024-12-13; not named in Applied Materials, Inc.'s 2025-12-12 filing as read.

Samsung Electronics Co., Ltd. 12% 15% Taiwan Semiconductor Manufacturing Company Limited 11% 19%

From Applied Materials, Inc.'s 10-K filed 2024-12-13, accession 000000695124000044, period October 27, 2024, under Item 1: Business; characters 51858 to 51954; re-found.

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Information on net revenue to unaffiliated customers and long-lived assets attributable to our geographic regions is included in Note 14 of Notes to Consolidated Financial Statements. The following companies accounted for at least 10 percent of our net revenue for the following fiscal years for products and services in multiple reportable segments. 2024 2023 Samsung Electronics Co., Ltd. 12% 15% Taiwan Semiconductor Manufacturing Company Limited 11% 19% 7 Table of Contents Competition The industries in which we operate are highly competitive and characterized by rapid technological change. Our ability to compete generally depends on our ability to commercialize our technology in a timely manner, continually improve our products, and develop new products that meet constantly evolving customer requirements.

ASE Technology Holding Co., Ltd. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-04-01 (this filer's naming: current); last named 2026-04-01.

Since 1997, we have maintained a strategic alliance with Taiwan Semiconductor Manufacturing Company Limited, or TSMC, one of the largest dedicated semiconductor foundries in the world. TSMC designates us as its non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.

From ASE Technology Holding Co., Ltd.'s 20-F filed 2026-04-01, accession 000119312526135585, period December 31, 2025, under Item 3. Key Information; characters 193859 to 194177; re-found.

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We cannot ensure that these customers or any other customers will continue to place orders with us in the future at the same levels as in past periods. The loss of one or more of our significant customers, or reduced orders by any one of them, and our inability to replace these customers or make up for such orders, could adversely affect our revenues and profitability. In addition, we have in the past reduced, and may in the future be requested to reduce, our prices to limit the level of order cancellations. Any price reduction would likely reduce our margins and profitability. Since 1997, we have maintained a strategic alliance with Taiwan Semiconductor Manufacturing Company Limited, or TSMC, one of the largest dedicated semiconductor foundries in the world. TSMC designates us as its non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC. Such strategic alliances, as well as our other commercial arrangements with providers of other complementary semiconductor manufacturing services, enable us to offer total semiconductor manufacturing solutions to our customers. These strategic alliances and other commercial arrangements may not achieve their anticipated commercial benefits and may be terminated at any time.

ASML Holding N.V. names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

In November 2025, we were honored to receive the TSMC Supplier ‘Excellence in Green Manufacturing’ Award

From ASML HOLDING NV's 20-F filed 2026-02-25, accession 000162828026011378, period December 31, 2025, under Item 6 Any; characters 677109 to 677213; re-found.

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During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1A. RISK FACTORS; characters 114481 to 114584; re-found.

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We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From Broadcom Inc.'s 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Cirrus Logic, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-05-21 (this filer's naming: current); last named 2026-05-21.

We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").

From CIRRUS LOGIC, INC.'s 10-K filed 2026-05-21, accession 000077240626000018, period March 28, 2026, under ITEM 1. Business; characters 36579 to 36767; re-found.

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Entegris, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2026-02-11 (this filer's naming: current); last named 2026-02-11.

Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16% 16% 11%

From Entegris, Inc.'s 10-K filed 2026-02-11, accession 000110130226000012, period December 31, 2025, under Item 1. Business.; characters 72204 to 72310; re-found.

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We also serve OSAT facilities, flat panel display manufacturers and hard disk drive component and device makers, as well as customers in solar, life sciences, electrical discharge machining, glass manufacturing, aerospace and biomedical implant manufacturing. The following table shows the percentage of our net sales to top customers and the percentage of our net sales that are domestic and international during the three most recent fiscal years. 8 Table of Contents 2025 2024 2023 Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16% 16% 11% Remaining top ten customers 34% 32% 32% Total top ten customers 50% 48% 43% Percentage of net sales by market: Domestic/U.S. 18% 21% 25% Foreign/International 82% 79% 75% We may enter into supply agreements with our customers, though these agreements typically do not include long-term purchase commitments.

Fortinet, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

These contract manufacturers use foundries in Taiwan and Japan operated by either Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) or by the contract manufacturer itself.

From FORTINET, INC.'s 10-K filed 2026-02-25, accession 000126203926000007, period 2025-12-31, under ITEM 1. Business; characters 80246 to 80427; re-found.

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We believe that outsourcing our manufacturing and a substantial portion of our logistics enables us to focus resources on our core competencies. Our proprietary ASICs, which are key to the performance of our appliances, are built by contract manufacturers including Toshiba America Electronic Components, Inc. (“Toshiba America”) and Renesas Electronics America, Inc. (“Renesas”). These contract manufacturers use foundries in Taiwan and Japan operated by either Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) or by the contract manufacturer itself. The components included in our products are sourced from various suppliers by us or, more frequently, by our contract manufacturers.

Taiwan Semiconductor Manufacturing Company Limited names Global Unichip Corporation as its customer; State current since 2026-04-16 (this filer's naming: current); last named 2026-04-16.

In 2025 , we had total sales of NT $31,094 million (US $991 million) to GUC, representing 0.8% of our total revenue.

From TSM's 20-F filed 2026-04-16, accession 000162828026025362, period December 31, 2025, under ITEM 7. MAJOR SHAREHOLDERS AND RELATED PARTY TRANSACTIONS; characters 348011 to 348127; re-found.

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In 2025 , we had total purchases of NT$ 4,113 million (US$ 131 million) from SSMC, representing 0.3% of our total cost of revenue. Global Unichip Corporation (“GUC”) In January 2003, we acquired a 52.0% equity interest in GUC, a SoC design service company that provides large scale SoC implementation services. GUC listed its shares on the Taiwan Stock Exchange in November 2006. As of February 28, 2026 , we owned approximately 34.8% of the equity interest in GUC. In 2025 , we had total sales of NT $31,094 million (US $991 million) to GUC, representing 0.8% of our total revenue. Xintec, Inc. (“Xintec”) In January 2007, we acquired a 51.2% equity interest in Xintec, a supplier of wafer level packaging service, to support our CMOS image sensor manufacturing business. Xintec listed its shares on the Taipei Exchange in March 2015. Subsequent to Xintec’s IPO, our shareholding in Xintec was diluted to approximately 41.2%.

Impinj, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-09 (this filer's naming: current); last named 2026-02-09.

Taiwan Semiconductor Manufacturing Company Limited, or TSMC, manufactures our endpoint IC wafers primarily in Taiwan and has been our supplier since 2003.

From IMPINJ, INC.'s 10-K filed 2026-02-09, accession 000119312526042813, period December 31, 2025, under Item 1. B; characters 57128 to 57282; re-found.

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* Customer accounted for less than 10% of total revenue in the period. Manufacturing We outsource most of our product manufacturing to third parties that build our products to our specifications, manufacturing only a small portion of our products, principally some of our tag production systems ourselves. This capital-efficient operating model scales efficiently with volume, allowing us to focus our resources on developing new products and solutions. Taiwan Semiconductor Manufacturing Company Limited, or TSMC, manufactures our endpoint IC wafers primarily in Taiwan and has been our supplier since 2003. We order endpoint IC wafers on a purchase-order basis and do not have a long-term supply agreement with TSMC. We test the wafers 9

Intel Corporation names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-01-23 (this filer's naming: current); last named 2026-01-23.

In recent years, however, we have also strategically utilized third-party foundry manufacturing capacity, including at one of our key foundry competitors, TSMC, for various tiles or an entire product where advantageous for cost, performance, schedule or other considerations.

From INTEL CORPORATION's 10-K filed 2026-01-23, accession 000005086326000011, period December 27, 2025; characters 114211 to 114486; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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KLA Corporation names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2025-08-08 (this filer's naming: current); last named 2025-08-08.

For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.

From KLA CORP ORATION's 10-K filed 2025-08-08, accession 000031920125000024, period June 30, 2025, under ITEM 1. BUSINESS; characters 71995 to 72408; re-found.

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Our business depends on capital expenditures from these manufacturers which, in turn, depend on many factors including general economic conditions, anticipated market demand, evolving government regulations and capacity constraints. Our ability to compete in this area depends upon the continuation of favorable trading relationships between countries in the region and the U.S., and our continuing ability to maintain satisfactory relationships with leading semiconductor companies in the region. For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd. Sales, Service and Marketing Our sales, service and marketing efforts aim to build deep long-term relationships with our customers.

Lam Research Corporation names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2025-08-11 (this filer's naming: current); last named 2025-08-11.

Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company.

From LAM RESEARCH CORPORATION's 10-K filed 2025-08-11, accession 000070754925000075, period June 29, 2025, under Item 1. Business; characters 55541 to 55741; re-found.

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Customers Our customers include many of the world’s leading semiconductor manufacturers. Customers continue to establish joint ventures, alliances, and licensing arrangements which have the potential to positively or negatively impact our competitive position and market opportunities. Refer to Note 9 of our Consolidated Financial Statements, included in Part II, Item 8 of this report, for information concerning customer concentrations. Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company. A material reduction in orders from our customers could adversely affect our results of operations and projected financial condition. Our business depends upon the expenditures of semiconductor manufacturers.

Taiwan Semiconductor Manufacturing Company Limited names MediaTek Inc. as its end customer; State current since 2025-04-17 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Mobileye Global Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-12 (this filer's naming: current); last named 2026-02-12.

As part of an effort to establish redundancy and better control of our supply chain, we have sought additional qualified suppliers, and we have recently entered into an agreement with TSMC (Taiwan Semiconductor Manufacturing Company Ltd.) pursuant to which it will manufacture components of our imaging radar and some of our future generations of our EyeQ™ product, and potentially other future products.

From Mobileye Global Inc.'s 10-K filed 2026-02-12, accession 000110465926014300, period December 27, 2025, under Item 7. Management’s Discussion and Analysis of Financial Condition and Results of Operations; characters 374698 to 375102; re-found.

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We partner with STMicroelectronics, a leading supplier and innovator of semiconductor devices for automotive applications, in manufacturing, design, and research and development. We have co-developed six generations of our automotive grade SoC, EyeQ™, with STMicroelectronics including EyeQ™5 and EyeQ™6. We have also established relationships with several suppliers, such as Quanta Computer, to develop and assemble our ECUs, including the design for our Mobileye SuperVision™, which includes our EyeQ™5 SoCs manufactured by STMicroelectronics. As part of an effort to establish redundancy and better control of our supply chain, we have sought additional qualified suppliers, and we have recently entered into an agreement with TSMC (Taiwan Semiconductor Manufacturing Company Ltd.) pursuant to which it will manufacture components of our imaging radar and some of our future generations of our EyeQ™ product, and potentially other future products. Our close partnership with Intel exists on multiple fronts. As a result of our relationship with Intel, we have access to unique and differentiating technologies. For example, we may license certain technologies from Intel that support the design and development of our software-defined imaging radar, including Intel’s mmWave technologies.

NVIDIA Corporation names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-25 (this filer's naming: current); last named 2026-02-25.

We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.

From NVIDIA CORP ORATION's 10-K filed 2026-02-25, accession 000104581026000021, period January 25, 2026, under Item 1. Business; characters 57819 to 57993; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names NXP Semiconductors N.V. as its end customer; State current since 2025-04-17 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Onto Innovation, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2026-02-24 (this filer's naming: current); last named 2026-02-24.

The effect of these types of events on our revenue and cash flows could be material because we derive substantial revenue from sales to semiconductor device foundries in Taiwan such as Taiwan Semiconductor Manufacturing Company Ltd., from memory chip manufacturers in South Korea such as Samsung Electronics Co., Ltd., and from semiconductor device manufacturers in Japan such as Toshiba Corporation.

From ONTO INNOVATION INC.'s 10-K filed 2026-02-24, accession 000119312526066937, period 2026-01-03, under Item 1A. Risk Factors.; characters 140793 to 141193; re-found.

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In particular, the escalation of geopolitical tensions between China and Taiwan may cause disruptions in the markets in which we operate and lead to a decreased demand for our products, which could adversely affect our business in Asia or have a negative impact on the regional or global economy. Furthermore, an outbreak of hostilities or other political upheaval in China, Taiwan, Japan, or South Korea, or an economic downturn in Asia or globally, would likely harm the operations of our customers in these countries. The effect of these types of events on our revenue and cash flows could be material because we derive substantial revenue from sales to semiconductor device foundries in Taiwan such as Taiwan Semiconductor Manufacturing Company Ltd., from memory chip manufacturers in South Korea such as Samsung Electronics Co., Ltd., and from semiconductor device manufacturers in Japan such as Toshiba Corporation. Natural disasters, changes in climate, public health crises, and geo-political conflicts could materially adversely affect our worldwide operations (or those of our business partners).

QUALCOMM INC names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2025-11-05 (this filer's naming: current); last named 2025-11-05.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 57997 to 58203; re-found.

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We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names Renesas Electronics Corporation as its end customer; State current since 2025-04-17 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Silicon Laboratories Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2026-02-10 (this filer's naming: current); last named 2026-02-10.

We currently partner primarily with Taiwan Semiconductor Manufacturing Co. (“TSMC”) and Semiconductor Manufacturing International Corporation (“SMIC”) to manufacture the majority of our semiconductor wafers.

From SILICON LABORATORIES INC.'s 10-K filed 2026-02-10, accession 000103807426000005, period January 3, 2026, under Item 1. Business; characters 52473 to 52680; re-found.

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Our IC designs typically use industry-standard CMOS manufacturing process technology to achieve a level of performance normally associated with more expensive special-purpose IC fabrication technology. We believe the use of CMOS technology facilitates the rapid production of our ICs within a lower-cost framework. Our IC production employs submicron process geometries, which are readily available from leading foundry suppliers worldwide, thus increasing the likelihood that manufacturing capacity will be available throughout our products’ life cycles. We currently partner primarily with Taiwan Semiconductor Manufacturing Co. (“TSMC”) and Semiconductor Manufacturing International Corporation (“SMIC”) to manufacture the majority of our semiconductor wafers. We believe that our fabless manufacturing model significantly reduces our capital requirements and allows us to focus our resources on the design, development, and marketing of our ICs. Once the silicon wafers have been produced, they are shipped directly to our third-party assembly subcontractors. The assembled ICs are then moved to the final testing stage.

Taiwan Semiconductor Manufacturing Company Limited names Sony Semiconductor Solutions Corporation as its end customer; State current since 2025-04-17 (this filer's naming: current); last named 2025-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Inc., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2025-04-17, accession 000119312525083423, period December 31, 2024, under ITEM 4. INFORMATION ON THE COMPANY; characters 207309 to 207764; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names Systems on Silicon Manufacturing Company Pte. Ltd. as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State current since 2026-04-16 (this filer's naming: current); last named 2026-04-16.

In return, we provide SSMC with certain technical support and limited licenses of related intellectual property rights for the manufacture of products for us.

From TSM's 20-F filed 2026-04-16, accession 000162828026025362, period December 31, 2025, under ITEM 7. MAJOR SHAREHOLDERS AND RELATED PARTY TRANSACTIONS; characters 347203 to 347361; re-found.

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SSMC’s business is exclusively dedicated to the manufacturing of wafers for us, our subsidiaries, NXP and its subsidiaries. We and NXP have the right to purchase up to 100% of SSMC’s annual capacity and are required in the aggregate to purchase at least 70% of its capacity. Pursuant to a technology cooperation agreement entered into between us and SSMC in 1999, SSMC bases at least a major part of its production on processes compatible with those used in our metal oxide semiconductor integrated circuits wafer volume production fabs. In return, we provide SSMC with certain technical support and limited licenses of related intellectual property rights for the manufacture of products for us. SSMC pays to us during, and up to three years after, the 56 term of this agreement a remuneration of a fixed percentage of the net selling price of all products manufactured by SSMC. In 2025 , we had total purchases of NT$ 4,113 million (US$ 131 million) from SSMC, representing 0.3% of our total cost of revenue.

Taiwan Semiconductor Manufacturing Company Limited names Systems on Silicon Manufacturing Company Pte. Ltd. as its foundry; State current since 2026-04-16 (this filer's naming: current); last named 2026-04-16.

In 2025 , we had total purchases of NT$ 4,113 million (US$ 131 million) from SSMC, representing 0.3% of our total cost of revenue.

From TSM's 20-F filed 2026-04-16, accession 000162828026025362, period December 31, 2025, under ITEM 7. MAJOR SHAREHOLDERS AND RELATED PARTY TRANSACTIONS; characters 347545 to 347675; re-found.

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In return, we provide SSMC with certain technical support and limited licenses of related intellectual property rights for the manufacture of products for us. SSMC pays to us during, and up to three years after, the 56 term of this agreement a remuneration of a fixed percentage of the net selling price of all products manufactured by SSMC. In 2025 , we had total purchases of NT$ 4,113 million (US$ 131 million) from SSMC, representing 0.3% of our total cost of revenue. Global Unichip Corporation (“GUC”) In January 2003, we acquired a 52.0% equity interest in GUC, a SoC design service company that provides large scale SoC implementation services. GUC listed its shares on the Taiwan Stock Exchange in November 2006. As of February 28, 2026 , we owned approximately 34.8% of the equity interest in GUC.

Teradyne, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its end customer; State current since 2025-02-20 (this filer's naming: current); last named 2025-02-20; not named in Teradyne, Inc.'s 2026-02-19 filing as read.

As of December 31, 2024, two customers of our Semiconductor Test segment, Taiwan Semiconductor Manufacturing Co. and SK Hynix Inc, each accounted for 10% of our accounts receivable balance.

From TERADYNE, INC's 10-K filed 2025-02-20, accession 000095017025023784, period December 31, 2024, under Item 7A: Quantitative and Q; characters 225072 to 225261; re-found.

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We place forward currency contracts with high credit-quality financial institutions in order to minimize credit risk exposure. Concentrations of credit risk with respect to accounts receivable are limited due to the large number of geographically dispersed customers. We perform ongoing credit evaluations of our customers’ financial condition and from time to time may require customers to provide a letter of credit from a bank to secure accounts receivable. As of December 31, 2024, two customers of our Semiconductor Test segment, Taiwan Semiconductor Manufacturing Co. and SK Hynix Inc, each accounted for 10% of our accounts receivable balance. As of December 31, 2023, a customer of our Semiconductor Test segment, Texas Instruments Inc., accounted for 18% of our accounts receivable balance.

Taiwan Semiconductor Manufacturing Company Limited names Vanguard International Semiconductor Corporation as its foundry; State current since 2026-04-16 (this filer's naming: current); last named 2026-04-16.

In 2025 , we had total purchases of NT$ 878 million (US$ 28 million) from VIS, representing 0.1% of our total cost of revenue .

From TSM's 20-F filed 2026-04-16, accession 000162828026025362, period December 31, 2025, under ITEM 7. MAJOR SHAREHOLDERS AND RELATED PARTY TRANSACTIONS; characters 346096 to 346223; re-found.

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In 2004, VIS completely terminated its DRAM production and became a dedicated foundry company. As of February 28, 2026 , we owned approximately 27.6 % of the equity interest in VIS. Pursuant to the terms of a manufacturing agreement between both parties, VIS was obligated to use its best commercial efforts to manufacture wafers at specified yield rates for us up to a fixed amount of reserved capacity per month, and TSMC was required to use its best commercial efforts to maintain utilization of such reserved capacity. In 2025 , we had total purchases of NT$ 878 million (US$ 28 million) from VIS, representing 0.1% of our total cost of revenue . Systems on Silicon Manufacturing Company Pte. Ltd. (“SSMC”) SSMC is a joint venture in Singapore that we established with Philips and EDB to produce integrated circuits by means of advanced submicron manufacturing processes.

Taiwan Semiconductor Manufacturing Company Limited names Xintec, Inc. as its assembly and test provider; State current since 2026-04-16 (this filer's naming: current); last named 2026-04-16.

In 2025 , we incurred total manufacturing expenses of NT$ 5,448 million (US$ 174 million) from Xintec, representing 0.4% of our total cost of revenue.

From TSM's 20-F filed 2026-04-16, accession 000162828026025362, period December 31, 2025, under ITEM 7. MAJOR SHAREHOLDERS AND RELATED PARTY TRANSACTIONS; characters 348561 to 348711; re-found.

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In 2025 , we had total sales of NT $31,094 million (US $991 million) to GUC, representing 0.8% of our total revenue. Xintec, Inc. (“Xintec”) In January 2007, we acquired a 51.2% equity interest in Xintec, a supplier of wafer level packaging service, to support our CMOS image sensor manufacturing business. Xintec listed its shares on the Taipei Exchange in March 2015. Subsequent to Xintec’s IPO, our shareholding in Xintec was diluted to approximately 41.2%. As of February 28, 2026 , we owned approximately 41.0% of the equity interest in Xintec. In 2025 , we incurred total manufacturing expenses of NT$ 5,448 million (US$ 174 million) from Xintec, representing 0.4% of our total cost of revenue. ITEM 8. FINANCIAL INFORMATION Consolidated Financial Statements and Other Financial Information Please see “Item 18. Financial Statements”. Other than as disclosed elsewhere in this annual report, no significant change has occurred since the date of the annual consolidated financial statements.

stale (37)

Taiwan Semiconductor Manufacturing Company Limited names Altera Corporation as its end customer; State stale since 2015-04-13 (this filer's naming: stale); last named 2013-04-02; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor and system companies such as Advanced Micro Devices, Inc., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, OmniVision Technologies and Qualcomm Incorporated, to integrated device manufacturers such as LSI Corporation, STMicroelectronics and Texas Instruments Inc.

From TSM's 20-F filed 2013-04-02, accession 000119312513137651, period December 31, 2012, under ITEM 4. INFORMATION ON THE COMPANY; characters 77166 to 77603; re-found.

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We estimate that our revenue market segment share among total foundries worldwide was 45% in 2012. We also offer design, mask making, bumping, probing, assembly and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “— Manufacturing Capacity and Technology” and “— Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor and system companies such as Advanced Micro Devices, Inc., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, OmniVision Technologies and Qualcomm Incorporated, to integrated device manufacturers such as LSI Corporation, STMicroelectronics and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 85%, and integrated device manufacturers accounted for approximately 15% of our net sales in 2012. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs and three 300mm wafer fabs.

Ambarella, Inc. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State stale since 2022-04-01 (this filer's naming: stale); last named 2020-03-27; not named in Ambarella, Inc.'s 2026-03-23 filing as read.

The wafers used by GUC in the assembly of our products are manufactured by Taiwan Semiconductor Manufacturing Co., Ltd., or TSMC, in Taiwan.

From AMBARELLA, INC.'s 10-K filed 2020-03-27, accession 000156459020013513, period January 31, 2020, under ITEM 1. BUSINESS; characters 78483 to 78623; re-found.

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While we currently manufacture the majority of our solutions in the 28nm and 14nm process nodes utilizing the services of several different foundries, our most recent products are manufactured in the 10nm process node. Currently, the majority of our SoCs are supplied by Samsung in facilities located in Austin, Texas and South Korea, from whom we have the option to purchase both fully-assembled and tested products as well as tested die in wafer form for assembly. We also have products supplied by Global Foundries, Global UniChip Corporation, or GUC, in Taiwan. The wafers used by GUC in the assembly of our products are manufactured by Taiwan Semiconductor Manufacturing Co., Ltd., or TSMC, in Taiwan. 13 Assembly and Testing Samsung subcontracts the assembly and initial testing of the assembled chips it supplies to us to Signetics Corporation and STATS ChipPAC Ltd. In the case of purchases of tested die from Samsung, we contract the assembly to Advanced Semiconductor Engineering, Inc., or ASE.

Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11620 to 11751; re-found.

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Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

TSMC joined the Customer Co-Investment Program of ASML Holding N.V. (“ASML”) in August 2012.

From TSM's 20-F filed 2019-04-17, accession 000119312519108390, period December 31, 2018, under ITEM 10. ADDITIONAL INFORMATION; characters 248763 to 248855; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names Bitmain Technologies Limited as its end customer; State stale since 2020-04-15 (this filer's naming: stale); last named 2018-04-19; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Bitmain Technologies Limited, Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Texas Instruments Inc.

From TSM's 20-F filed 2018-04-19, accession 000119312518121866, period December 31, 2017, under ITEM 4. INFORMATION ON THE COMPANY; characters 77430 to 77922; re-found.

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We estimate that our revenue market segment share among total foundries worldwide was 56% in 2017. We also offer design, mask making, bumping, probing, and assembly and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “– Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Bitmain Technologies Limited, Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 80%, and integrated device manufacturers accounted for approximately 20% of our net revenue in 2017.

Taiwan Semiconductor Manufacturing Company Limited names Broadcom Corporation as its end customer; State stale since 2017-04-13 (this filer's naming: stale); last named 2015-04-13; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Corporation, Freescale Semiconductor, Inc., Huawei Tech, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors, OmniVision Technologies, Qualcomm Inc. and Texas Instruments Inc.

From TSM's 20-F filed 2015-04-13, accession 000119312515126836, period December 31, 2014, under ITEM 4. INFORMATION ON THE COMPANY; characters 69088 to 69534; re-found.

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We estimate that our revenue market segment share among total foundries worldwide was 54% in 2014. We also offer design, mask making, bumping, probing, and assembly and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “— Manufacturing Capacity and Technology” and “— Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Corporation, Freescale Semiconductor, Inc., Huawei Tech, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors, OmniVision Technologies, Qualcomm Inc. and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 85%, and integrated device manufacturers accounted for approximately 15% of our net revenue in 2014. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs and three 300mm wafer fabs.

Taiwan Semiconductor Manufacturing Company Limited names Formosa Sumco Technology Corporation as its supplier; State stale since 2026-04-16 (this filer's naming: stale); last named 2024-04-18; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, GlobalWafers of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, Soitec Microelectronics of Singapore, and SUMCO Corporation of Japan.

From TSM's 20-F filed 2024-04-18, accession 000119312524099840, period December 31, 2023, under ITEM 4. INFORMATION ON THE COMPANY; characters 231472 to 231710; re-found.

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The most important raw material used in our production is silicon wafer, which is the basic raw material from which integrated circuits are made. The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, GlobalWafers of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, Soitec Microelectronics of Singapore, and SUMCO Corporation of Japan. Together they supplied approximately 96.0%, 95.0% and 96.2% of our total wafer needs in 2021, 2022 and 2023, respectively. We have in the past obtained, and believe we will continue to be able to obtain, a sufficient supply of wafers.

Taiwan Semiconductor Manufacturing Company Limited names Freescale Semiconductor, Inc. as its end customer; State stale since 2017-04-13 (this filer's naming: stale); last named 2015-04-13; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Corporation, Freescale Semiconductor, Inc., Huawei Tech, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors, OmniVision Technologies, Qualcomm Inc. and Texas Instruments Inc.

From TSM's 20-F filed 2015-04-13, accession 000119312515126836, period December 31, 2014, under ITEM 4. INFORMATION ON THE COMPANY; characters 69088 to 69534; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names GlobalWafers Co., Ltd. as its supplier; State stale since 2026-04-16 (this filer's naming: stale); last named 2024-04-18; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, GlobalWafers of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, Soitec Microelectronics of Singapore, and SUMCO Corporation of Japan.

From TSM's 20-F filed 2024-04-18, accession 000119312524099840, period December 31, 2023, under ITEM 4. INFORMATION ON THE COMPANY; characters 231472 to 231710; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names HiSilicon Technologies Co., Ltd. as its end customer; State stale since 2022-04-14 (this filer's naming: stale); last named 2020-04-15; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Xilinx Inc.

From TSM's 20-F filed 2020-04-15, accession 000119312520107579, period December 31, 2019, under ITEM 4. INFORMATION ON THE COMPANY; characters 78318 to 78738; re-found.

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We estimate that our revenue market segment share among total foundries worldwide was 52% in 2019. We also offer design, mask making, bumping, advanced packaging, and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “– Semiconductor Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Xilinx Inc. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs, five 300mm wafer fabs, and four advanced backend fabs.

Taiwan Semiconductor Manufacturing Company Limited names Huawei Technologies Co., Ltd. as its end customer; State stale since 2025-04-17 (this filer's naming: stale); last named 2023-04-20; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

To comply with relevant laws and regulations, we have discontinued shipment of products to Huawei since September 15, 2020.

From TSM's 20-F filed 2023-04-20, accession 000119312523107214, period December 31, 2022, under ITEM 3. KEY INFORMATION; characters 132000 to 132123; re-found.

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For example, in May 2020 and again in August 2020, the U.S. tightened its export control measures against Huawei Technology Co. Ltd. and its affiliates (collectively, “Huawei”), including an expanded license requirement for providing Huawei with items subject to the U.S. export control jurisdiction. To comply with relevant laws and regulations, we have discontinued shipment of products to Huawei since September 15, 2020. Since February 2022, there have been expansive measures, including sanctions and export controls, imposed by several countries and regions against Russia, including certain individuals and entities, in connection with the military conflict in Ukraine.

Taiwan Semiconductor Manufacturing Company Limited names Huawei Technologies Co., Ltd. as its end customer; State stale since 2018-04-19 (this filer's naming: stale); last named 2016-04-11; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Corporation, Huawei Tech, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technologies Inc., Qualcomm Inc., Sony Corporation, Spreadtrum Communications, Inc. and Texas Instruments Inc.

From TSM's 20-F filed 2016-04-11, accession 000119312516536225, period December 31, 2015, under ITEM 4. INFORMATION ON THE COMPANY; characters 72735 to 73214; re-found.

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We estimate that our revenue market segment share among total foundries worldwide was 55% in 2015. We also offer design, mask making, bumping, probing, and assembly and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “— Manufacturing Capacity and Technology” and “— Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. 12 Table of Contents We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Corporation, Huawei Tech, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technologies Inc., Qualcomm Inc., Sony Corporation, Spreadtrum Communications, Inc. and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 81%, and integrated device manufacturers accounted for approximately 18% of our net revenue in 2015. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs and three 300mm wafer fabs.

Taiwan Semiconductor Manufacturing Company Limited names Infineon Technologies AG as its end customer; State stale since 2026-04-16 (this filer's naming: stale); last named 2024-04-18; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Limited, Infineon Technologies AG, Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., and Sony Semiconductor Solutions Corporation.

From TSM's 20-F filed 2024-04-18, accession 000119312524099840, period December 31, 2023, under ITEM 4. INFORMATION ON THE COMPANY; characters 197144 to 197596; re-found.

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We produced 28 percent of the world semiconductor excluding memory output value in 2023, as compared to 30 percent in the previous year, mainly due to an inventory correction within the semiconductor industry. We believe that our scale and capacity, particularly for advanced technologies, is a major competitive advantage. Please see “– Semiconductor Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Limited, Infineon Technologies AG, Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., and Sony Semiconductor Solutions Corporation. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs, six 300mm wafer fabs, and five advanced backend fabs.

Taiwan Semiconductor Manufacturing Company Limited names LSI Corporation as its end customer; State stale since 2015-04-13 (this filer's naming: stale); last named 2013-04-02; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor and system companies such as Advanced Micro Devices, Inc., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, OmniVision Technologies and Qualcomm Incorporated, to integrated device manufacturers such as LSI Corporation, STMicroelectronics and Texas Instruments Inc.

From TSM's 20-F filed 2013-04-02, accession 000119312513137651, period December 31, 2012, under ITEM 4. INFORMATION ON THE COMPANY; characters 77166 to 77603; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names Marvell Technology, Inc. as its end customer; State stale since 2021-04-16 (this filer's naming: stale); last named 2019-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Texas Instruments Inc.

From TSM's 20-F filed 2019-04-17, accession 000119312519108390, period December 31, 2018, under ITEM 4. INFORMATION ON THE COMPANY; characters 75502 to 75964; re-found.

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We estimate that our revenue market segment share among total foundries worldwide was 56% in 2018. We also offer design, mask making, bumping, advanced packaging, and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “— Semiconductor Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Texas Instruments Inc. Growth Opportunities In light of the rapid growth in four major markets, namely mobile, high-performance computing, automotive electronics, and IoT, and the fact that focus of customer demand is shifting from process-technology-centric to product-application-centric, we have constructed four different technology platforms to provide customers with the most comprehensive and competitive …

Taiwan Semiconductor Manufacturing Company Limited names MEMC Electronic Materials Inc. as its supplier; State stale since 2016-04-11 (this filer's naming: stale); last named 2014-04-14; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Shin-Etsu Handotai and SUMCO Corporation of Japan, MEMC Electronic Materials, Inc. of the United States, Siltronic AG of Germany and Formosa Sumco Technology Corporation of Taiwan. Together they supplied approximately 94.2% and 93.3% of our total wafer needs in 2012 and 2013, respectively.

From TSM's 20-F filed 2014-04-14, accession 000119312514141496, period December 31, 2013, under ITEM 4. INFORMATION ON THE COMPANY; characters 103677 to 104010; re-found.

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The most important raw material used in our production is silicon wafers, which is the basic raw material from which integrated circuits are made. The principal suppliers for our wafers are Shin-Etsu Handotai and SUMCO Corporation of Japan, MEMC Electronic Materials, Inc. of the United States, Siltronic AG of Germany and Formosa Sumco Technology Corporation of Taiwan. Together they supplied approximately 94.2% and 93.3% of our total wafer needs in 2012 and 2013, respectively. We have in the past obtained, and believe we will continue to be able to obtain, a sufficient supply of wafers. Please see “Item 3. Key Information - Risk Factors - Risks Relating to Our Business” for a discussion of the risk related to raw materials.

Taiwan Semiconductor Manufacturing Company Limited names MEMC Electronic Materials Inc. as its supplier; State stale since 2015-04-13 (this filer's naming: stale); last named 2013-04-02; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Shin-Etsu Handotai and SUMCO Corporation of Japan, MEMC Electronic Materials, Inc. of the United States, Siltronic AG of Germany and Formosa Sumco Technology Corporation of Taiwan. Together they supplied approximately 96.8%, 96.0% and 94.2% of our total wafer needs in 2010, 2011 and 2012, respectively.

From TSM's 20-F filed 2013-04-02, accession 000119312513137651, period December 31, 2012, under ITEM 4. INFORMATION ON THE COMPANY; characters 109199 to 109545; re-found.

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The quality and delivery performance of each vendor is evaluated quarterly and quantity allocations are adjusted for subsequent periods based on the evaluation. The most important raw material used in our production is silicon wafers, which is the basic raw material from which integrated circuits are made. The principal suppliers for our wafers are Shin-Etsu Handotai and SUMCO Corporation of Japan, MEMC Electronic Materials, Inc. of the United States, Siltronic AG of Germany and Formosa Sumco Technology Corporation of Taiwan. Together they supplied approximately 96.8%, 96.0% and 94.2% of our total wafer needs in 2010, 2011 and 2012, respectively. We have in the past obtained, and believe we will continue to be able to obtain, a sufficient supply of 150mm, 200mm and 300mm wafers. Please see “Item 3. Key Information - Risk Factors - Risks Relating to Our Business” for a discussion of the risk related to raw materials.

Microsoft Corporation names Taiwan Semiconductor Manufacturing Company Limited as its supplier; State stale since 2015-07-31 (this filer's naming: stale); last named 2013-07-30; not named in Microsoft Corporation's 2025-07-30 filing as read.

Sourcing in the filing's own words: single source.

The integrated central processing unit/graphics processing unit for the Xbox 360 console is purchased from IBM, and the supporting embedded dynamic random access memory chips are purchased from Taiwan Semiconductor Manufacturing Company.

From MICROSOFT CORP's 10-K filed 2013-07-30, accession 000119312513310206, period June 30, 2013, under Item 1 Competition Our Xbox; characters 31040 to 31277; re-found.

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Localizing a product may require modifying the user interface, altering dialog boxes, and translating text. We contract most of our manufacturing activities for Xbox 360 and related games, Kinect for Xbox 360, various retail software packaged products, Surface devices, and Microsoft PC accessories to third parties. Our products may include some components that are available from only one or limited sources. Our Xbox 360 console, Kinect for Xbox 360, Surface devices, and Microsoft PC accessories include key components that are supplied by a single source. The integrated central processing unit/graphics processing unit for the Xbox 360 console is purchased from IBM, and the supporting embedded dynamic random access memory chips are purchased from Taiwan Semiconductor Manufacturing Company. We generally have the ability to use other manufacturers if the current vendor becomes unavailable or unable to meet our requirements. We generally have multiple sources for raw materials, supplies, and components, and are often able to acquire component parts and materials on a volume discount basis.

NXP Semiconductors N.V. names Taiwan Semiconductor Manufacturing Company Limited as its customer; State stale since 2016-02-26 (this filer's naming: stale); last named 2014-02-28; not named in NXP Semiconductors N.V.'s 2026-02-19 filing as read.

They also reflect the ongoing results from the sale of wafers to our SSMC joint venture partner, TSMC.

From NXP Semiconductors N.V.'s 20-F filed 2014-02-28, accession 000119312514075232, period December 31, 2013, under Item 19. Exhibits; characters 591087 to 591189; re-found.

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complexity and the management of the business. In addition, during the fourth quarter of 2013 we determined that a change to our reportable segments was warranted due to the significant decline in external revenues and costs reported by Manufacturing Operations (“MO”). These external results were, to a large extent, derived from revenue of wafer foundry and packaging services to our divested businesses in order to support their separation and, on a limited basis, their ongoing operations. They also reflect the ongoing results from the sale of wafers to our SSMC joint venture partner, TSMC. MO’s results are also not regularly reviewed by the Chief Operating Decision Maker, or CODM to assess operating performance and allocate resources as its primary function is to manage the Company’s internal manufacturing and supply chain activities and substantially all of its results are reflected within the operating segments utilizing its services.

NXP Semiconductors N.V. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State current since 2025-04-17 (this filer's naming: stale); last named 2013-03-01; not named in NXP Semiconductors N.V.'s 2026-02-19 filing as read.

The Company has made certain commitments to TSMC, whereby the Company is obligated to make cash payments to TSMC with respect to long-term obligations for a joint development process should it fail to purchase an agreed-upon accumulative volume of wafers.

From NXP Semiconductors N.V.'s 20-F filed 2013-03-01, accession 000119312513086161, period December 31, 2012, under Item 19. Exhibits; characters 582720 to 582975; re-found.

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Guarantees At the end of 2012 there were no material guarantees recognized by the Company. F-31 Table of Contents Other commitments The Company has made certain commitments to TSMC, whereby the Company is obligated to make cash payments to TSMC with respect to long-term obligations for a joint development process should it fail to purchase an agreed-upon accumulative volume of wafers. The maximum commitment is $18 million and expires at the end of 2015. Environmental remediation In each jurisdiction in which we operate, we are subject to many environmental, health and safety laws and regulations that govern, among other things, emissions of pollutants into the air, wastewater …

Taiwan Semiconductor Manufacturing Company Limited names Omnivision Technologies Inc. as its end customer; State stale since 2024-04-18 (this filer's naming: stale); last named 2022-04-14; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technology Inc., Qualcomm Inc., and Renesas Electronics Corporation.

From TSM's 20-F filed 2022-04-14, accession 000119312522104891, period December 31, 2021, under ITEM 4. INFORMATION ON THE COMPANY; characters 187135 to 187553; re-found.

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We also offer design, mask making, TSMC 3DFabric TM advanced packaging and testing services. We produced 26 percent of the world semiconductor excluding memory output value in 2021, as compared to 24 percent in the previous year. We believe that our scale and capacity, particularly for advanced technologies, is a major competitive advantage. Please see “– Semiconductor Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technology Inc., Qualcomm Inc., and Renesas Electronics Corporation. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs, five 300mm wafer fabs, and four advanced backend fabs.

Taiwan Semiconductor Manufacturing Company Limited names Omnivision Technologies Inc. as its end customer; State stale since 2019-04-17 (this filer's naming: stale); last named 2017-04-13; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Huawei Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technologies Inc., Qualcomm Inc., Sony Corporation, Spreadtrum Communications, Inc. and Texas Instruments Inc.

From TSM's 20-F filed 2017-04-13, accession 000119312517122097, period December 31, 2016, under ITEM 4. INFORMATION ON THE COMPANY; characters 70330 to 70852; re-found.

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We estimate that our revenue market segment share among total foundries worldwide was 56% in 2016. We also offer design, mask making, bumping, probing, and assembly and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “– Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Huawei Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technologies Inc., Qualcomm Inc., Sony Corporation, Spreadtrum Communications, Inc. and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 83%, and integrated device manufacturers accounted for approximately 17% of our net revenue in 2016. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs and three 300mm wafer fabs.

Taiwan Semiconductor Manufacturing Company Limited names Omnivision Technologies Inc. as its end customer; State stale since 2017-04-13 (this filer's naming: stale); last named 2015-04-13; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Corporation, Freescale Semiconductor, Inc., Huawei Tech, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors, OmniVision Technologies, Qualcomm Inc. and Texas Instruments Inc.

From TSM's 20-F filed 2015-04-13, accession 000119312515126836, period December 31, 2014, under ITEM 4. INFORMATION ON THE COMPANY; characters 69088 to 69534; re-found.

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ON Semiconductor Corporation names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State stale since 2020-02-19 (this filer's naming: stale); last named 2018-02-21; not named in ON Semiconductor Corporation's 2026-02-09 filing as read.

These contract manufacturers, including Amkor, ASE, Kingpak, SMIC, TPSCo and TSMC, collectively accounted for approximately 36%, 36% and 39% of our manufacturing costs in 2017, 2016 and 2015, respectively.

From ON SEMICONDUCTOR CORPORATION's 10-K filed 2018-02-21, accession 000119312518051397, period December 31, 2017, under Item 1. Business; characters 40372 to 40577; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names R.O.C. Ministry of Economic Affairs as its government customer; State stale since 2018-04-19 (this filer's naming: stale); last named 2016-04-11; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

According to our agreement with the Industrial Technology Research Institute of Taiwan, or ITRI, the Ministry of Economic Affairs of the R.O.C., or an entity designated by the Ministry of Economic Affairs, has an option to purchase up to 35% of certain of our capacity, if our outstanding commitments to our customers are not prejudiced.

From TSM's 20-F filed 2016-04-11, accession 000119312516536225, period December 31, 2015, under ITEM 3. KEY INFORMATION; characters 39797 to 40134; re-found.

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Also, since we procure some of our raw materials from sole-source suppliers, there is a risk that our need for such raw materials may not be met or that back-up supplies may not be readily available. Our revenue and earnings could decline if we are unable to obtain adequate supplies of the necessary raw materials in a timely manner or if there are significant increases in the costs of raw materials that we cannot pass on to our customers. If the Ministry of Economic Affairs uses a substantial portion of our production capacity, we will not be able to service our other customers. According to our agreement with the Industrial Technology Research Institute of Taiwan, or ITRI, the Ministry of Economic Affairs of the R.O.C., or an entity designated by the Ministry of Economic Affairs, has an option to purchase up to 35% of certain of our capacity, if our outstanding commitments to our customers are not prejudiced. Although the Ministry of Economic Affairs has never exercised this option, if this option is exercised to any significant degree during tight market conditions, we may not be able to provide services to all of our other customers unless we are able to increase our capacity accordingly or outsource such increased demand in a timely manner. 6

Taiwan Semiconductor Manufacturing Company Limited names Shin-Etsu Handotai as its supplier; State stale since 2026-04-16 (this filer's naming: stale); last named 2024-04-18; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, GlobalWafers of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, Soitec Microelectronics of Singapore, and SUMCO Corporation of Japan.

From TSM's 20-F filed 2024-04-18, accession 000119312524099840, period December 31, 2023, under ITEM 4. INFORMATION ON THE COMPANY; characters 231472 to 231710; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names Siltronic AG as its supplier; State stale since 2026-04-16 (this filer's naming: stale); last named 2024-04-18; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, GlobalWafers of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, Soitec Microelectronics of Singapore, and SUMCO Corporation of Japan.

From TSM's 20-F filed 2024-04-18, accession 000119312524099840, period December 31, 2023, under ITEM 4. INFORMATION ON THE COMPANY; characters 231472 to 231710; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names Soitec Microelectronics as its supplier; State stale since 2026-04-16 (this filer's naming: stale); last named 2024-04-18; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, GlobalWafers of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, Soitec Microelectronics of Singapore, and SUMCO Corporation of Japan.

From TSM's 20-F filed 2024-04-18, accession 000119312524099840, period December 31, 2023, under ITEM 4. INFORMATION ON THE COMPANY; characters 231472 to 231710; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names Spreadtrum Communications, Inc. (now UNISOC (Shanghai) Technologies Co., Ltd.) as its end customer; State stale since 2019-04-17 (this filer's naming: stale); last named 2017-04-13; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Huawei Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technologies Inc., Qualcomm Inc., Sony Corporation, Spreadtrum Communications, Inc. and Texas Instruments Inc.

From TSM's 20-F filed 2017-04-13, accession 000119312517122097, period December 31, 2016, under ITEM 4. INFORMATION ON THE COMPANY; characters 70330 to 70852; re-found.

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STMicroelectronics N.V. names Taiwan Semiconductor Manufacturing Company Limited as its foundry; State stale since 2025-02-27 (this filer's naming: stale); last named 2023-02-23; not named in STMicroelectronics N.V.'s 2026-02-26 filing as read.

the parties indicated that they are moving to agree that TSMC, one of the world's leading dedicated semiconductor foundry companies, will manufacture the SoC wafers for ST.

From STMicroelectronics N.V.'s 20-F filed 2023-02-23, accession 000156459023002312, period December 31, 2022, under Item 5 . Operating and Financial Review and Prospects; characters 287797 to 287969; re-found.

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This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out. The project remains subject to regulatory approvals from the European Commission’s DG Competition. On July 20, 2022, we announced a new cooperation model with CARIAD, the software unit of Volkswagen Group, under which the underlying parties will jointly develop an automotive system-on-chip (SoC). The planned cooperation targets the new generation of Volkswagen Group vehicles that will be based on the unified and scalable software platform. At the same time, the parties indicated that they are moving to agree that TSMC, one of the world's leading dedicated semiconductor foundry companies, will manufacture the SoC wafers for ST. On July 11, 2022, we signed a Memorandum of Understanding with GlobalFoundries to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out.

Taiwan Semiconductor Manufacturing Company Limited names STMicroelectronics N.V. as its end customer; State stale since 2025-02-27 (this filer's naming: stale); last named 2023-04-20; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Limited, Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation, Sony Semiconductor Solutions Corporation, and STMicroelectronics N.V.

From TSM's 20-F filed 2023-04-20, accession 000119312523107214, period December 31, 2022, under ITEM 4. INFORMATION ON THE COMPANY; characters 188785 to 189268; re-found.

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We also offer design, mask making, TSMC 3DFabric TM advanced packaging and silicon stacking technologies and testing services. We produced 30 percent of the world semiconductor excluding memory output value in 2022, as compared to 26 percent in the previous year. We believe that our scale and capacity, particularly for advanced technologies, is a major competitive advantage. Please see “– Semiconductor Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Amazon Web Services, Inc., Broadcom Limited, Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Renesas Electronics Corporation, Sony Semiconductor Solutions Corporation, and STMicroelectronics N.V. 13 Table of Contents Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs, five 300mm wafer fabs, and five advanced backend fabs.

Taiwan Semiconductor Manufacturing Company Limited names SUMCO Corporation as its supplier; State stale since 2026-04-16 (this filer's naming: stale); last named 2024-04-18; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, GlobalWafers of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, Soitec Microelectronics of Singapore, and SUMCO Corporation of Japan.

From TSM's 20-F filed 2024-04-18, accession 000119312524099840, period December 31, 2023, under ITEM 4. INFORMATION ON THE COMPANY; characters 231472 to 231710; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names SunEdison Semiconductor Limited as its supplier; State stale since 2018-04-19 (this filer's naming: stale); last named 2016-04-11; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, SUMCO Corporation of Japan, and SunEdison Semiconductor Ltd. of the United States. Together they supplied approximately 93.3%, 94.3% and 95.5% of our total wafer needs in 2013, 2014 and 2015, respectively.

From TSM's 20-F filed 2016-04-11, accession 000119312516536225, period December 31, 2015, under ITEM 4. INFORMATION ON THE COMPANY; characters 100936 to 101286; re-found.

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The quality and delivery performance of each vendor is evaluated quarterly and quantity allocations are adjusted for subsequent periods based on the evaluation. The most important raw material used in our production is silicon wafers, which is the basic raw material from which integrated circuits are made. The principal suppliers for our wafers are Formosa SUMCO Technology Corporation of Taiwan, Shin-Etsu Handotai of Japan, Siltronic AG of Germany, SUMCO Corporation of Japan, and SunEdison Semiconductor Ltd. of the United States. Together they supplied approximately 93.3%, 94.3% and 95.5% of our total wafer needs in 2013, 2014 and 2015, respectively. We have in the past obtained, and believe we will continue to be able to obtain, a sufficient supply of wafers. Please see “Item 3. Key Information—Risk Factors—Risks Relating to Our Business” for a discussion of the risk related to raw materials.

Taiwan Semiconductor Manufacturing Company Limited names Taiwan Power Company as its supplier; State stale since 2024-04-18 (this filer's naming: stale); last named 2022-04-14; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We have occasionally suffered power outages or surges in Taiwan caused by difficulties encountered by our electricity supplier, the Taiwan Power Company, or other power consumers on the same power grid.

From TSM's 20-F filed 2022-04-14, accession 000119312522104891, period December 31, 2021, under ITEM 3. KEY INFORMATION; characters 168479 to 168681; re-found.

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In addition, there is also a risk that any post-pandemic downward changes in consumers’ demand for electronic products may, in turn, lead to reduced demand for and place downward pressure on the price of our products and services. Our operation may be interrupted, and our expansion may be limited, by power or other utility shortages. We have occasionally suffered power outages or surges in Taiwan caused by difficulties encountered by our electricity supplier, the Taiwan Power Company, or other power consumers on the same power grid. Some of these have resulted in interruptions to our operations. Such shortages or interruptions in electricity supply could further be exacerbated by changes in the energy policy of the government, which intends to make Taiwan a nuclear-free country by 2025.

Taiwan Semiconductor Manufacturing Company Limited names Texas Instruments Incorporated as its end customer; State stale since 2021-04-16 (this filer's naming: stale); last named 2019-04-17; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Texas Instruments Inc.

From TSM's 20-F filed 2019-04-17, accession 000119312519108390, period December 31, 2018, under ITEM 4. INFORMATION ON THE COMPANY; characters 75502 to 75964; re-found.

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Taiwan Semiconductor Manufacturing Company Limited names Vanguard International Semiconductor Corporation as its licensee (licence words as read: HE-1 support audit 83.0% supported, 1.7% wrong over all relations; the use-case audit (C-6) has not run); State stale since 2020-04-15 (this filer's naming: stale); last named 2018-04-19; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We also agreed to license VIS certain of our process technologies and transfer certain technical know-how and information. TSMC receives from VIS certain royalty payments for granting such licenses.

From TSM's 20-F filed 2018-04-19, accession 000119312518121866, period December 31, 2017, under ITEM 7. MAJOR SHAREHOLDERS AND RELATED PARTY TRANSACTIONS; characters 224919 to 225117; re-found.

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Pursuant to its terms, upon expiration of its initial two-year term, this agreement is to be automatically renewed for additional one year periods unless earlier terminated by the parties. This Agreement has been so renewed per its terms. We pay VIS at a fixed discount to the actual selling price as mutually agreed between the parties in respect of each purchase order. We also agreed to license VIS certain of our process technologies and transfer certain technical know-how and information. TSMC receives from VIS certain royalty payments for granting such licenses. In 2017, we had total purchases of NT$5,756 million (US$194 million) from VIS, representing 1.2% of our total cost of revenue. 42

Taiwan Semiconductor Manufacturing Company Limited names Xilinx, Inc. as its end customer; State stale since 2023-04-20 (this filer's naming: stale); last named 2021-04-16; not named in Taiwan Semiconductor Manufacturing Company Limited's 2026-04-16 filing as read.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technology Inc., Qualcomm Inc., STMicroelectronics N.V., and Xilinx Inc.

From TSM's 20-F filed 2021-04-16, accession 000119312521118512, period December 31, 2020, under ITEM 4. INFORMATION ON THE COMPANY; characters 81451 to 81873; re-found.

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We produced 24 percent of the world semiconductor excluding memory output value in 2020, as compared to 21 percent in the previous year. We also offer design, mask making, TSMC 3DFabric TM advanced 3D chip stacking and packaging, and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “– Semiconductor Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Intel Corporation, MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., OmniVision Technology Inc., Qualcomm Inc., STMicroelectronics N.V., and Xilinx Inc. Our Semiconductor Facilities We currently operate one 150mm wafer fab, six 200mm wafer fabs, five 300mm wafer fabs, and four advanced backend fabs.

Book weight, not a loss or exposure estimate

For each shared counterparty: the share of this book's gross, long and short weight held in holdings with a current disclosed relationship with it. Long and short are never netted; funds and lines with no weight are left out of the book's weight.

Counterparty	Gross	Long	Short	Holdings
Taiwan Semiconductor Manufacturing Company Limited	68.0%	68.0%	none	AMD, ASML, AVGO, NVDA, QCOM
Hewlett Packard Enterprise Company	48.0%	48.0%	none	AMD, AVGO, NVDA
Nokia Corporation	46.0%	46.0%	none	AVGO, NVDA, QCOM
Samsung Electronics Co., Ltd.	44.0%	44.0%	none	AMD, NVDA, QCOM
Siliconware Precision Industries Co., Ltd.	36.0%	36.0%	none	AMD, AVGO, QCOM
Advanced Semiconductor Engineering, Inc.	24.0%	24.0%	none	AVGO, QCOM
Amkor Technology, Inc.	24.0%	24.0%	none	AVGO, QCOM
Apple Inc.	18.0%	18.0%	none	AMKR, QCOM
Broadcom Inc.	26.0%	26.0%	none	AMKR, TSM
Cirrus Logic, Inc.	26.0%	26.0%	none	AMKR, TSM
GLOBALFOUNDRIES Inc.	22.0%	22.0%	none	AMD, QCOM
Hon Hai Precision Industry Co., Ltd.	36.0%	36.0%	none	AVGO, NVDA
HP Inc.	34.0%	34.0%	none	AMD, NVDA
Intel Corporation	28.0%	28.0%	none	ASML, TSM
Lam Research Corporation	24.0%	24.0%	none	MU, TSM
Microsoft Corporation	34.0%	34.0%	none	AMD, NVDA
NVIDIA Corporation	24.0%	24.0%	none	MU, TSM
QUALCOMM INC	26.0%	26.0%	none	AMKR, TSM