SMIC, Entity List: Semiconductor Manufacturing International Corporation (SMIC) as of 2020-12-18

Relationship mentions, completeness untested (reached through a disclosed relationship).

Second-hop block hidden (the second-hop test, H2, has not passed).

Nothing known on or after the date is used; the evidence is the covered filers' annual reports read so far.

The synthetic demo book (a development fixture, not a person's book), line by line

LineAs enteredLabelWhy
1NVDA 22not reached by disclosed evidenceThe dated relationship table records no relationship with Semiconductor Manufacturing International Corporation (SMIC) from NVDA's read filings, the latest dated 2020-02-20 (302 days before the as-of date). Its filings were not searched for Semiconductor Manufacturing International Corporation (SMIC): never asked.
2TSM 18reached through a disclosed relationship (relationship mentions, completeness untested)
3AVGO 14reached through a disclosed relationship (relationship mentions, completeness untested)
4AMD 12not reached by disclosed evidenceThe dated relationship table records no relationship with Semiconductor Manufacturing International Corporation (SMIC) from AMD's read filings, the latest dated 2020-02-04 (318 days before the as-of date). Its filings were not searched for Semiconductor Manufacturing International Corporation (SMIC): never asked.
5QCOM 10reached through a disclosed relationship (relationship mentions, completeness untested)
6ASML 10not reached by disclosed evidenceThe dated relationship table records no relationship with Semiconductor Manufacturing International Corporation (SMIC) from ASML's read filings, the latest dated 2020-02-12 (310 days before the as-of date). Its filings were not searched for Semiconductor Manufacturing International Corporation (SMIC): never asked.
7AMKR 8not reached by disclosed evidenceThe dated relationship table records no relationship with Semiconductor Manufacturing International Corporation (SMIC) from AMKR's read filings, the latest dated 2020-02-19 (303 days before the as-of date). Its filings were not searched for Semiconductor Manufacturing International Corporation (SMIC): never asked.
8MU 6not reached by disclosed evidenceThe dated relationship table records no relationship with Semiconductor Manufacturing International Corporation (SMIC) from MU's read filings, the latest dated 2020-10-19 (60 days before the as-of date). Its filings were not searched for Semiconductor Manufacturing International Corporation (SMIC): never asked.

Reached (5)

Broadcom AVGOcovered filerbest State current

named by AVGO as its foundry: State current since 2018-12-21 (the edge: current since 2018-12-21); last named 2018-12-21, 728 days before the date.

The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited, or TSMC, primarily, as well as United Microelectronics Corporation, Semiconductor Manufacturing International Corporation, GlobalFoundries, TowerJazz and WIN Semiconductors Corp.

From AVGO's 10-K filed 2018-12-21, accession 000173016818000084, period November 4, 2018, under ITEM 1. BUSINESS; characters 44586 to 44924; re-found.

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We have strategically developed distributor relationships to serve thousands of customers around the world. A significant amount of our sales are to large global electronic components distributors, complemented by a number of regional distributors with customer relationships based on their respective product ranges. We believe we are well-positioned to support our customers throughout the design, technology transfer and manufacturing stages across all geographies. 7 Table of Contents Operations The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited, or TSMC, primarily, as well as United Microelectronics Corporation, Semiconductor Manufacturing International Corporation, GlobalFoundries, TowerJazz and WIN Semiconductors Corp. We use third-party contract manufacturers for a significant majority of our assembly and test operations, including Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Inari Technology Sdn Bhd and Flextronics Telecom Systems, Ltd. We use our internal fabrication facilities for products utilizing our innovative and proprietary processes, …

ON SEMICONDUCTOR CORP ORATION ONcovered filerbest State stale

named by ON as its foundry: State stale since 2020-02-19 (the edge: stale since 2020-02-19); last named 2018-02-21, 1031 days before the date.

These contract manufacturers, including Amkor, ASE, Kingpak, SMIC, TPSCo and TSMC, collectively accounted for approximately 36%, 36% and 39% of our manufacturing costs in 2017, 2016 and 2015, respectively.

From ON SEMICONDUCTOR CORPORATION's 10-K filed 2018-02-21, accession 000119312518051397, period December 31, 2017, under Item 1. Business; characters 40372 to 40577; re-found.

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forecast product needs and commit to purchase services consistent with these forecasts. In some cases, longer-term commitments are required in the early stages of the relationship. These contract manufacturers, including Amkor, ASE, Kingpak, SMIC, TPSCo and TSMC, collectively accounted for approximately 36%, 36% and 39% of our manufacturing costs in 2017, 2016 and 2015, respectively. For information regarding risks associated with our foreign operations, see “Risk Factors - Trends, Risks and Uncertainties Related to Our Business” included elsewhere in this Form 10-K.

QUALCOMM Incorporated QCOMcovered filerbest State current

named by QCOM as its foundry: State current since 2020-11-04 (the edge: current since 2020-11-04); last named 2020-11-04, 44 days before the date.

Sourcing in the filing's own words: few.

The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits are Global Foundries, Samsung Electronics, Semiconductor Manufacturing International Corporation (SMIC), Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics.

From QUALCOMM Incorporated's 10-K filed 2020-11-04, accession 000172894920000067, period September 27, 2020, under Item 1. Business; characters 69837 to 70126; re-found.

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We employ both turnkey and two-stage manufacturing models to purchase our integrated circuits. Under the turnkey model, our foundry suppliers are responsible for delivering fully assembled and tested integrated circuits. Under the two-stage manufacturing model, we purchase die in singular or wafer form from semiconductor manufacturing foundries and contract with separate third-parties for manufacturing services such as wafer bump, probe, assembly and the majority of our final test requirements. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits are Global Foundries, Samsung Electronics, Semiconductor Manufacturing International Corporation (SMIC), Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics. The primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region.

SILICON LABORATORIES INC. SLABcovered filerbest State current

named by SLAB as its foundry: State current since 2020-01-29 (the edge: current since 2020-01-29); last named 2020-01-29, 324 days before the date.

We currently partner primarily with Taiwan Semiconductor Manufacturing Co. (TSMC) and Semiconductor Manufacturing International Corporation (SMIC) to manufacture the majority of our semiconductor wafers.

From SILICON LABORATORIES INC.'s 10-K filed 2020-01-29, accession 000110465920007928, period December 28, 2019, under Item 1. Business; characters 61919 to 62122; re-found.

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Our IC designs typically use industry-standard CMOS manufacturing process technology to achieve a level of performance normally associated with more expensive special-purpose IC fabrication technology. We believe the use of CMOS technology facilitates the rapid production of our ICs within a lower cost framework. Our IC production employs submicron process geometries which are readily available from leading foundry suppliers worldwide, thus increasing the likelihood that manufacturing capacity will be available throughout our products’ life cycles. We currently partner primarily with Taiwan Semiconductor Manufacturing Co. (TSMC) and Semiconductor Manufacturing International Corporation (SMIC) to manufacture the majority of our semiconductor wafers. We believe that our fabless manufacturing model significantly reduces our capital requirements and allows us to focus our resources on design, development and marketing of our ICs. Once the silicon wafers have been produced, they are shipped directly to our third-party assembly subcontractors. The assembled ICs are then moved to the final testing stage.

Taiwan Semiconductor Manufacturing Company Limited TSMcovered filerbest State stale

named by TSM as its investee: State stale since 2016-04-11 (the edge: stale since 2016-04-11); last named 2014-04-14, 2440 days before the date.

to issue to TSMC a total of 1,789,493,218 common shares of SMIC (representing about 8% of SMIC’s total shares outstanding as of December 31, 2009)

From TSM's 20-F filed 2014-04-14, accession 000119312514141496, period December 31, 2013, under ITEM 10. ADDITIONAL INFORMATION; characters 236868 to 237014; re-found.

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Pursuant to the new settlement agreement, the parties entered a stipulated judgment in favor of TSMC in the California action and the dismissal of the SMIC appeal against the Beijing Higher Court’s finding in favor of TSMC. The new settlement agreement and the stipulated judgment also require SMIC to: (a) make cash payments to TSMC totaling US$200 million, which are in addition to the US$135 million previously paid to TSMC under the 2005 settlement agreement; and (b) conditional upon relevant government regulatory approvals, to issue to TSMC a total of 1,789,493,218 common shares of SMIC (representing about 8% of SMIC’s total shares outstanding as of December 31, 2009) and a three-year warrant to purchase 695,914,030 SMIC common shares (subject to adjustment) at HK$1.30 per share (subject to adjustment). Both parties also agreed to terminate the patent cross-licensing agreement signed in 2005. On July 5, 2010, we acquired the above mentioned common shares.   47

Second hop

Second-hop block hidden until the second-hop test (H2) passes.

Where the evidence stopped (stops-v1)

locus_not_covered_filer: 1

edge_stale: 2

never_asked: 176

filer_not_read_before_as_of: 8

depth_limit: 1

Coverage

181 of 189 covered filers have a filing read before 2020-12-18. Coverage: the annual filings of 189 SEC filers read so far; where the evidence stopped is in the stop ledger.

The newest filing read before the date is dated 2020-12-17.