Renesas Naka factory fire: Renesas as of 2021-03-19

Relationship mentions, completeness untested (reached through a disclosed relationship).

Second-hop block hidden (the second-hop test, H2, has not passed).

Nothing known on or after the date is used; the evidence is the covered filers' annual reports read so far.

The synthetic demo book (a development fixture, not a person's book), line by line

LineAs enteredLabelWhy
1NVDA 22not reached by disclosed evidenceThe dated relationship table records no relationship with Renesas from NVDA's read filings, the latest dated 2021-02-26 (21 days before the as-of date). Its filings were not searched for Renesas: never asked.
2TSM 18reached through a disclosed relationship (relationship mentions, completeness untested)
3AVGO 14not reached by disclosed evidenceThe dated relationship table records no relationship with Renesas from AVGO's read filings, the latest dated 2020-12-18 (91 days before the as-of date). Its filings were not searched for Renesas: never asked.
4AMD 12not reached by disclosed evidenceThe dated relationship table records no relationship with Renesas from AMD's read filings, the latest dated 2021-01-29 (49 days before the as-of date). Its filings were not searched for Renesas: never asked.
5QCOM 10not reached by disclosed evidenceThe dated relationship table records no relationship with Renesas from QCOM's read filings, the latest dated 2020-11-04 (135 days before the as-of date). Its filings were not searched for Renesas: never asked.
6ASML 10not reached by disclosed evidenceThe dated relationship table records no relationship with Renesas from ASML's read filings, the latest dated 2021-02-10 (37 days before the as-of date). Its filings were not searched for Renesas: never asked.
7AMKR 8reached through a disclosed relationship (relationship mentions, completeness untested)
8MU 6not reached by disclosed evidenceThe dated relationship table records no relationship with Renesas from MU's read filings, the latest dated 2020-10-19 (151 days before the as-of date). Its filings were not searched for Renesas: never asked.

Reached (10)

Amkor Technology, Inc. AMKRcovered filerbest State stale

named by AMKR as its customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 756 days before the date.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

ASE Technology Holding ASXcovered filerbest State stale

named by ASX as its customer: State stale since 2014-04-17 (the edge: stale since 2014-04-17); last named 2012-04-20, 3255 days before the date.

The following table sets forth some of our largest customers, in alphabetical order, categorized by the principal end-use applications of the products which we package and test for them. Communications Computing Consumer Electronics/Industrial/Automotive Atmel Corporation Avago Technologies Broadcom Corporation Cambridge Silicon Radio Limited Media Tek Inc. Micron Technology, Inc. Qualcomm Incorporated Spreadtrum Communications, Inc. Atmel Corporation Lenovo Computer Ltd. Marvell Technology Group Ltd. NVIDIA Corporation STMicroelectronics N.V. AU Optronics Corp. Freescale Semiconductor, Inc. Motorola, Inc. Mstar International Inc. Renesas Electronics Corporation

From ASX's 20-F filed 2012-04-20, accession 000095010312002055, period December 31, 2011, under Item 4. Information on the Company; characters 182292 to 183113; re-found.

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Many of our customers are leaders in their respective end-use markets. For example, we provide Freescale Semiconductor, Inc., an industry leader in automotive semiconductor products, with a substantial portion of its outsourced packaging and testing requirements. The following table sets forth some of our largest customers, in alphabetical order, categorized by the principal end-use applications of the products which we package and test for them.     Communications     Computing     Consumer Electronics/Industrial/Automotive Atmel Corporation Avago Technologies Broadcom Corporation Cambridge Silicon Radio Limited Media Tek Inc. Micron Technology, Inc. Qualcomm Incorporated Spreadtrum Communications, Inc.   Atmel Corporation Lenovo Computer Ltd. Marvell Technology Group Ltd. NVIDIA Corporation STMicroelectronics N.V.         AU Optronics Corp. Freescale Semiconductor, Inc. Motorola, Inc. Mstar International Inc. Renesas Electronics Corporation STMicroelectronics N.V. Toshiba Corporation We categorize our revenues geographically based on the country in which the customer is headquartered. The following table sets forth, for the periods indicated, the percentage breakdown by geographic regions of our revenues.

BlackBerry Limited BBcovered filerbest State current

named by BB as its partner: State current since 2019-04-05 (the edge: current since 2019-04-05); last named 2019-04-05, 714 days before the date.

Expanded a partnership with Renesas to offer an integrated virtualization, functional safety and secure development environment for the Renesas R-Car system-on-chip devices

From BlackBerry Limited's 40-F filed 2019-04-05, accession 000107023519000014, period February 28, 2019; characters 12541 to 12713; re-found.

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… BlackBerry Workspaces to enable researchers to securely share critical research data and patient records; • Expanded its partnerships with Android and PLDT Enterprise, through Smart Communications Inc. to provide MiCab, an online taxi-hailing platform, with an integrated, secure enterprise cloud solution that maintains data privacy, meets compliance and accelerates service delivery; • Entered into a partnership with Virginia Tech to help advance the Department of Mechanical Engineering’s connected and autonomous vehicle research and provide hands-on training with BlackBerry QNX software; • Expanded a partnership with Renesas to offer an integrated virtualization, functional safety and secure development environment for the Renesas R-Car system-on-chip devices; • Expanded its partner ecosystem by growing enterprise ISV partners by 25 percent in the last year, signing on 140 new channel partners to the BlackBerry Enterprise Partner Program in the fiscal second quarter, signing four new channel partners to the BlackBerry QNX Distributor & Value-Added Integrator programs, and adding AWS as a cloud partner; and • Announced a commitment by the Government …

CEVA, INC. CEVAcovered filerbest State current

named by CEVA as its licensee: State current since 2021-03-01 (the edge: current since 2021-03-01); last named 2021-03-01, 18 days before the date.

Included among our licensees are the following customers: Actions, Artosyn, ASR Micro, Atmosic, Autotalks, Beken, Bestechnic, Broadcom, Celeno, Ceragon, Cirrus Logic, Dialog Semiconductor, DSP Group, Espressif, FujiFilm, GCT Semi, iCatch, InPlay, Intel, iRobot, Itron, Leadcore, LG Electronics, Mediatek, Microchip, MorningCore, Nextchip, Nokia, Novatek, Nurlink, NXP, ON Semiconductor, Optek, Oticon, Panasonic, RDA, Renesas, Rockchip, Rohm, Samsung, Sanechips, Sharp, SiFive, Siflower, SigmaStar, Socionext, Sony, Sonova, STMicroelectronics, Toshiba, Unisoc, Vatics, Yamaha and ZTE.

From CEVA, INC.'s 10-K filed 2021-03-01, accession 000143774921004597, period December 31, 2020, under ITEM 1. BUSINESS; characters 69652 to 70236; re-found.

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Customers   We have licensed our signal processing cores, platforms, AI processors and connectivity IPs to leading semiconductor and OEM companies throughout the world. These companies incorporate our IP into application-specific chipsets or custom-designed chipsets that they manufacture, market and sell to consumer electronics companies. We also license our technologies to OEMs directly. Included among our licensees are the following customers: Actions, Artosyn, ASR Micro, Atmosic, Autotalks, Beken, Bestechnic, Broadcom, Celeno, Ceragon, Cirrus Logic, Dialog Semiconductor, DSP Group, Espressif, FujiFilm, GCT Semi, iCatch, InPlay, Intel, iRobot, Itron, Leadcore, LG Electronics, Mediatek, Microchip, MorningCore, Nextchip, Nokia, Novatek, Nurlink, NXP, ON Semiconductor, Optek, Oticon, Panasonic, RDA, Renesas, Rockchip, Rohm, Samsung, Sanechips, Sharp, SiFive, Siflower, SigmaStar, Socionext, Sony, Sonova, STMicroelectronics, Toshiba, Unisoc, Vatics, Yamaha and ZTE.   8     International Sales and Operations   Customers based in EME (Europe and Middle East) and APAC (Asia Pacific) accounted for 79% of our total revenues for 2020, 81% of our total revenues for 2019 and 89% for 2018.

FORTINET, INC. FTNTcovered filerbest State stale

named by FTNT as its contract manufacturer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-27, 751 days before the date.

Our proprietary SPUs, which are the key to the performance of our appliances, are built by contract manufacturers including Faraday Technology Corporation (“Faraday”), Kawasaki Microelectronics America, Inc. and Renesas Electronics Corporation (“Renesas”). These contract manufacturers use foundries operated by either United Microelectronics Corporation (“UMC”) or Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), or their own foundry, such as Renesas

From FORTINET, INC.'s 10-K filed 2019-02-27, accession 000126203919000006, period December 31, 2018, under ITEM 1. Business; characters 29923 to 30387; re-found.

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We submit purchase orders to our contract manufacturers that describe the type and quantities of our products to be manufactured, the delivery date and other delivery terms. Once our products are manufactured, they are sent to either our warehouse in California, or to our logistics partner in Taoyuan City, Taiwan, where accessory packaging and quality-control testing are performed. We believe that outsourcing our manufacturing and a substantial portion of our logistics enables us to focus resources on our core competencies. Our proprietary SPUs, which are the key to the performance of our appliances, are built by contract manufacturers including Faraday Technology Corporation (“Faraday”), Kawasaki Microelectronics America, Inc. and Renesas Electronics Corporation (“Renesas”). These contract manufacturers use foundries operated by either United Microelectronics Corporation (“UMC”) or Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), or their own foundry, such as Renesas’ fab. The components included in our products are sourced from various suppliers by us or, more frequently, by our contract manufacturers.

KULICKE AND SOFFA INDUSTRIES, INC. KLICcovered filerbest State stale

named by KLIC as its customer: State stale since 2019-11-15 (the edge: stale since 2019-11-15); last named 2017-11-16, 1219 days before the date.

5 Super Power International Ltd # 5 Powertech Technology Inc. 5 Renesas Semiconductor

From KULICKE AND SOFFA INDUSTRIES, INC.'s 10-K filed 2017-11-16, accession 000005697817000149, period September 30, 2017, under Item 1. BUSINESS; characters 37629 to 37714; re-found.

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The following table reflects our top ten customers, based on net revenue, for each of the last three fiscal years:   Fiscal 2017   Fiscal 2016   Fiscal 2015 1 Haoseng Industrial Co., Ltd. *# 1 Haoseng Industrial Co., Ltd. *# 1 Amkor Technology Inc. 2 Siliconware Precision Industries Ltd. 2 Siliconware Precision Industries Ltd. 2 Haoseng Industrial Co., Ltd. # 3 Advanced Semiconductor Engineering 3 Advanced Semiconductor Engineering 3 Skyworks Solutions Incorporated 4 Amkor Technology Inc. 4 STATS Chippac Ltd 4 ST Microelectronics 5 Super Power International Ltd # 5 Powertech Technology Inc. 5 Renesas Semiconductor 6 Samsung 6 Amkor Technology Inc. 6 First Technology China, Ltd. # 7 First Technology China, Ltd. # 7 Orient Semiconductor Electronics, Ltd. 7 Orient Semiconductor Electronics, Ltd. 8 LG Innotek Co. Ltd. 8 First Technology China, Ltd. # 8 Texas Instruments, Inc. 9 Texas Instruments, Inc. 9 Samsung 9 Rohm Integrated Systems 10 Xinye Electronics. Co # 10 Tesla Motors 10 Xinye Electronics.

Magna International Inc. MGAcovered filerbest State current

named by MGA as its supplier: State current since 2019-03-29 (the edge: current since 2019-03-29); last named 2019-03-29, 721 days before the date.

We have announced a partnership with Renesas Electronics Corporation, a supplier of automotive semiconductor solutions

From Magna International Inc.'s 40-F filed 2019-03-29, accession 000119312519092912, period December 31, 2018; characters 126616 to 126736; re-found.

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This allows a demonstration and comparison of ten different powertrain configurations within a single vehicle architecture. Drivers can experience, for example, a mild hybrid for optimal fuel consumption, an electrified four-wheel-drive system for increased traction and safety, and an e-axle with integrated torque vectoring for the improved driving dynamics – all within the e2 prototype vehicle.     3D Surround View System   We have announced a partnership with Renesas Electronics Corporation, a supplier of automotive semiconductor solutions, to accelerate the mass adoption of a new, cost-efficient 3D surround view system designed for entry and mid-range vehicles. The 3D surround view system is a vehicle camera system that provides a 360-degree panoramic view to assist drivers when parking or performing low speed operations.

RAMBUS INC. RMBScovered filerbest State current

named by RMBS as its licensee: State current since 2021-02-26 (the edge: current since 2021-02-26); last named 2021-02-26, 21 days before the date.

Leading semiconductor and electronic system companies such as AMD, Broadcom, Cisco, Fujitsu, IBM, Marvell, Mediatek, Micron, Nanya, NVIDIA, Panasonic, Phison, Qualcomm, Renesas, Samsung, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital, Winbond, and Xilinx have licensed our patents for use in their own products.

From RAMBUS INC.'s 10-K filed 2021-02-26, accession 000091727321000005, period December 31, 2020, under Item 1. Business; characters 42192 to 42522; re-found.

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Our Architecture Licenses enable our customers to use specified portions of our portfolio of patented inventions in the customer’s own digital electronics products, systems or services. These licenses may also define the specific field of use where our customers may use or employ our inventions in their products. License agreements are structured with fixed or variable, or a hybrid of fixed and variable royalty payments over certain periods ranging up to ten years. Leading semiconductor and electronic system companies such as AMD, Broadcom, Cisco, Fujitsu, IBM, Marvell, Mediatek, Micron, Nanya, NVIDIA, Panasonic, Phison, Qualcomm, Renesas, Samsung, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital, Winbond, and Xilinx have licensed our patents for use in their own products. Competition The semiconductor industry is intensely competitive and is characterized by rapid technological change, short product life cycles, cyclical market patterns, price erosion, increasing foreign and domestic competition and market consolidation. Rambus competes with product offerings from various companies depending upon the particular Rambus product line.

SONY CORP SONYcovered filerbest State stale

named by SONY as its customer: State stale since 2018-06-19 (the edge: stale since 2018-06-19); last named 2016-06-17, 1736 days before the date.

SCK also entered into a supply arrangement with Renesas to manufacture and supply system LSIs for a certain period following the acquisition.

From SONY CORP's 20-F filed 2016-06-17, accession 000119312516624169, period March 31, 2016, under Item 19. Exhibits; characters 827206 to 827347; re-found.

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( 2 ) Sony Semiconductor acquisition s On March 31, 2014, Sony Semiconductor Corporation (“SCK”), a wholly-owned subsidiary of Sony, acquired from Renesas Electronics Corporation (“Renesas”) semiconductor fabrication equipment and certain related assets (“Renesas Transferred Assets”) for 7,510 million yen. SCK is utilizing the Renesas Transferred Assets to establish a new technology center and further strengthen its production capacity for CMOS image sensors. The purchase price was allocated and recorded primarily to machinery and equipment. SCK also entered into a supply arrangement with Renesas to manufacture and supply system LSIs for a certain period following the acquisition. In connection with this, SCK also acquired related inventories from Renesas.   F-80

named by SONY as its acquirer or acquisition target: State stale since 2018-06-19 (the edge: stale since 2018-06-19); last named 2016-06-17, 1736 days before the date.

acquired from Renesas Electronics Corporation (“Renesas”) semiconductor fabrication equipment and certain related assets (“Renesas Transferred Assets”) for 7,510 million yen.

From SONY CORP's 20-F filed 2016-06-17, accession 000119312516624169, period March 31, 2016, under Item 19. Exhibits; characters 826791 to 826965; re-found.

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( 2 ) Sony Semiconductor acquisition s On March 31, 2014, Sony Semiconductor Corporation (“SCK”), a wholly-owned subsidiary of Sony, acquired from Renesas Electronics Corporation (“Renesas”) semiconductor fabrication equipment and certain related assets (“Renesas Transferred Assets”) for 7,510 million yen. SCK is utilizing the Renesas Transferred Assets to establish a new technology center and further strengthen its production capacity for CMOS image sensors. The purchase price was allocated and recorded primarily to machinery and equipment. SCK also entered into a supply arrangement with Renesas to manufacture and supply system LSIs for a certain period following the acquisition.

Taiwan Semiconductor Manufacturing Company Limited TSMcovered filerbest State stale

named by TSM as its customer: State stale since 2016-04-11 (the edge: stale since 2016-04-11); last named 2014-04-14, 2531 days before the date.

We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor and system companies such as Advanced Micro Devices, Inc., Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, OmniVision Technologies and Qualcomm Incorporated, to integrated device manufacturers such as Renesas Electronics Corporation, STMicroelectronics and Texas Instruments Inc.

From TSM's 20-F filed 2014-04-14, accession 000119312514141496, period December 31, 2013, under ITEM 4. INFORMATION ON THE COMPANY; characters 73608 to 74041; re-found.

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We estimate that our revenue market segment share among total foundries worldwide was 49% in 2013. We also offer design, mask making, bumping, probing, and assembly and testing services. We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “— Manufacturing Capacity and Technology” and “— Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity. We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor and system companies such as Advanced Micro Devices, Inc., Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., NVIDIA Corporation, OmniVision Technologies and Qualcomm Incorporated, to integrated device manufacturers such as Renesas Electronics Corporation, STMicroelectronics and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 87%, and integrated device manufacturers accounted for approximately 13% of our net revenue in 2013.   13

Possible matches, never reached (1)

named by FTNT: Renesas Electronics America, Inc. (identity rule name_contains_locus_name).

Our proprietary SPUs, which are key to the performance of our appliances, are built by contract manufacturers including Toshiba America Electronic Components, Inc. (“Toshiba”) and Renesas Electronics America, Inc. (“Renesas”). These contract manufacturers use foundries in Taiwan and Japan operated by either Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) or by the contract manufacturer itself.

From FORTINET, INC.'s 10-K filed 2021-02-19, accession 000126203921000008, period 2020-12-31, under ITEM 1. Business; characters 63984 to 64392; re-found.

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Approximately 85% of our hardware is manufactured in Taiwan. We submit purchase orders to our contract manufacturers that describe the type and quantities of our products to be manufactured, the delivery date and other delivery terms. Once our products are manufactured, they are sent to either our warehouse in California or to our logistics partner in Taoyuan City, Taiwan, where accessory packaging and quality-control testing are performed. We believe that outsourcing our manufacturing and a substantial portion of our logistics enables us to focus resources on our core competencies. Our proprietary SPUs, which are key to the performance of our appliances, are built by contract manufacturers including Toshiba America Electronic Components, Inc. (“Toshiba”) and Renesas Electronics America, Inc. (“Renesas”). These contract manufacturers use foundries in Taiwan and Japan operated by either Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) or by the contract manufacturer itself. The components included in our products are sourced from various suppliers by us or, more frequently, by our contract manufacturers.

Second hop

Second-hop block hidden until the second-hop test (H2) passes.

Where the evidence stopped (stops-v1)

locus_not_covered_filer: 1

counterparty_unresolved: 1

edge_stale: 7

never_asked: 174

filer_not_read_before_as_of: 5

depth_limit: 1

Coverage

184 of 189 covered filers have a filing read before 2021-03-19. Coverage: the annual filings of 189 SEC filers read so far; where the evidence stopped is in the stop ledger.

The newest filing read before the date is dated 2021-03-17.