AMKR as the locus: Amkor Technology, Inc. as of 2026-09-30

Relationship mentions, completeness untested (reached through a disclosed relationship).

Second-hop block hidden (the second-hop test, H2, has not passed).

Nothing known on or after the date is used; the evidence is the covered filers' annual reports read so far.

The synthetic demo book (a development fixture, not a person's book), line by line

LineAs enteredLabelWhy
1NVDA 22reached through a disclosed relationship (relationship mentions, completeness untested)
2TSM 18reached through a disclosed relationship (relationship mentions, completeness untested)
3AVGO 14reached through a disclosed relationship (relationship mentions, completeness untested)
4AMD 12not reached by disclosed evidenceThe dated relationship table records no relationship with Amkor Technology, Inc. from AMD's read filings, the latest dated 2026-02-04 (238 days before the as-of date). Its filings were not searched for Amkor Technology, Inc.: never asked.
5QCOM 10reached through a disclosed relationship (relationship mentions, completeness untested)
6ASML 10not reached by disclosed evidenceThe dated relationship table records no relationship with Amkor Technology, Inc. from ASML's read filings, the latest dated 2026-02-25 (217 days before the as-of date). Its filings were not searched for Amkor Technology, Inc.: never asked.
7AMKR 8the event's locus itself
8MU 6reached through a disclosed relationship (relationship mentions, completeness untested)

Reached (38)

Samsung Electronics Company, Ltd. 005930.KSnot a covered filerbest State stale

named by the locus as its contract-manufacturer customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 2777 days before the date.

Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11620 to 11751; re-found.

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Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Global Unichip Corporation (GUC) 3443.TWnot a covered filerbest State stale

named by the locus as its customer: State stale since 2014-02-28 (the edge: stale since 2014-02-28); last named 2012-02-24, 5332 days before the date.

Global Unichip Corp. ST Microelectronics N.V. Infineon Technologies AG Texas Instruments Incorporated International Business Machines Corporation (“IBM”) Toshiba Corporation LSI Corporation Xilinx, Inc. Maxim Integrated Products, Inc.   Our top 25 customers accounted for 83.1% of our net sales in

From Amkor Technology, Inc.'s 10-K filed 2012-02-24, accession 000144530512000428, period December 31, 2011, under Item 1. Business; characters 43249 to 43546; re-found.

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The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc.  Nordic Semiconductor ASA Atmel Corporation ON Semiconductor Corporation Avago Technologies Limited Panasonic Corporation Broadcom Corporation Qualcomm Incorporated Cypress Semiconductor Corporation Renesas Electronics Corporation Entropic Communications, Inc.  Samsung Electronics Co., Ltd. Freescale Semiconductor, Inc. Sony Corporation Global Unichip Corp. ST Microelectronics N.V. Infineon Technologies AG Texas Instruments Incorporated International Business Machines Corporation (“IBM”) Toshiba Corporation LSI Corporation Xilinx, Inc. Maxim Integrated Products, Inc.   Our top 25 customers accounted for 83.1% of our net sales in 2011 , and our ten largest customers accounted for approximately 61.0% , 54.2% and 53.4% of our net sales for the years ended December 31, 2011 , 2010 and 2009 , respectively. Qualcomm Incorporated and Texas Instruments Incorporated each accounted for more than 10% of our consolidated net sales in 2011. No customer accounted for more than 10% of our consolidated net sales in 2010.

Toshiba 6502.Tnot a covered filerbest State stale

named by the locus as its joint venture partner: State stale since 2017-02-24 (the edge: stale since 2017-02-24); last named 2015-02-19, 4241 days before the date.

J-Devices was formed in 2009 as a result of a joint venture between Amkor, Toshiba

From Amkor Technology, Inc.'s 10-K filed 2015-02-19, accession 000104712715000010, period December 31, 2014, under Item 1. Business; characters 47469 to 47551; re-found.

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J-Devices' business covers a broad range of packaging and test services focused on the automotive, industrial and consumer end markets. The company's customers include some of the largest semiconductor companies in the world, such as Fujitsu Semiconductor Limited, Renesas Electronics Corporation and Toshiba Corporation. J-Devices was formed in 2009 as a result of a joint venture between Amkor, Toshiba and J-Devices' predecessor, Nakaya Microdevices Corporation ("NMD"). As part of this transaction, J-Devices acquired certain assets and business, including technology development, of Toshiba's semiconductor packaging business.

named by the locus as its customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 2777 days before the date.

Toshiba accounted for more than 10% of our net sales in 2018 .

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 54449 to 54511; re-found.

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In addition, semiconductor companies generally reduce their production during the holidays at the end of December which generally results in a decrease in packaging and test services during the first quarter. General economic conditions, changes in our supply chain or overall demand in any of our end-markets can impact our seasonality.   CUSTOMERS In 2018 , we had approximately 275 customers, including many of the largest semiconductor companies in the world. Our ten largest customers accounted for 62% of our net sales in 2018 . Toshiba accounted for more than 10% of our net sales in 2018 . MATERIALS AND EQUIPMENT Materials Our materials are used primarily for packaging activities. Our packaging operations depend upon obtaining adequate supplies of materials on a timely basis. The principal materials used in our packaging process are leadframes, laminate substrates, gold and copper wire, mold compound, epoxy, tubes and trays.

named by the locus as its acquirer or acquisition target: State stale since 2019-02-22 (the edge: stale since 2019-02-22); last named 2017-02-24, 3505 days before the date.

Also, in 2013, we acquired Toshiba’s power discrete semiconductor packaging and test factory in Malaysia.

From Amkor Technology, Inc.'s 10-K filed 2017-02-24, accession 000104712717000011, period December 31, 2016, under Item 7. Management’s Discussion and Analysis of Financial Condition and Results of Operations; characters 146599 to 146704; re-found.

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This includes an expanded emphasis on the automotive market where semiconductor content continues to grow and in the analog area for our mainstream wirebond technologies. From time to time, we identify attractive opportunities to grow our customer base and expand the markets we serve. For example, in 2009 we invested in J-Devices, a joint venture to provide semiconductor packaging and test services in Japan. We increased our investment in J-Devices to 60% in 2013 and to 100% in 2015 through the exercise of additional options. Also, in 2013, we acquired Toshiba’s power discrete semiconductor packaging and test factory in Malaysia. We believe that selective growth through joint ventures, acquisitions and other strategic investments can help diversify our revenue streams, improve our profits, broaden our portfolio of services and continue our technological leadership. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

named by the locus as its licensor: State stale since 2018-02-23 (the edge: stale since 2018-02-23); last named 2016-02-22, 3873 days before the date.

We were also granted a non-exclusive, royalty bearing license by Toshiba to certain intellectual property rights for providing packaging and test services for power discrete and certain other semiconductor products.

From Amkor Technology, Inc.'s 10-K filed 2016-02-22, accession 000104712716000049, period December 31, 2015, under Item 8. Financial Statements and Supplementary Data; characters 247648 to 247863; re-found.

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Bhd. On July 31, 2013, we completed the purchase of 100% of the shares of Toshiba Electronics Malaysia Sdn. Bhd., Toshiba’s power discrete semiconductor packaging and test operation in Malaysia, and subsequently changed the name of the entity to Amkor Technology Malaysia Sdn. Bhd. The total price for the shares was $61.2 million , based on the net asset value at closing. We paid $42.4 million in cash at closing and paid the remaining $18.8 million in March 2014. We were also granted a non-exclusive, royalty bearing license by Toshiba to certain intellectual property rights for providing packaging and test services for power discrete and certain other semiconductor products. The license has a royalty cap of ¥1.5 billion (approximately $12 million ). Under the purchase method of accounting, we allocated the purchase price to the assets acquired and liabilities assumed based on their estimated fair values on the date of acquisition. We did not record any goodwill as a result of the acquisition.

Renesas 6723.Tnot a covered filerbest State stale

named by the locus as its customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 2777 days before the date.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

Panasonic 6752.Tnot a covered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45649; re-found.

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SEASONALITY Our sales have generally been higher in the second half of the year than in the first half due to the effect of consumer buying patterns in the U.S., Europe and Asia. In addition, semiconductor companies generally reduce their production during the holidays at the end of December which results in a decrease in units for packaging and test services during the first quarter. 12 Table of Contents CUSTOMERS As of December 31, 2012 , we had approximately 200 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines …

Altera Corporation ?alteranot a covered filerbest State stale

named by the locus as its customer: State stale since 2017-02-24 (the edge: stale since 2017-02-24); last named 2015-02-19, 4241 days before the date.

Our fabless customers include: Altera Corporation; Avago Technologies; Broadcom Corporation and Qualcomm Incorporated.

From Amkor Technology, Inc.'s 10-K filed 2015-02-19, accession 000104712715000010, period December 31, 2014, under Item 1. Business; characters 11254 to 11372; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Micron Technology, Inc.; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Altera Corporation; Avago Technologies; Broadcom Corporation and Qualcomm Incorporated. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Atmel ?atmelnot a covered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45667; re-found.

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SEASONALITY Our sales have generally been higher in the second half of the year than in the first half due to the effect of consumer buying patterns in the U.S., Europe and Asia. In addition, semiconductor companies generally reduce their production during the holidays at the end of December which results in a decrease in units for packaging and test services during the first quarter. 12 Table of Contents CUSTOMERS As of December 31, 2012 , we had approximately 200 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) …

Broadcom Corporation ?broadcomnot a covered filerbest State stale

named by the locus as its customer: State stale since 2017-02-24 (the edge: stale since 2017-02-24); last named 2015-02-19, 4241 days before the date.

Our fabless customers include: Altera Corporation; Avago Technologies; Broadcom Corporation and Qualcomm Incorporated.

From Amkor Technology, Inc.'s 10-K filed 2015-02-19, accession 000104712715000010, period December 31, 2014, under Item 1. Business; characters 11254 to 11372; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Micron Technology, Inc.; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Altera Corporation; Avago Technologies; Broadcom Corporation and Qualcomm Incorporated. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Cypress Semiconductor Technology Ltd. ?cypress semiconductornot a covered filerbest State stale

named by the locus as its customer: State stale since 2014-02-28 (the edge: stale since 2014-02-28); last named 2012-02-24, 5332 days before the date.

The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc.  Nordic Semiconductor ASA Atmel Corporation ON Semiconductor Corporation Avago Technologies Limited Panasonic Corporation Broadcom Corporation Qualcomm Incorporated Cypress Semiconductor Corporation

From Amkor Technology, Inc.'s 10-K filed 2012-02-24, accession 000144530512000428, period December 31, 2011, under Item 1. Business; characters 42775 to 43108; re-found.

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Our business is tied to market conditions in the semiconductor industry which is highly cyclical. The semiconductor industry has experienced significant and sometimes prolonged cyclical downturns in the past. We cannot predict the timing, strength or duration of any economic slowdown or subsequent economic recovery. CUSTOMERS As of December 31, 2011 , we had approximately 225 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc.  Nordic Semiconductor ASA Atmel Corporation ON Semiconductor Corporation Avago Technologies Limited Panasonic Corporation Broadcom Corporation Qualcomm Incorporated Cypress Semiconductor Corporation Renesas Electronics Corporation Entropic Communications, Inc.  Samsung Electronics Co., Ltd. Freescale Semiconductor, Inc. Sony Corporation Global Unichip Corp. ST Microelectronics N.V. Infineon Technologies AG Texas Instruments Incorporated International Business Machines Corporation (“IBM”) Toshiba Corporation LSI Corporation Xilinx, Inc. Maxim Integrated Products, Inc.   Our top 25 customers …

Freescale Semiconductor Inc. ?freescale semiconductornot a covered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45826; re-found.

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SEASONALITY Our sales have generally been higher in the second half of the year than in the first half due to the effect of consumer buying patterns in the U.S., Europe and Asia. In addition, semiconductor companies generally reduce their production during the holidays at the end of December which results in a decrease in units for packaging and test services during the first quarter. 12 Table of Contents CUSTOMERS As of December 31, 2012 , we had approximately 200 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc.   Our top 25 customers …

J-Devices Corporation ?j devicesnot a covered filerbest State stale

named by the locus as its acquirer or acquisition target: State stale since 2022-02-18 (the edge: stale since 2022-02-18); last named 2020-02-19, 2415 days before the date.

In 2015, we completed the acquisition of 100% of J-Devices, our outsourced semiconductor assembly and test (“OSAT”) joint venture in Japan.

From Amkor Technology, Inc.'s 10-K filed 2020-02-19, accession 000104712720000006, period December 31, 2019, under Item 1. Business; characters 63873 to 64012; re-found.

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Selectively Grow Our Scale and Scope through Strategic Investments From time to time we see attractive opportunities to grow our customer base and expand markets through strategic investments. For example, in 2017 we completed the acquisition of Nanium, S.A. (“Nanium”), a provider of wafer-level fan-out semiconductor packaging solutions. We believe that this acquisition has strengthened our position in the market for wafer-level packaging. In 2015, we completed the acquisition of 100% of J-Devices, our outsourced semiconductor assembly and test (“OSAT”) joint venture in Japan. We believe that selective growth through joint ventures, acquisitions and other strategic investments can help diversify our revenue streams, improve our profits and maintain our technological leadership. Competitive Strengths The outsourced semiconductor packaging and test market is very competitive.

named by the locus as its investee: State stale since 2017-02-24 (the edge: stale since 2017-02-24); last named 2015-02-19, 4241 days before the date.

J-Devices, our 65.7% owned equity-method joint venture in Japan

From Amkor Technology, Inc.'s 10-K filed 2015-02-19, accession 000104712715000010, period December 31, 2014, under Item 2. Properties; characters 131277 to 131340; re-found.

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(2) As a result of foreign ownership restrictions in the Philippines, the land is leased. A portion of the land we lease is owned by realty companies in which we own a 40% interest. We also lease 648,000 square feet of building space. (3) Land is leased. During 2013, we purchased land for a factory and research and development center in Korea and in September 2014, we started construction. Construction work is expected to continue into 2016. J-Devices, our 65.7% owned equity-method joint venture in Japan, operates 13 manufacturing facilities with a total of 3.6 million square feet of space. This includes 0.9 million square feet of leased building space. Our principal executive office and operational headquarters is located in Tempe, Arizona.

LSI Technology Corporation ?lsinot a covered filerbest State stale

named by the locus as its customer: State stale since 2016-02-22 (the edge: stale since 2016-02-22); last named 2014-02-28, 4597 days before the date.

Our fabless customers include: Altera Corporation; Broadcom Corporation; LSI Corporation and Qualcomm Incorporated.

From Amkor Technology, Inc.'s 10-K filed 2014-02-28, accession 000104712714000006, period December 31, 2013, under Item 1. Business; characters 10995 to 11110; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Micron Technology, Inc.; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Altera Corporation; Broadcom Corporation; LSI Corporation and Qualcomm Incorporated. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Maxim Integrated Products Inc. ?maxim integrated productsnot a covered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc.   Our top 25 customers accounted for 83.9% of our net sales in

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 46132 to 46263; re-found.

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… 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc.   Our top 25 customers accounted for 83.9% of our net sales in 2012 , and our ten largest customers accounted for approximately 62.2% , 61.0% and 54.2% and of our net sales for the years ended December 31, 2012 , 2011 and 2010 , respectively. Qualcomm Incorporated accounted for more than 10% of our net sales in 2012. Qualcomm Incorporated and Texas Instruments Incorporated each accounted for more than 10% of our consolidated net sales in 2011.

Nanium ?naniumnot a covered filerbest State current

named by the locus as its acquirer or acquisition target: State current since 2026-02-20 (the edge: current since 2026-02-20); last named 2026-02-20, 222 days before the date.

The terms of the purchase agreement from our Nanium acquisition in May 2017 required us to remit any insolvency payments received to the selling shareholders

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 8. Financial Statements and Supplementary Data; characters 359030 to 359187; re-found.

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17. Commitments and Contingencies We generally warrant that our services will be performed in a professional and workmanlike manner and in compliance with our customers’ specifications. We accrue costs for known warranty issues. Historically, our warranty costs have been immaterial. 92 Table of Contents AMKOR TECHNOLOGY, INC. Notes to Consolidated Financial Statements — (Continued) Insolvency payments associated with Nanium acquisition In June 2025, we received $ 72.8 million for the Nanium Insolvency Receipt. The terms of the purchase agreement from our Nanium acquisition in May 2017 required us to remit any insolvency payments received to the selling shareholders, less certain costs, including tax costs, incurred by us. In 2025, we remitted $ 40.4 million to the selling shareholders. Such amounts were recorded on a net basis within selling, general and administrative expenses in our Consolidated Statements of Income and as operating cash flows within our Condensed Consolidated Statements of Cash Flows.

Nordic Semiconductor ASA ?nordic semiconductor asanot a covered filerbest State stale

named by the locus as its customer: State stale since 2014-02-28 (the edge: stale since 2014-02-28); last named 2012-02-24, 5332 days before the date.

The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc.  Nordic Semiconductor ASA

From Amkor Technology, Inc.'s 10-K filed 2012-02-24, accession 000144530512000428, period December 31, 2011, under Item 1. Business; characters 42775 to 42935; re-found.

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Our business is tied to market conditions in the semiconductor industry which is highly cyclical. The semiconductor industry has experienced significant and sometimes prolonged cyclical downturns in the past. We cannot predict the timing, strength or duration of any economic slowdown or subsequent economic recovery. CUSTOMERS As of December 31, 2011 , we had approximately 225 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2011 based on net sales: Altera Corporation Micron Technology, Inc. Analog Devices, Inc.  Nordic Semiconductor ASA Atmel Corporation ON Semiconductor Corporation Avago Technologies Limited Panasonic Corporation Broadcom Corporation Qualcomm Incorporated Cypress Semiconductor Corporation Renesas Electronics Corporation Entropic Communications, Inc.  Samsung Electronics Co., Ltd. Freescale Semiconductor, Inc. Sony Corporation Global Unichip Corp. ST Microelectronics N.V. Infineon Technologies AG Texas …

RF Micro Devices, Inc. ?rf micro devicesnot a covered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45796; re-found.

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SEASONALITY Our sales have generally been higher in the second half of the year than in the first half due to the effect of consumer buying patterns in the U.S., Europe and Asia. In addition, semiconductor companies generally reduce their production during the holidays at the end of December which results in a decrease in units for packaging and test services during the first quarter. 12 Table of Contents CUSTOMERS As of December 31, 2012 , we had approximately 200 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, …

Socionext ?socionextnot a covered filerbest State stale

named by the locus as its customer: State stale since 2020-02-19 (the edge: stale since 2020-02-19); last named 2018-02-23, 3141 days before the date.

Our fabless customers include: Broadcom Limited, Qualcomm Incorporated and Socionext Inc.

From Amkor Technology, Inc.'s 10-K filed 2018-02-23, accession 000104712718000009, period December 31, 2017, under Item 1. Business; characters 11463 to 11552; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited, Qualcomm Incorporated and Socionext Inc. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Toshiba Memory Holdings Corporation ?toshiba memorynot a covered filerbest State stale

named by the locus as its customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 2777 days before the date.

Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11517 to 11619; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Xilinx, Inc. ?xilinxnot a covered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

Xilinx, Inc. Micron Technology, Inc.   Our top 25 customers accounted for 83.9% of our net sales in

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 46164 to 46263; re-found.

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… Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc.   Our top 25 customers accounted for 83.9% of our net sales in 2012 , and our ten largest customers accounted for approximately 62.2% , 61.0% and 54.2% and of our net sales for the years ended December 31, 2012 , 2011 and 2010 , respectively. Qualcomm Incorporated accounted for more than 10% of our net sales in 2012. Qualcomm Incorporated and Texas Instruments Incorporated each accounted for more than 10% of our consolidated net sales in 2011.

Apple Inc. AAPLcovered filerbest State current

named by the locus as its customer: State current since 2026-02-20 (the edge: current since 2026-02-20); last named 2026-02-20, 222 days before the date.

Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 1. Business; characters 92238 to 92372; re-found.

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In addition, semiconductor companies generally reduce their production during the holidays at the end of December, which generally results in a decrease in packaging and test services during the first quarter. General economic conditions, changes in our product mix or overall demand in any of our end markets can impact our seasonality. CUSTOMERS Our customers include most of the world’s largest semiconductor companies. Our ten largest customers accounted for 72% of our net sales in 2025. Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025. MATERIALS AND EQUIPMENT Materials Our materials are used primarily for packaging activities. Our packaging operations depend upon obtaining adequate supplies of materials on a timely basis. The principal materials used in our packaging process are laminate substrates, ICs, capacitors, leadframes and bonding wires. The silicon wafer is generally consigned from our customer.

Tessera ADEAcovered filerbest State stale

named by the locus as its licensor: State stale since 2019-02-22 (the edge: stale since 2019-02-22); last named 2017-02-24, 3505 days before the date.

In January 2015, we settled our patent license litigation with Tessera.

From Amkor Technology, Inc.'s 10-K filed 2017-02-24, accession 000104712717000011, period December 31, 2016, under Item 7. Management’s Discussion and Analysis of Financial Condition and Results of Operations; characters 170837 to 170908; re-found.

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We have never paid a dividend to our stockholders, and we do not have any present plans for doing so. From time to time, Amkor Technology, Inc. also guarantees certain debt of our subsidiaries. Our subsidiary in Korea maintains an unfunded severance plan that covers certain employees that were employed prior to August 1, 2015. As of December 31, 2016 , the severance liability was $136.2 million . For service periods subsequent to August 1, 2015, employees participate in either a defined benefit pension plan or a defined contribution pension plan. In January 2015, we settled our patent license litigation with Tessera. Under the terms of the settlement, Amkor agreed to pay Tessera a total of $155.0 million in 16 equal quarterly recurring payments commencing in the first quarter of 2015 and continuing through the fourth quarter of 2018. As of December 31, 2016 , we owe $77.5 million to Tessera. In April 2016, our Kumamoto factory was damaged by the earthquakes in Japan.

named by the locus as its licensee: State stale since 2017-02-24 (the edge: stale since 2017-02-24); last named 2015-02-19, 4241 days before the date.

In January 2015, the parties entered into a settlement agreement to end all pending proceedings related to the dispute.

From Amkor Technology, Inc.'s 10-K filed 2015-02-19, accession 000104712715000010, period December 31, 2014, under Item 8. Financial Statements and Supplementary Data; characters 283611 to 283730; re-found.

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In the second quarter of 2014, the arbitration panel awarded Tessera $113 million plus interest for these past royalties due under the License Agreement. In October 2014, the Superior Court for San Francisco County formally confirmed the arbitration panel's award and entered judgment against Amkor for $128 million plus post-judgment interest at 10% per annum. In November 2014, the California First District Court of Appeal affirmed the Superior Court’s ruling. In January 2015, the parties entered into a settlement agreement to end all pending proceedings related to the dispute. Under the terms of the settlement, Amkor agreed to pay Tessera a total of $155.0 million in 16 equal quarterly recurring payments commencing in the first quarter of 2015, and continuing through the fourth quarter of 2018, and the parties agreed to a mutual release and dismissal of all claims relating to their pending litigation and arbitration proceedings, including the previously awarded …

Analog Devices, Inc. ADIcovered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

Our customers include, among others: Altera Corporation; Analog Devices, Inc.; Broadcom Corporation; Intel Corporation; LSI Corporation; Qualcomm Incorporated; Sony Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 9340 to 9598; re-found.

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The test services we offer include probe testing and final testing. Our packaging services are designed to meet application and chip specific requirements including the type of interconnect technology employed; size; thickness and electrical, mechanical and thermal performance. We are able to provide turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. Our customers include, among others: Altera Corporation; Analog Devices, Inc.; Broadcom Corporation; Intel Corporation; LSI Corporation; Qualcomm Incorporated; Sony Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. The outsourced semiconductor packaging and test market is very competitive. We also compete with the internal semiconductor packaging and test capabilities of many of our customers. 2 Table of Contents AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

Broadcom AVGOcovered filerbest State current

named by the locus as its customer: State stale since 2021-02-19 (the edge: current since 2025-12-18); last named 2019-02-22, 2777 days before the date.

Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11517 to 11619; re-found.

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Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

named by AVGO as its assembly and test provider: State current since 2025-12-18 (the edge: current since 2025-12-18); last named 2025-12-18, 286 days before the date.

Sourcing in the filing's own words: few.

We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.

From AVGO's 10-K filed 2025-12-18, accession 000173016825000121, period November 2, 2025, under ITEM 1. BUSINESS; characters 74539 to 74779; re-found.

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Manufacturing We focus on maintaining an efficient global supply chain and a variable, low-cost operating model. Accordingly, we outsource a majority of our manufacturing operations, utilizing third-party foundry and assembly and test capabilities, as well as some of our corporate infrastructure functions. The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”). We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd. We use our internal fabrication facilities for products utilizing our innovative and proprietary processes, such as our FBAR filters for wireless communications and our vertical-cavity surface emitting laser and side emitting lasers based on gallium arsenide (“GaAs”) and indium phosphide (“InP”) lasers for fiber optic communications, while outsourcing commodity processes such as standard CMOS.

CIRRUS LOGIC, INC. CRUScovered filerbest State current

named by CRUS as its assembly and test provider: State current since 2026-05-21 (the edge: current since 2026-05-21); last named 2026-05-21, 132 days before the date.

The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.

From CIRRUS LOGIC, INC.'s 10-K filed 2026-05-21, accession 000077240626000018, period March 28, 2026, under ITEM 1. Business; characters 37310 to 37525; re-found.

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In fiscal year 2022, the Company entered into a Capacity Reservation and Wafer Supply Commitment Agreement with GlobalFoundries to reserve capacity and set wafer pricing for products purchased pursuant to the agreement through calendar year 2026. On February 18, 2025, the Capacity Reservation Agreement was amended (the "Amendment") to define the quarterly spread of the remaining wafer quantities under the agreement. See Note 13 - Commitments and Contingencies of the Notes to the Consolidated Financial Statements for additional details. The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd. Our outsourced manufacturing strategy allows us to concentrate on our design strengths and minimize fixed costs and capital expenditures while giving us access to advanced manufacturing facilities. It also provides the flexibility to source multiple leading-edge technologies through strategic relationships.

Entropic Communications ENTRnot a covered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45772; re-found.

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SEASONALITY Our sales have generally been higher in the second half of the year than in the first half due to the effect of consumer buying patterns in the U.S., Europe and Asia. In addition, semiconductor companies generally reduce their production during the holidays at the end of December which results in a decrease in units for packaging and test services during the first quarter. 12 Table of Contents CUSTOMERS As of December 31, 2012 , we had approximately 200 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, …

GLOBALFOUNDRIES GFScovered filerbest State stale

named by the locus as its contract-manufacturer customer: State stale since 2020-02-19 (the edge: stale since 2020-02-19); last named 2018-02-23, 3141 days before the date.

Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited.

From Amkor Technology, Inc.'s 10-K filed 2018-02-23, accession 000104712718000009, period December 31, 2017, under Item 1. Business; characters 11553 to 11669; re-found.

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Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited, Qualcomm Incorporated and Socionext Inc. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”). You may read and copy any document we file at the SEC’s Public Reference Room, 100 F Street, NE, Washington, D.C. 20549. Please call the SEC at 1-800-SEC-0330 for information on the Public Reference Room.

INTERNATIONAL BUSINESS MACHINES CORPORATION IBMcovered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc.   Our top 25 customers accounted for 83.9% of our net sales in

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 46013 to 46263; re-found.

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The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company Limited International Business Machines Corporation (“IBM”) Texas Instruments Incorporated LSI Corporation Toshiba Corporation Maxim Integrated Products, Inc. Xilinx, Inc. Micron Technology, Inc.   Our top 25 customers accounted for 83.9% of our net sales in 2012 , and our ten largest customers accounted for approximately 62.2% , 61.0% and 54.2% and of our net sales for the years ended December 31, 2012 , 2011 and 2010 , respectively. Qualcomm Incorporated accounted for more than 10% of our net sales in 2012. Qualcomm Incorporated and Texas Instruments Incorporated each accounted for more than 10% of our consolidated net sales in 2011.

Infineon Technologies AG IFX.DEnot a covered filerbest State stale

named by the locus as its customer: State stale since 2018-02-23 (the edge: stale since 2018-02-23); last named 2016-02-22, 3873 days before the date.

Our IDM customers include: Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2016-02-22, accession 000104712716000049, period December 31, 2015, under Item 1. Business; characters 11194 to 11404; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Avago Technologies; Broadcom Corporation and Qualcomm Incorporated. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. J-Devices Corporation On December 30, 2015 , we increased our ownership in J-Devices Corporation from 65.7% to 100% through the exercise of existing options.

INTEL CORPORATION INTCcovered filerbest State stale

named by the locus as its customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 2777 days before the date.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

KULICKE AND SOFFA INDUSTRIES, INC. KLICcovered filerbest State stale

named by KLIC as its customer: State stale since 2021-11-18 (the edge: stale since 2021-11-18); last named 2019-11-15, 2511 days before the date.

4 ASE Industrial Holding (3) 4 Micron Technology Incorporated 4 Amkor Technology Inc.

From KULICKE AND SOFFA INDUSTRIES, INC.'s 10-K filed 2019-11-15, accession 000005697819000130, period September 28, 2019, under Item 1. BUSINESS; characters 45996 to 46081; re-found.

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There was no customer with sales representing more than 10% of net revenue in fiscal 2019. The following table reflects our top ten customers, based on net revenue, for each of the last three fiscal years:   Fiscal 2019   Fiscal 2018   Fiscal 2017 1 Super Power International Ltd (2) 1 Haoseng Industrial Co., Ltd. (1)(2) 1 Haoseng Industrial Co., Ltd. (1)(2) 2 Micron Technology Incorporated 2 ASE Industrial Holding (3) 2 Siliconware Precision Industries Ltd. (3) 3 First Technology China, Ltd. (2) 3 Super Power International Ltd (2) 3 Advanced Semiconductor Engineering (3) 4 ASE Industrial Holding (3) 4 Micron Technology Incorporated 4 Amkor Technology Inc. 5 Xinye Electronics. Co (2) 5 First Technology China, Ltd. (2) 5 Super Power International Ltd (2) 6 Forehope Electronic Co., Ltd 6 Tesla Motors 6 Samsung 7 Infineon Technologies 7 Samsung 7 First Technology China, Ltd. (2) 8 ST Microelectronics 8 Texas Instruments, Inc. 8 LG Innotek Co. Ltd. 9 On Semiconductor 9 Xinye Electronics.

MICRON TECHNOLOGY INC MUcovered filerbest State stale

named by the locus as its customer: State stale since 2018-02-23 (the edge: stale since 2018-02-23); last named 2016-02-22, 3873 days before the date.

Our IDM customers include: Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2016-02-22, accession 000104712716000049, period December 31, 2015, under Item 1. Business; characters 11194 to 11404; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Avago Technologies; Broadcom Corporation and Qualcomm Incorporated. Our contract foundry customers include: GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. J-Devices Corporation On December 30, 2015 , we increased our ownership in J-Devices Corporation from 65.7% to 100% through the exercise of existing options.

NVIDIA CORP ORATION NVDAcovered filerbest State stale

named by NVDA as its assembly and test provider: State stale since 2025-02-26 (the edge: stale since 2025-02-26); last named 2023-02-24, 1314 days before the date.

Sourcing in the filing's own words: few.

We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products

From NVIDIA CORP ORATION's 10-K filed 2023-02-24, accession 000104581023000017, period January 29, 2023, under ITEM 1. BUSINESS; characters 59750 to 60115; re-found.

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We have placed non-cancellable inventory orders for certain product components in advance of our historical lead times, paid premiums and provided deposits to secure future supply and capacity and may need to continue to do so in the future. We have expanded our supplier relationships to build redundancy and resilience in our operations. We utilize suppliers, such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Electronics Co. Ltd, to produce our semiconductor wafers. We then utilize independent subcontractors and contract manufacturers, such as Amkor Technology, BYD Auto Co. Ltd., or BYD Auto, Hon Hai Precision Industry Co., or Hon Hai, King Yuan Electronics Co., Ltd., Omni Logistics, LLC, Siliconware Precision Industries Company Ltd., and Wistron Corporation to perform assembly, testing, and packaging of most of our products and platforms. We use contract manufacturers such as Flex Ltd., Jabil Inc., and Universal Scientific Industrial Co., Ltd., to manufacture our standard and custom adapter card products and switch systems, and Fabrinet to manufacture our networking cables.

ON SEMICONDUCTOR CORPORATION ONcovered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 45487 to 45605; re-found.

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SEASONALITY Our sales have generally been higher in the second half of the year than in the first half due to the effect of consumer buying patterns in the U.S., Europe and Asia. In addition, semiconductor companies generally reduce their production during the holidays at the end of December which results in a decrease in units for packaging and test services during the first quarter. 12 Table of Contents CUSTOMERS As of December 31, 2012 , we had approximately 200 customers, including many of the largest semiconductor companies in the world. The table below lists our top 25 customers in 2012 based on net sales: Altera Corporation ON Semiconductor Corporation Analog Devices, Inc.  Panasonic Corporation Atmel Corporation Qualcomm Incorporated Broadcom Corporation Renesas Electronics Corporation Entropic Communications, Inc.  RF Micro Devices, Inc. Freescale Semiconductor, Ltd. Samsung Electronics Co., Ltd. GLOBALFOUNDRIES Inc. Sony Corporation Infineon Technologies AG STMicroelectronics N.V. Intel Corporation Taiwan Semiconductor Manufacturing Company …

named by ON as its assembly and test provider: State stale since 2020-02-19 (the edge: stale since 2015-02-19); last named 2018-02-21, 3143 days before the date.

These contract manufacturers, including Amkor, ASE, Kingpak, SMIC, TPSCo and TSMC, collectively accounted for approximately 36%, 36% and 39% of our manufacturing costs in 2017, 2016 and 2015, respectively.

From ON SEMICONDUCTOR CORPORATION's 10-K filed 2018-02-21, accession 000119312518051397, period December 31, 2017, under Item 1. Business; characters 40372 to 40577; re-found.

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forecast product needs and commit to purchase services consistent with these forecasts. In some cases, longer-term commitments are required in the early stages of the relationship. These contract manufacturers, including Amkor, ASE, Kingpak, SMIC, TPSCo and TSMC, collectively accounted for approximately 36%, 36% and 39% of our manufacturing costs in 2017, 2016 and 2015, respectively. For information regarding risks associated with our foreign operations, see “Risk Factors - Trends, Risks and Uncertainties Related to Our Business” included elsewhere in this Form 10-K.

named by ON as its customer: State stale since 2014-02-21 (the edge: stale since 2014-02-21); last named 2012-02-22, 5334 days before the date.

Honeywell Inc.   Amkor Technology Inc   Delta Elec Int’l Ltd

From ON SEMICONDUCTOR CORPORATION's 10-K filed 2012-02-22, accession 000119312512072371, period December 31, 2011, under Item 1. Business; characters 41586 to 41654; re-found.

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… Emerson Electric Co   Echostar   Delphi   Flir Systems   Huawei Tech Co., Ltd.   Ericson   ITT Corporation   St. Jude Medical   Schneider Electric   Xerox Corp   CAS-Former Motorola Automotive   Emerson Electric Co   Motorola   Nokia Siemens Networks   Stellar Microelectronics   Medtronic   Dell Computer   Scientific Atlanta   Visteon   Siemens Industrial   ZTE Hong Kong Ltd   Nortel Networks   Sofradir   Cardic Pacemakers Inc   LG Electronics   Sony Corp   Bosch GMBH   Honeywell Inc.   Amkor Technology Inc   Delta Elec Int’l Ltd   Honeywell Inc   ELA Medical   Samsung Elec Co.   Philips   Valeo   Tyco International   Kyocera   Foxconn   L-3 Communications   Intricon Corp   Surface Mount Technology   Whirlpool Corp   TRW Inc   Belimo Automation AG   V.Tech   Adtran Inc   British Aerospace   Philips   Lite-On Electronics, Inc AP …

QUALCOMM Incorporated QCOMcovered filerbest State current

named by the locus as its customer: State current since 2026-02-20 (the edge: current since 2026-02-20); last named 2026-02-20, 222 days before the date.

Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.

From Amkor Technology, Inc.'s 10-K filed 2026-02-20, accession 000104712726000014, period December 31, 2025, under Item 1. Business; characters 92238 to 92372; re-found.

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In addition, semiconductor companies generally reduce their production during the holidays at the end of December, which generally results in a decrease in packaging and test services during the first quarter. General economic conditions, changes in our product mix or overall demand in any of our end markets can impact our seasonality. CUSTOMERS Our customers include most of the world’s largest semiconductor companies. Our ten largest customers accounted for 72% of our net sales in 2025. Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025. MATERIALS AND EQUIPMENT Materials Our materials are used primarily for packaging activities. Our packaging operations depend upon obtaining adequate supplies of materials on a timely basis. The principal materials used in our packaging process are laminate substrates, ICs, capacitors, leadframes and bonding wires. The silicon wafer is generally consigned from our customer.

named by QCOM as its assembly and test provider: State current since 2025-11-05 (the edge: current since 2026-02-20); last named 2025-11-05, 329 days before the date.

Sourcing in the filing's own words: few.

Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.

From QUALCOMM Incorporated's 10-K filed 2025-11-05, accession 000080432825000085, period September 28, 2025, under Item 1. Business; characters 58204 to 58366; re-found.

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Under the two-stage manufacturing model, we purchase die in singular or wafer form from semiconductor manufacturing foundries and contract with separate third parties for manufacturing services such as wafer bump, probe, assembly and the majority of our final test requirements. The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries. Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC. The majority of our foundry and semiconductor assembly and test suppliers are located in the Asia-Pacific region. QCT primarily uses internal fabrication facilities to manufacture certain RFFE modules and RF filter products, and our manufacturing operations consist of front-end and back-end processes.

Sony Group Corp SONYcovered filerbest State stale

named by the locus as its customer: State stale since 2015-02-19 (the edge: stale since 2015-02-19); last named 2013-03-08, 4954 days before the date.

Our customers include, among others: Altera Corporation; Analog Devices, Inc.; Broadcom Corporation; Intel Corporation; LSI Corporation; Qualcomm Incorporated; Sony Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2013-03-08, accession 000104712713000007, period December 31, 2012, under Item 1. Business; characters 9340 to 9598; re-found.

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The test services we offer include probe testing and final testing. Our packaging services are designed to meet application and chip specific requirements including the type of interconnect technology employed; size; thickness and electrical, mechanical and thermal performance. We are able to provide turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. Our customers include, among others: Altera Corporation; Analog Devices, Inc.; Broadcom Corporation; Intel Corporation; LSI Corporation; Qualcomm Incorporated; Sony Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. The outsourced semiconductor packaging and test market is very competitive. We also compete with the internal semiconductor packaging and test capabilities of many of our customers. 2 Table of Contents AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

STMicroelectronics N.V. STMcovered filerbest State stale

named by the locus as its customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 2777 days before the date.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

Taiwan Semiconductor Manufacturing Company TSMcovered filerbest State stale

named by the locus as its contract-manufacturer customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 2777 days before the date.

Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11620 to 11751; re-found.

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Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited. AVAILABLE INFORMATION Amkor files annual, quarterly and current reports, proxy statements and other information with the U.S. Securities and Exchange Commission (the “SEC”).

TEXAS INSTRUMENTS INC TXNcovered filerbest State stale

named by the locus as its customer: State stale since 2021-02-19 (the edge: stale since 2021-02-19); last named 2019-02-22, 2777 days before the date.

Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation.

From Amkor Technology, Inc.'s 10-K filed 2019-02-22, accession 000104712719000007, period December 31, 2018, under Item 1. Business; characters 11357 to 11516; re-found.

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Fabless semiconductor companies do not have factories and focus exclusively on the semiconductor design process and outsource virtually every step of the manufacturing process. Fabless semiconductor companies utilize contract foundries to manufacture their semiconductors in wafer form, and companies such as Amkor for their packaging and test needs. Some companies will engage a contract foundry to manage the complete semiconductor manufacturing process, and in turn, the contract foundry will outsource some of its packaging and test needs. Our IDM customers include: Intel Corporation; Renesas Electronics Corporation; STMicroelectronics N.V.; Texas Instruments Incorporated and Toshiba Corporation. Our fabless customers include: Broadcom Limited; Qualcomm Incorporated and Toshiba Memory Corporation. Our contract foundry customers include: Samsung Electronics Company Limited and Taiwan Semiconductor Manufacturing Company Limited.

Second hop

Second-hop block hidden until the second-hop test (H2) passes.

Where the evidence stopped (stops-v1)

counterparty_not_read: 21

edge_stale: 41

never_asked: 171

depth_limit: 1

Coverage

189 of 189 covered filers have a filing read before 2026-09-30. Coverage: the annual filings of 189 SEC filers read so far; where the evidence stopped is in the stop ledger.

The newest filing read before the date is dated 2026-09-10.